Patents by Inventor Wen-Chung Tsai

Wen-Chung Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240089645
    Abstract: A headphone includes a headgear and two earmuffs connected to opposite ends of the headgear, and each of the earmuffs includes an adjustment assembly. The adjustment assembly includes a base, two elastic members, two protrusions, and two sliding blocks. The base has two opposite accommodating parts and two guiding grooves. The elastic members are disposed in the accommodating parts, respectively, and the elastic members extend along a first axial direction. The protrusions are slidably connected to the guiding grooves, respectively, and protrude into the accommodating parts. The sliding blocks are disposed in the accommodating parts, respectively, and each of the sliding blocks is respectively connected between the corresponding protrusion and the corresponding elastic member.
    Type: Application
    Filed: October 19, 2022
    Publication date: March 14, 2024
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Wen-Chung Lee, Yung-Lung Tsai, Hung-Wen Tsao
  • Publication number: 20200000669
    Abstract: The invention is to provide a vibration fitness machine, comprising: a bottom seat, a driving device, two linkage mechanisms, a plurality of eccentric units and an upper cover seat body. The driving device drives the linkage mechanism to act through an eccentric shaft. The linkage mechanism is composed of at least three linkages, wherein the second and third linkages are pivotally connected to a left and right sides of the first linkage, and the middle between the second and third linkages and another end are pivotally connected to a fastening seat and the carrying seat, respectively, through the eccentric unit. The carrying seat is fixedly connected to the upper cover seat body so that the second and third linkages can generate up and down displacement as the same as seesaw-like at left and right sides, capable of driving the upper cover seat body to generate vertical motion as up and down displacement repeatedly, thereby achieving vibration fitness effect.
    Type: Application
    Filed: June 25, 2019
    Publication date: January 2, 2020
    Inventor: Wen-Chung Tsai
  • Publication number: 20160175493
    Abstract: Methods of fabricating a bioresorbable polymer scaffold are disclosed including a step of inducing crystallization in a bioresorbable polymer construct through exposure to a liquid penetrant.
    Type: Application
    Filed: November 3, 2015
    Publication date: June 23, 2016
    Inventors: Mikael Trollsas, John Stankus, Michael N. Ngo, Wen Chung Tsai, Thierry Glauser
  • Patent number: 9205456
    Abstract: Methods of fabricating a bioresorbable polymer scaffold are disclosed including a step of inducing crystallization in a bioresorbable polymer construct through exposure to a liquid penetrant.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: December 8, 2015
    Assignee: Abbott Cardiovascular Systems Inc.
    Inventors: Mikael Trollsas, John Stankus, Michael H. Ngo, Wen Chung Tsai, Thierry Glauser
  • Publication number: 20140030422
    Abstract: Methods of fabricating a bioresorbable polymer scaffold are disclosed including a step of inducing crystallization in a bioresorbable polymer construct through exposure to a liquid penetrant.
    Type: Application
    Filed: July 24, 2012
    Publication date: January 30, 2014
    Inventors: Mikael TROLLSAS, John STANKUS, Michael H. NGO, Wen Chung TSAI, Thierry Glauser
  • Publication number: 20110120450
    Abstract: A portable solar energy collecting device includes a container configured with an accommodating space therein and including a transparent housing. The transparent housing is formed with a vacuum chamber defined between the inner and outer surrounding walls and surrounding the accommodating space. A heat-absorbing unit is disposed in the accommodating space in the container, absorbs solar energy when the housing is irradiated by solar radiation, and converts the solar energy into thermal energy that is accumulated in the accommodating space in the container.
    Type: Application
    Filed: March 26, 2010
    Publication date: May 26, 2011
    Inventors: Chin-Kuang Luo, Jeng-Jong Guo, Wen-Chung Tsai
  • Patent number: 7581072
    Abstract: A data buffer device that includes a write unit and a read unit, and is disposed between a first interface device and a second interface device is provided. The write unit further includes a first write buffer, a second write buffer and a write controller. The write controller controls the first write buffer and the second write buffer to receive and transmit data from the first interface device to the second interface device alternatively according to the requests of the first interface device and the second interface device. The read unit further includes a first read controller, a first read buffer and a second read buffer. The read controller controls the first read buffer and the second read buffer to receive and transmit data from the second interface device to the first interface device alternatively according to the requests of the first interface device and the second interface device.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: August 25, 2009
    Assignee: Via Technologies, Inc.
    Inventors: Wen-Chung Tsai, Jung-Tsan Hsu
  • Patent number: 7552253
    Abstract: A method for determining a buffer size of devices in an embedded system is disclosed. A buffer fill time (BFT) and a request response time (RRT) are determined. Next, a media data rate (MDR) and a number of bus masters (NBM) are calculated. Finally, a lowest buffer size of a device is determined according to the BFT, the MDR and NBM of the system.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: June 23, 2009
    Assignee: Via Technologies, Inc.
    Inventors: Wen-Chung Tsai, Jung-Tsan Hsu
  • Publication number: 20070294439
    Abstract: A method for determining a buffer size of devices in an embedded system is disclosed. A buffer fill time (BFT) and a request response time (RRT) are determined. Next, a media data rate (MDR) and a number of bus masters (NBM) are calculated. Finally, a lowest buffer size of a device is determined according to the BFT, the MDR and NBM of the system.
    Type: Application
    Filed: December 14, 2006
    Publication date: December 20, 2007
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Wen-Chung Tsai, Jung-Tsan Hsu
  • Publication number: 20070198730
    Abstract: The present invention relates to an embedded system and method, and in particular relates to an embedded system with a bus and an arbitration method. An arbitration method is applied in an embedded system that comprises a plurality of devices, a bus and an arbiter. Each device comprises a buffer and a time-to-death value. The arbiter chooses one device to access data through the bus according to the plurality of TTD values. The arbitration method comprises: sending a plurality of request signals to the arbiter; choosing one device to access data through the bus according to the plurality of TTD values, wherein the chosen device with a minimum TTD value is chosen; increasing the TTD value of the chosen device when the chosen device is accessing data through the bus; choosing another device to access data through the bus when the TTD value of another device becomes minimum.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 23, 2007
    Inventors: Wen-Chung Tsai, Jung-Tsan Hsu
  • Publication number: 20060282619
    Abstract: A data buffer device that includes a write unit and a read unit, and is disposed between a first interface device and a second interface device is provided. The write unit further includes a first write buffer, a second write buffer and a write controller. The write controller controls the first write buffer and the second write buffer to receive and transmit data from the first interface device to the second interface device alternatively according to the requests of the first interface device and the second interface device. The read unit further includes a first read controller, a first read buffer and a second read buffer. The read controller controls the first read buffer and the second read buffer to receive and transmit data from the second interface device to the first interface device alternatively according to the requests of the first interface device and the second interface device.
    Type: Application
    Filed: June 28, 2006
    Publication date: December 14, 2006
    Applicant: VIA TECHNOLOGIES, INC.
    Inventors: Wen-Chung Tsai, Jung-Tsan Hsu
  • Patent number: 7026181
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Grant
    Filed: August 1, 2005
    Date of Patent: April 11, 2006
    Assignee: Advanced Epitaxy Technology
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Publication number: 20050272176
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Application
    Filed: August 1, 2005
    Publication date: December 8, 2005
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Patent number: 6969626
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Grant
    Filed: February 5, 2004
    Date of Patent: November 29, 2005
    Assignee: Advanced Epitaxy Technology
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Publication number: 20050176162
    Abstract: The present invention relates to a method for forming LED. In the present invention, LED dies are defined by photolithography and etching processes to replace a cutting step, and a metal substrate of the LED is formed by chemical or physical method.
    Type: Application
    Filed: February 5, 2004
    Publication date: August 11, 2005
    Inventors: Jan-Der Guo, Wen-Chung Tsai, Tsung-Yu Chen, Shao-Hua Huang
  • Publication number: 20050083930
    Abstract: A method of early release of buffers and a related media access control chip are disclosed, wherein the method includes the steps of: receiving an Ethernet packet from a port, allocating a buffer area having a plurality of buffers stitched sequentially for storing the Ethernet packet, transmitting the Ethernet packet from the destination port, and releasing the buffers when the transmission starts if the destination port is full-duplex transmission mode, or releasing the buffers after at least 128 bytes of the packet is transmitted if the destination port is half-duplex transmission mode. The Ethernet packet can be either uni-cast, multi-cast or broadcast.
    Type: Application
    Filed: October 19, 2004
    Publication date: April 21, 2005
    Inventors: Jen-Kai Chen, Wen-Chung Tsai
  • Publication number: 20030148591
    Abstract: The present invention includes step of selecting a provisional substrate, and forming semiconductor device structure is formed on the provisional substrate. The provisional substrate includes conductor material, semiconductor material or insulator material. Then, next step is to separate the chips on the provisional substrate into a plurality of individual units on the provisional substrate. The separating method includes but is not limited to physical method such as cutting by knife or laser or, chemical method such as lithography. Next step is to select a permanence substrate to attach the device to the permanence substrate by using physical or chemical method. The attaching method includes the usage of glue, metal, fusion, pressure, van der waale force, and so on. Subsequently, the provisional substrate on the other side of the semiconductor device is removed. The method of removing the provisional substrate includes but is not limited to physical polish, chemical etching, or laser removal.
    Type: Application
    Filed: August 23, 2002
    Publication date: August 7, 2003
    Inventors: Jan-Dar Guo, Tsung-Yu Chen, Hui-wen Chuang, Jian-Shihn Tsang, Wen-Chung Tsai, Shih-Hsiung Chan
  • Patent number: 6432847
    Abstract: A novel method of using lasers for generating driving energy for activating P-type compound semiconductor films and reducing the resistivity thereof. The P-type compound semiconductor films are made from III-V nitrides or II-VI group compounds doped with P-type impurity. The present invention can be carried out in the ambience of atmosphere rather than in the ambience of nitrogen gas. In addition, adjusting the power and focusing distance of a laser source, and the power density can change the time required by the activating process.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: August 13, 2002
    Assignee: Advanced Epitaxy Technology Inc.
    Inventors: Jian-Shihn Tsang, Wen-Chung Tsai, Tsung-Yu Chen, Chia-Hung Hsu, Wei-Chih Lai
  • Patent number: D523560
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: June 20, 2006
    Inventor: Wen-Chung Tsai
  • Patent number: D478670
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: August 19, 2003
    Inventor: Wen-Chung Tsai