Abstract: The present disclosure provides a silicon carbide (SiC) opto-thyristor and a method for manufacturing the same. The SiC opto-thyristor includes a SiC substrate, a SiC light emitter and a SiC light-sensitive thyristor. In the method, a SiC epitaxy is mainly formed on the SiC substrate with the doped P-type and N-type semiconductor materials to define the regions for forming the SiC light emitter and the basic structures of the SiC light-sensitive thyristor. A passivation layer is deposited. Conducting channels for the SiC light emitter and the SiC light-sensitive thyristor are formed by an etching process. After patterning a metal conductor layer, a structure of electrical contacts of the SiC light emitter and the SiC light-sensitive thyristor is formed. Then, terminals of an input voltage and an output voltage of the silicon carbide opto-thyristor are formed after a wire bonding process upon the electrical contacts. Finally, a packaging process is performed.

Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.

Abstract: The invention is directed to a securing apparatus for a vibration speaker, the securing apparatus including at least one fastening plate fixed to or pressed on the vibration speaker; and at least one suction cup correspondingly attached to the fastening plate. When the at least one suction cup is adhered to a vibration plate, the suction cup draws the fastening plate, which then presses on the vibration speaker, such that the bottom of the vibration speaker bonds with the vibration plate.

Abstract: The present invention is directed to a transducer module, which includes at least two actuators with a same physical dimension. At least two support members correspond to the actuators, and are used to transfer inertial force to a vibration plate. The two support members are disposed between neighboring actuators, and between the actuator and the vibration plate, respectively.

Abstract: The present invention is directed to a method of generating three dimensional (3D) haptic feedback and an associated handheld electronic device. A first, a second and a third directional actuator groups are disposed on an inner surface of a housing. The vibration inertial forces generated by the first, the second, and the third directional actuator groups are parallel with the first, the second and the third axial directions respectively. The first, the second, and the third directional actuator groups are individually or in combination driven, thereby generating haptic feedback.

Abstract: The present invention is directed to a transducer module, which includes an actuator that is directly or indirectly coupled to a vibration plate. The transducer module includes a plastic damper that elastically secures the vibration plate to a frame.

Abstract: A band-pass filter circuit with transmission lines includes an input end and an output end connected by a transmission line circuit. The input end is configured for inputting signals into the band-pass filter circuit. The output end is configured for outputting the filtered signals to other devices. The transmission line circuit includes a microstrip transmission line and a number of shorted transmission lines parallel to each other. An end of each shorted transmission line is connected to the microstrip transmission line, and the other end of each shorted transmission line is grounded. Both the microstrip transmission line and the shorted transmission lines are quarter wavelength lossless transmission lines and the phase difference in signal transmission is ?/2.

Abstract: A via impedance matching method is provided. Firstly, a circuit model of a via in the PCB is created, which comprises a low pass filter circuit composed of two capacitors connected in parallel and an inductor connected between the two capacitors. Then, S parameters of the via by analyzing the circuit model is obtained and converted to an ABCD matrix, and parameters of an ideal low pass filter model is obtained by equaling an ABCD matrix of the ideal low pass filter model to the ABCD matrix with the S parameters. Then, impedance matching parameters are calculated according to the parameters of the ideal low pass filter model. Finally, proper capacitors and inductors are selected and disposed on the PCB to match the via.

Abstract: A life-saying travel bag includes a suitably long, wide and durable rope sewn with a zipper on each side such that the rope forms a substantially cylindrical bag when the side zippers are closed. A fastening mechanism is disposed near either end on the inside of the bag, and a fastening strap is arranged at either end of the bag for connecting to a shoulder strap for carrying. An upper cover and a lower cover are respectively connected to the ends of the bag by zippers. The upper cover accommodates a speed control means which has a narrow recess at its center for containing an adjusting rod with an eccentric shaft. The ends of the shaft are connected to a control lever which may bring the adjusting rod to rotate towards or away from the opening of the recess so that the rod may be retained at or disengage from the opening to achieve the object of control. The zippers may be opened so that the rope is extended to its full length.