Patents by Inventor Wen-Chung Lee
Wen-Chung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12096174Abstract: A headphone includes a headgear and two earmuffs connected to opposite ends of the headgear, and each of the earmuffs includes an adjustment assembly. The adjustment assembly includes a base, two elastic members, two protrusions, and two sliding blocks. The base has two opposite accommodating parts and two guiding grooves. The elastic members are disposed in the accommodating parts, respectively, and the elastic members extend along a first axial direction. The protrusions are slidably connected to the guiding grooves, respectively, and protrude into the accommodating parts. The sliding blocks are disposed in the accommodating parts, respectively, and each of the sliding blocks is respectively connected between the corresponding protrusion and the corresponding elastic member.Type: GrantFiled: October 19, 2022Date of Patent: September 17, 2024Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Wen-Chung Lee, Yung-Lung Tsai, Hung-Wen Tsao
-
Publication number: 20240145613Abstract: The present disclosure provides a silicon carbide (SiC) opto-thyristor and a method for manufacturing the same. The SiC opto-thyristor includes a SiC substrate, a SiC light emitter and a SiC light-sensitive thyristor. In the method, a SiC epitaxy is mainly formed on the SiC substrate with the doped P-type and N-type semiconductor materials to define the regions for forming the SiC light emitter and the basic structures of the SiC light-sensitive thyristor. A passivation layer is deposited. Conducting channels for the SiC light emitter and the SiC light-sensitive thyristor are formed by an etching process. After patterning a metal conductor layer, a structure of electrical contacts of the SiC light emitter and the SiC light-sensitive thyristor is formed. Then, terminals of an input voltage and an output voltage of the silicon carbide opto-thyristor are formed after a wire bonding process upon the electrical contacts. Finally, a packaging process is performed.Type: ApplicationFiled: October 10, 2023Publication date: May 2, 2024Inventors: Di-Bao WANG, Wen-Chung LEE
-
Publication number: 20240089645Abstract: A headphone includes a headgear and two earmuffs connected to opposite ends of the headgear, and each of the earmuffs includes an adjustment assembly. The adjustment assembly includes a base, two elastic members, two protrusions, and two sliding blocks. The base has two opposite accommodating parts and two guiding grooves. The elastic members are disposed in the accommodating parts, respectively, and the elastic members extend along a first axial direction. The protrusions are slidably connected to the guiding grooves, respectively, and protrude into the accommodating parts. The sliding blocks are disposed in the accommodating parts, respectively, and each of the sliding blocks is respectively connected between the corresponding protrusion and the corresponding elastic member.Type: ApplicationFiled: October 19, 2022Publication date: March 14, 2024Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Wen-Chung Lee, Yung-Lung Tsai, Hung-Wen Tsao
-
Publication number: 20220211205Abstract: A frozen food heating apparatus is disclosed, which includes a boiler body, a water tank in communication with the boiler body, and a container for containing food, a spray nozzle in communication with both the boiler body and the water tank being provided above the container, where a first solenoid valve or an electric ball valve is provided on a connection pipeline between the water tank and the spray nozzle, the spray nozzle is in communication with an upper end of the boiler body and a second solenoid valve is provided on a connection pipeline, and the water tank is in communication with the lower end of the boiler body and a third solenoid valve is provided on a connection pipeline.Type: ApplicationFiled: April 24, 2020Publication date: July 7, 2022Applicant: Novel Food (Suzhou) Co., Ltd.Inventor: Wen-Chung LEE
-
Patent number: 11258220Abstract: A positioning structure includes a first positioning component and a second positioning component. The first positioning component includes a first arched positioning portion having a first arched positioning surface. The second positioning component is disposed at one side of the first positioning component, wherein the second positioning component includes a second arched positioning portion having a second arched positioning surface. The second positioning component is configured to rotate relative to the first positioning component, such that the second arched positioning portion is moved to one side of the first arched positioning portion. The second arched positioning surface abuts against the first arched positioning surface, such that a degree of freedom of movement of the second positioning component in a direction is restricted by the first positioning component. An energy storage device is also provided.Type: GrantFiled: November 7, 2018Date of Patent: February 22, 2022Assignee: Merry Electronics (Shenzhen) Co., Ltd.Inventors: Wen-Chung Lee, Hsiang-Sen Chang, Feng-Ping Chang
-
Publication number: 20190181601Abstract: A positioning structure includes a first positioning component and a second positioning component. The first positioning component includes a first arched positioning portion having a first arched positioning surface. The second positioning component is disposed at one side of the first positioning component, wherein the second positioning component includes a second arched positioning portion having a second arched positioning surface. The second positioning component is configured to rotate relative to the first positioning component, such that the second arched positioning portion is moved to one side of the first arched positioning portion. The second arched positioning surface abuts against the first arched positioning surface, such that a degree of freedom of movement of the second positioning component in a direction is restricted by the first positioning component. An energy storage device is also provided.Type: ApplicationFiled: November 7, 2018Publication date: June 13, 2019Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Wen-Chung Lee, Hsiang-Sen Chang, Feng-Ping Chang
-
Patent number: 8159148Abstract: A light emitting diode (LED) light source module includes plural voltage converters to convert an input voltage into plural corresponding different operation voltages. A plurality of sets of different color LEDs are provided in the light source module, where each set receives a corresponding one of the operation voltages.Type: GrantFiled: January 16, 2007Date of Patent: April 17, 2012Assignee: Chimei Innolux CorporationInventor: Wen-Chung Lee
-
Publication number: 20070164928Abstract: A light emitting diode (LED) light source module includes plural voltage converters to convert an input voltage into plural corresponding different operation voltages. A plurality of sets of different color LEDs are provided in the light source module, where each set receives a corresponding one of the operation voltages.Type: ApplicationFiled: January 16, 2007Publication date: July 19, 2007Inventor: Wen-Chung Lee
-
Patent number: 6862545Abstract: A method for calibrating a linewidth measurement tool and a system for calibrating the linewidth measurement tool each employ a correction of a series of periodic actual measurements of at least one single measurement location of a topographic feature within a linewidth standard with an exponentially weighted moving average of a series of deviations of the series of periodic actual measurements from a corresponding series of regressed data points derived from mathematical regression of the series of periodic actual measurements. Such a correction provides for a more accurate calibration of the linewidth measurement tool and a more accurate measurement of linewidths within microelectronic products while employing the calibrated linewidth measurement tool.Type: GrantFiled: April 3, 2003Date of Patent: March 1, 2005Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Pey-Yuan Lee, Hong-Ji Yang, Yi-Hung Chen, Chi-Shen Lo, Chen-Ning Fuh, Wen-Chung Lee
-
Patent number: 5999011Abstract: This invention describes a method for improving the test time for hot carrier injection effects in CMOS transistors. In conventional testing of hot carrier effects a stress voltage is applied between the drain and the source of a transistor. This stress voltage is limited by the drain to source punch-through voltage. In the enhance method described within, a substrate back bias is applied that extends the punch-through voltage and allows a higher drain to source stress voltage. With the higher stress voltage the amount of time needed to test parameter degradation caused by hot carrier injection is substantially reduced.Type: GrantFiled: March 26, 1998Date of Patent: December 7, 1999Assignee: Taiwan Semiconductor Manufacturing CompanyInventors: Li-Huan Chu, Wen-Chung Lee