Patents by Inventor Wen-Fa Tai

Wen-Fa Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gas delivering device
    Patent number: 6828246
    Abstract: A gas delivering device inside a gaseous reaction chamber capable of increasing gas flow in areas having a deficient supply of gas by forming additional holes in corresponding positions. Because a gas-delivering panel design having asymmetrical holes is employed, gas flow rate within the reactions chamber can be roughly balanced. Hence, a homogeneous stream of gaseous reactants can be maintained above the surface of a reacting wafer.
    Type: Grant
    Filed: May 20, 2002
    Date of Patent: December 7, 2004
    Assignee: Winbond Electronics Corp.
    Inventors: An-Chun Tu, Wen-Fa Tai
  • Gas delivering device
    Publication number: 20020134309
    Abstract: A gas delivering device inside a gaseous reaction chamber capable of increasing gas flow in areas having a deficient supply of gas by forming additional holes in corresponding positions. Because a gas-delivering panel design having asymmetrical holes is employed, gas flow rate within the reactions chamber can be roughly balanced. Hence, a homogeneous stream of gaseous reactants can be maintained above the surface of a reacting wafer.
    Type: Application
    Filed: May 20, 2002
    Publication date: September 26, 2002
    Inventors: An-Chun Tu, Wen-Fa Tai
  • GAS DELIVERING DEVICE
    Publication number: 20010050051
    Abstract: A gas delivering device inside a gaseous reaction chamber capable of increasing gas flow in areas having a deficient supply of gas by forming additional air holes in corresponding positions. Because a gas-delivering panel design having asymmetrical air holes is employed, gas flow rate within the reaction chamber can be roughly balanced. Hence, a homogeneous stream of gaseous reactants can be maintained above the surface of a reacting wafer.
    Type: Application
    Filed: November 12, 1998
    Publication date: December 13, 2001
    Inventors: AN-CHUN TU, WEN-FA TAI