Patents by Inventor Wen Dai

Wen Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7999195
    Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: August 16, 2011
    Assignee: Askey Computer Corp.
    Inventors: Chung-Shao Huang, Ching-Feng Hsieh, Jen-Huan Yu, Cheng-Wen Dai, Kuo-Ching Chen
  • Patent number: 7958625
    Abstract: An assembly device includes a base having a supporting portion upon which an isolation cover and a main body are disposed. A press-fitting mechanism is movably connected to the base, and includes a press-fitting portion facing the supporting portion and disposed corresponding in position to the supporting portion, and further portions for guiding and bending second positioning portions. The further portions are movably disposed on external side faces of the press-fitting portion. The press-fitting mechanism also has first portions for holding the further portions to the external side faces of the press-fitting portion, and has second portions passing through upper ends of the further portions. A drive mechanism is disposed at the base and has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion via the drive portion, so as to bend and fasten ends of second positioning portions.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: June 14, 2011
    Assignee: Askey Computer Corp.
    Inventors: Chia-Hung Lee, Jen-Huan Yu, Chung-Shao Huang, Ching-Feng Hsieh, Cheng-Wen Dai, Kuo-Ching Chen
  • Publication number: 20110064246
    Abstract: An interface is provided between a transducer and audio processing circuitry. The interface has a switching device coupled to the transducer. The interface also has a first signal path that is selectively coupled to transducer via the switching device and includes a first output, the first signal path being configured to selectively receive input signals from the transducer, and form a first output signal at the first output by amplifying the input signals to provide a first gain. The first output is coupled to the audio processing circuitry. A second signal path is provided that is selectively coupled to the transducer via the switching device and includes a second output. The second gain is selected to be substantially larger than the first gain. The switching device is configured to switch the input signal between the first signal path and the second signal path.
    Type: Application
    Filed: September 16, 2010
    Publication date: March 17, 2011
    Inventors: Peter V. Loeppert, Paul Fielding Smith, Wei-Wen Dai, Shawn Beus
  • Publication number: 20100170460
    Abstract: Systems and methods for controlling air flow in an engine including a turbocharger are provided. One example method includes during a first operating range, operating the engine with a first exhaust valve duration at a first exhaust valve timing, during a second operating range, operating the engine with a second exhaust valve duration at a second timing, and during a third operating range, operating the engine with the first exhaust valve duration at a third timing, where engine load of the second operating range is higher than engine load of the first operating range, which in turn is higher than engine load of the third operating range, and where the first exhaust valve duration is longer than the second exhaust valve duration, and where the first timing is retarded to a greater extent than either of the second and third timings.
    Type: Application
    Filed: January 6, 2009
    Publication date: July 8, 2010
    Applicant: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Thomas G. Leone, Eric Warren Curtis, James Leiby, Wen Dai
  • Publication number: 20100095518
    Abstract: An assembly device applicable to assembling an isolation cover to a main body of a circuit board is provided. The main body and the isolation cover respectively have a plurality of first positioning portions and a plurality of second positioning portions corresponding to each other. The second positioning portions correspondingly pass through the first positioning portions, respectively. The assembly device includes a base, a press-fitting mechanism movably connected to the base, and a drive mechanism disposed at the base. The base has a supporting portion for disposing the isolation cover and the main body. The press-fitting mechanism has a press-fitting portion facing the supporting portion. The drive mechanism has a drive portion connected to the press-fitting mechanism, for driving the press-fitting mechanism to move towards the supporting portion of the base via the drive portion, so as to bend and fasten ends of the second positioning portions.
    Type: Application
    Filed: February 5, 2009
    Publication date: April 22, 2010
    Applicant: ASKEY COMPUTER CORP.
    Inventors: Chia-Hung LEE, Jen-Huan YU, Chung-Shao HUANG, Ching-Feng HSIEH, Cheng-Wen DAI, Kuo-Ching CHEN
  • Publication number: 20100089619
    Abstract: The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.
    Type: Application
    Filed: December 22, 2008
    Publication date: April 15, 2010
    Applicant: ASKEY COMPUTER CORP.
    Inventors: Kuo-Ching CHEN, Chung-Shao Huang, Ching-Feng Hsieh, Jen-Huan Yu, Cheng-Wen Dai
  • Publication number: 20100091471
    Abstract: The present invention provides a circuit board having an isolation cover and an assembling method thereof. The circuit board of the present invention comprises a main body and an isolation cover disposed on the circuit board main body. The main body and the isolation cover have a plurality of corresponding first and second positioning portions, and a ground portion is disposed on at least one side of each first positioning portion. The isolation cover is disposed on a first surface of the main body, and each second positioning portion passes through a second surface of the main body and each first positioning portion. An end of each second positioning portion is connected to each ground portion.
    Type: Application
    Filed: December 22, 2008
    Publication date: April 15, 2010
    Applicant: ASKEY COMPUTER CORP.
    Inventors: Chung-Shao HUANG, Ching-Feng Hsieh, Jen-Huan Yu, Cheng-Wen Dai, Kuo-Ching Chen
  • Publication number: 20090233225
    Abstract: This invention relates to the need to improve the corrosion resistance of very low total chlorine epoxy resins which contain very low contents of organically bound chlorine. The invention relates to the improvement of corrosion resistance of such epoxy resins for electronic applications by the addition of specific additives acceptable to the electronics industry. The use of these low chlorine resins in combination with said additives has been shown to be corrosion-free on highly corrosive surfaces such as aluminum and copper, which are frequently encountered in electronic applications.
    Type: Application
    Filed: March 10, 2009
    Publication date: September 17, 2009
    Inventors: Donald W. Johnson, Wen Dai
  • Patent number: 7536520
    Abstract: A method and apparatus for native method invocation and changing memory bank. A method return frame of a smart card stores the status of a native method invocation, and a memory bank flag points a program counter to a runtime environment (RE) memory bank or an operating system (OS) memory bank. First, upon a method invocation, the method return frame is pushed and set as a native method invocation when the method invocation is the native method invocation. Then, the memory bank flag points the program counter to the OS memory bank. Next, the method return frame is popped after the native method has been executed. Finally, the memory bank flag is changed to point the program counter to the RE memory bank if the method return frame is set as the native method invocation.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: May 19, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Hsien-Wen Dai, Lung-Chung Chang
  • Publication number: 20060119787
    Abstract: A sunglass clip-on includes an eyeglass-covering portion from which a pair of legs extend rearwardly. Each leg includes a generally horizontal segment and a downward segment.
    Type: Application
    Filed: December 8, 2004
    Publication date: June 8, 2006
    Inventor: Wen Dai
  • Publication number: 20050204350
    Abstract: A method and apparatus for native method invocation and changing memory bank. A method return frame of a smart card stores the status of a native method invocation, and a memory bank flag points a program counter to a runtime environment (RE) memory bank or an operating system (OS) memory bank. First, upon a method invocation, the method return frame is pushed and set as a native method invocation when the method invocation is the native method invocation. Then, the memory bank flag points the program counter to the OS memory bank. Next, the method return frame is popped after the native method has been executed. Finally, the memory bank flag is changed to point the program counter to the RE memory bank if the method return frame is set as the native method invocation.
    Type: Application
    Filed: August 31, 2004
    Publication date: September 15, 2005
    Inventors: Hsien-Wen Dai, Lung-Chung Chang