Abstract: An interconnect structure on a semiconductor die includes: a lower conductive layer; an upper conductive layer disposed above the lower conductive layer; and a VIA disposed between the lower conductive layer and the upper conductive layer. The VIA includes: a primary interconnect structure and a sacrificial stress barrier ring disposed around the primary interconnect structure and separated a distance from the primary interconnect structure. A fabrication method for the interconnect structure includes: forming a dielectric layer over a lower conductive layer; patterning photoresist (PR) layer over the dielectric layer to define a location for a plurality of VIA trenches, wherein the patterning includes patterning the PR layer to provide a center opening for the VIA trenches that is surrounded by a ring opening for the VIA trenches, wherein the center opening and the ring opening are spaced apart.

Abstract: A wafer container includes a frame, a door and at least a pair of shelves. The frame has opposite sidewalls. The pair of the shelves are respectively disposed and aligned on the opposite sidewalls of the frame. Various methods and devices are provided for holding at least one wafer to the shelves during transport.

Abstract: A signal decomposition system with low-latency empirical mode decomposition and the method of the same decompose an original signal using iterative computations with different directions of data streams. The directions of data stream in computations of odd or even iterations are adjusted for reducing the number of data stream direction reversals. As a result, computing data can be shared and computing time can be saved. The mechanism helps improve the efficiency of signal decompositions.

Abstract: Multi-unit module of portable computer, including a computer housing and a module casing. At least two expansion units are inserted in the module casing as a module. At least one plug is disposed on one side of the module casing and connected to the expansion units. A module insertion slot is disposed on one side of the housing. An inner end of the insertion slot is disposed with at least one socket secured on the main circuit board corresponding to the plug of the module casing, whereby when the module casing is inserted into the insertion slot, the plug is connected with the socket so that the expansion units can be at the same located in the housing and drivingly connected with and controlled by the main circuit board.