Patents by Inventor Wen-Dung HSU

Wen-Dung HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTICOMPONENT-ALLOY MATERIAL LAYER, METHOD OF MANUFACTURING THE SAME AND CAPACITOR STRUCTURE OF SEMICONDUCTOR DEVICE
    Publication number: 20230343848
    Abstract: The present invention relates to a multicomponent-alloy material layer and a method of manufacturing the multicomponent-alloy material layer and a capacitor structure of a semiconductor device comprising the multicomponent-alloy material layer. The multicomponent-alloy material layer has four to six metal elements and has specific two kinds of metal components, and the two kinds of metal components have a specific content ratio, such that without a thermal annealing treatment, the multicomponent-alloy material layer has a specific work function for an application in the capacitor structure of the semiconductor device.
    Type: Application
    Filed: September 21, 2022
    Publication date: October 26, 2023
    Inventors: Chuan-Feng SHIH, Wen-Dung HSU, Bernard Hao-Chih LIU, Chung-Hung HUNG, Hsuan-Ta WU, Cheng-Hsien YEH