Patents by Inventor Wen Feng Deng

Wen Feng Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular connector
    Patent number: 7134917
    Abstract: A modular connector (100) includes an insulative housing (1) defining a chamber (10). A terminal module insert (3) is fixedly received in the chamber and defines a plurality of passageways (330) therein. A plurality of terminals (34) are received in the passageways of the insert. Each terminal includes a mounting end (341), a fixing portion (342) engaging with a corresponding passageway of the insert and a mating end (344) downwardly and rearwardly extending from the fixing portion for engaging with a contact of a mating connector in a front-to-rear direction. The terminals have positioning portions at the fixing portions. The positioning portions are oriented perpendicularly to the front-to-rear direction.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: November 14, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Wen Feng Deng, Qin Wan, Li-Chun Wu
  • Electrical connector assembly with low crosstalk
    Patent number: 6997754
    Abstract: An electrical connector assembly (100) is mounted on a motherboard and includes an insulative housing (1) having at least two receiving cavities (110, 111) and an insert module (200) secured to the housing. The insert module includes an insulator (2), a first and a second terminal modules (4, 5) received in the insulator and a ground plate (3) secured between the first and the second terminal modules.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: February 14, 2006
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Qing Wan, Qisheng Zheng, Wen Feng Deng
  • Electrical connector assembly with low crosstalk
    Publication number: 20040224564
    Abstract: An electrical connector assembly (100) is mounted on a motherboard and includes an insulative housing (1) having at least two receiving cavities (110, 111) and an insert module (200) secured to the housing. The insert module includes an insulator (2), a first and a second terminal modules (4, 5) received in the insulator and a ground plate (3) secured between the first and the second terminal modules.
    Type: Application
    Filed: May 7, 2004
    Publication date: November 11, 2004
    Inventors: Qing Wan, Qisheng Zheng, Wen Feng Deng
  • USB flash memory drive
    Patent number: D520996
    Type: Grant
    Filed: November 17, 2004
    Date of Patent: May 16, 2006
    Assignee: BenQ Corporation
    Inventor: Wen-Feng Deng