Abstract: The invention discloses an electrostatic discharge circuit. The spirit of the invention is that the electrostatic common portion in the conventional integrated circuit is divided into at least two sets corresponding to at least two internal common voltages, separately. In addition, the electrostatic common portions use serily connected diode rings. Therefore, the number of diodes of the diode rings coupling to the higher common voltage and the electrostatic common portion, coupling to the higher common voltage, can be reduced.

Abstract: An improved apparatus and method for testing experiment is disclosed. The apparatus includes a motherboard and a stress module. The motherboard includes a component under test. A stress module connects the component and contacts the component directly. The stress module can provide the component with various rages of temperature and voltage for test. Besides, the stress module also can provide an anti-electrostatic device to prevent electrostatic disturbance.

Abstract: An improved apparatus and method for testing experiment is disclosed. The apparatus includes a motherboard and a stress module. The motherboard includes a component under test. A stress module connects the component and contacts the component directly. The stress module can provide the component with various rages of temperature and voltage for test. Besides, the stress module also can provide an anti-electrostatic device to prevent electrostatic disturbance.

Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.

Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads, and the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads that does not electrically connect to anyone of the first pads electrically connects to the interconnection-wiring layer. In another case, a shielding portion, which electrically connects the interconnection-wiring layer, is provided around the second pad that doesn't electrically connect to anyone of the first pads. Furthermore, this invention also discloses a semiconductor device including the substrate.

Abstract: A substrate used in a semiconductor device. The substrate includes a first wiring layer, a second wiring layer, and an interconnection-wiring layer. The first wiring layer includes a plurality of first pads while the second wiring layer includes a plurality of second pads. The interconnection-wiring layer is set between the first and second wiring layer. In this case, at least one of the second pads isn't electrically connected with anyone of the first pads, and other second pads that located adjacent to this second pad, which is not electrically connected with the first pads, electrically connect to the interconnection-wiring layer. Furthermore, this invention also discloses a semiconductor device including the substrate.