Patents by Inventor Wen-Feng Tsai

Wen-Feng Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10535697
    Abstract: An image sensor structure that includes a first semiconductor substrate having a plurality of imaging sensors; a first interconnect structure formed on the first semiconductor substrate; a second semiconductor substrate having a logic circuit; a second interconnect structure formed on the second semiconductor substrate, wherein the first and the second semiconductor substrates are bonded together in a configuration that the first and second interconnect structures are sandwiched between the first and second semiconductor substrates; and a backside deep contact (BDCT) feature extended from the first interconnect structure to the second interconnect structure, thereby electrically coupling the logic circuit to the image sensors.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Feng Kao, Dun-Nian Yaung, Jen-Cheng Liu, Chun-Chieh Chuang, Feng-Chi Hung, Shuang-Ji Tsai, Jen-Shyan Lin, Shu-Ting Tsai, Wen-I Hsu
  • Patent number: 10535631
    Abstract: Disclosed herein is a package comprising a first redistribution layer (RDL) disposed on a first side of a first semiconductor substrate and a second RDL disposed on a second semiconductor substrate, wherein the first RDL is bonded to the second RDL. First conductive elements are disposed in the first RDL and the second RDL. First vias extend from one or more of the first conductive elements through the first semiconductor substrate to a second side of the first semiconductor substrate opposite the first side. First spacers are interposed between the first semiconductor substrate and the first vias and each extend from a respective one of the first conductive elements through the first semiconductor substrate.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 14, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai, Sung-Feng Yeh
  • Patent number: 10521060
    Abstract: A reflected-capacitive touch panel of a wearable electronic device includes a center touch sensing portion composed of a plurality of mutual-capacitance sensors; a border touch sensing portion composed of a plurality of hybrid self-capacitance and mutual-capacitance sensors; and a predetermined bonding area into which channels of the center touch sensing portion and the border touch sensing portion are routed.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: December 31, 2019
    Assignee: Himax Technologies Limited
    Inventors: Cheng-Hung Tsai, Yao-Mao Liu, Wen-Juan Li, Jyun-Yan Liu, Li-Lin Liu, Jui-Ni Li, Wai-Pan Wu, Shen-Feng Tai
  • Patent number: 10510751
    Abstract: Embodiments of the disclosure provide a semiconductor device including a substrate, an insulating layer formed over the substrate, a plurality of fins formed vertically from a surface of the substrate, the fins extending through the insulating layer and above a top surface of the insulating layer, a gate structure formed over a portion of fins and over the top surface of the insulating layer, a source/drain structure disposed adjacent to opposing sides of the gate structure, the source/drain structure contacting the fin, a dielectric layer formed over the insulating layer, a first contact trench extending a first depth through the dielectric layer to expose the source/drain structure, the first contact trench containing an electrical conductive material, and a second contact trench extending a second depth into the dielectric layer, the second contact trench containing the electrical conductive material, and the second depth is greater than the first depth.
    Type: Grant
    Filed: August 25, 2017
    Date of Patent: December 17, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Che Tsai, Min-Yann Hsieh, Hua Feng Chen, Kuo-Hua Pan
  • Publication number: 20190305414
    Abstract: A communication apparatus, an electronic apparatus and an antenna adjustment method thereof are provided. The communication apparatus includes an antenna system, a tuning portion and a switch circuit. The antenna system includes at least two antenna units. The tuning portion is disposed between the at least two antenna units and includes at least two branch units. The switch circuit is coupled to the tuning portion. The switch circuit switches a conduction from a first one of the branch units to a second one of the branch units according to a switching signal. The switching signal is related to performances of the antenna system. Accordingly, a dynamic and flexible adjustment mechanism can be provided to increase throughput and improve users' internet experience.
    Type: Application
    Filed: April 2, 2019
    Publication date: October 3, 2019
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Liang-Che Chou, Li-Chun Lee, Yu-Chun Hsieh, Mau-Chi Sun, Jui-Hung Lai, Wen-Feng Tsai, Chih-Chien Liu
  • Patent number: 10431535
    Abstract: An electronic package and a method for fabricating the same are provided. The method includes forming an antenna structure in contact with one side of a circuit structure of a packaging substrate, and disposing an electronic component on the other side of the circuit structure. As such, the antenna structure is integrated with the packaging substrate, thereby reducing the thickness of the electronic package and improving the efficiency of the antenna structure.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: October 1, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Jui-Feng Chen, Chia-Cheng Hsu, Wen-Jung Tsai, Chia-Cheng Chen, Cheng Kai Chang
  • Publication number: 20190229233
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Inventors: Cheng-Feng YU, Ching-Yuan TSAI, Yao-Ru CHANG, Hsin-Chan CHUNG, Shih-Chang LEE, Wen-Luh LIAO, Cheng-Hsing CHIANG, Kuo-Feng HUANG, Hsu-Hsuan TENG, Hung-Ta CHENG, Yung-Fu CHANG
  • Publication number: 20190219061
    Abstract: A fan failure backup apparatus includes a first fan module and a second fan module. When a second control unit of the second fan module realizes that the first fan module is failed through a first control unit of the first fan module, and the second control unit realizes that the second fan module is not failed, the second control unit controls the second fan module to additionally enhance a pressure-flow characteristic of a second fan unit of the second fan module.
    Type: Application
    Filed: November 26, 2018
    Publication date: July 18, 2019
    Inventors: Wei-Shuo TSENG, Chia-Feng WU, Po-Hui SHEN, Chia-Huang WU, Chun-Chieh TSAI, Wen-Chih WANG
  • Patent number: 10348126
    Abstract: A battery switching method applicable to an electronic device is provided. The electronic device comprises a first battery and a second battery. The method comprises: (a) switching the electronic device to a sleep mode from a normal mode; (b) switching a power supply of the electronic device to the second battery according to a removing signal triggered by removing the first battery; (c) switching the power supply of the electronic device to the first battery according to an inserting signal triggered by inserting the first battery; (d) updating parameters of the first battery; and (e) switching the electronic device to the normal mode from the sleep mode.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: July 9, 2019
    Assignee: Chiun Mai Communication Systems, Inc.
    Inventors: Wen-Hann Tsai, Pi-Feng Shih, Chin-Kun Lai
  • Patent number: 10332786
    Abstract: A method for manufacturing a semiconductor device includes forming a gate stack over a substrate; forming an interlayer dielectric over the substrate to cover the gate stack; forming an opening in the interlayer dielectric to expose to the gate stack; forming a glue layer over the interlayer dielectric and in the opening; partially removing the glue layer, in which a portion of the glue layer remain in the opening; and tuning a profile of the remained portion of the glue layer.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: June 25, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Che Tsai, Min-Yann Hsieh, Hua-Feng Chen, Kuo-Hua Pan
  • Patent number: 10312407
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 4, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Feng Yu, Ching-Yuan Tsai, Yao-Ru Chang, Hsin-Chan Chung, Shih-Chang Lee, Wen-Luh Liao, Cheng-Hsing Chiang, Kuo-Feng Huang, Hsu-Hsuan Teng, Hung-Ta Cheng, Yung-Fu Chang
  • Publication number: 20190139933
    Abstract: Disclosed herein is a package comprising a first redistribution layer (RDL) disposed on a first side of a first semiconductor substrate and a second RDL disposed on a second semiconductor substrate, wherein the first RDL is bonded to the second RDL. First conductive elements are disposed in the first RDL and the second RDL. First vias extend from one or more of the first conductive elements through the first semiconductor substrate to a second side of the first semiconductor substrate opposite the first side. First spacers are interposed between the first semiconductor substrate and the first vias and each extend from a respective one of the first conductive elements through the first semiconductor substrate.
    Type: Application
    Filed: December 17, 2018
    Publication date: May 9, 2019
    Inventors: Chen-Hua Yu, Ming-Fa Chen, Wen-Ching Tsai, Sung-Feng Yeh
  • Patent number: 9604698
    Abstract: A bicycle cogset comprises a sprocket base, a first sprocket, and a second sprocket. A periphery of the sprocket base is provided with a plurality of connecting arms, and each of the connecting arms is provided with at least one first and one second connection hole respectively. The first sprocket has a first outer portion and a first inner portion, the first outer portion provided with a plurality of first teeth, the first inner portion provided with a plurality of first insertion members, and the first insertion members disposed in the first connection holes. The second sprocket has a second outer portion and a second inner portion, the second outer portion provided with a plurality of second teeth, the second inner portion provided with a plurality of second insertion members, and the second insertion members disposed in the second connection holes.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: March 28, 2017
    Assignee: TIEN HSIN INDUSTRIES CO., LTD.
    Inventors: Wen-Feng Tsai, Wen-Nan Liao
  • Patent number: 9604699
    Abstract: A bicycle cogset manufacturing method includes: connecting a first and a second sprocket in different sizes with connecting members as a sprockets assembly in advance, where first and second inner portions of the first and second sprockets respectively have first insertion and second insertion members, and each of the insertion members are respectively provided with a first and a second positioning hole; transferring the sprockets assembly into a mold, and performing pouring to form a sprocket base, where an assembly hole is disposed in the center of the sprocket base, a plurality of connecting arms are arranged on an outer portion of the sprocket base, and the connecting arms clad the first insertion members and the second insertion members to form a cogset. In this way, modularization can be implemented to achieve objectives of preventing troublesome riveting, accelerating manufacture, and reducing product weight.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: March 28, 2017
    Assignee: TIEN HSIN INDUSTRIES CO., LTD.
    Inventors: Wen-Feng Tsai, Wen-Nan Liao
  • Publication number: 20160121965
    Abstract: A bicycle cogset manufacturing method includes: connecting a first and a second sprocket in different sizes with connecting members as a sprockets assembly in advance, where first and second inner portions of the first and second sprockets respectively have first insertion and second insertion members, and each of the insertion members are respectively provided with a first and a second positioning hole; transferring the sprockets assembly into a mold, and performing pouring to form a sprocket base, where an assembly hole is disposed in the center of the sprocket base, a plurality of connecting arms are arranged on an outer portion of the sprocket base, and the connecting arms clad the first insertion members and the second insertion members to form a cogset. In this way, modularization can be implemented to achieve objectives of preventing troublesome riveting, accelerating manufacture, and reducing product weight.
    Type: Application
    Filed: October 30, 2014
    Publication date: May 5, 2016
    Inventors: WEN-FENG TSAI, WEN-NAN LIAO
  • Publication number: 20160114859
    Abstract: A bicycle cogset comprises a sprocket base, a first sprocket, and a second sprocket. A periphery of the sprocket base is provided with a plurality of connecting arms, and each of the connecting arms is provided with at least one first and one second connection hole respectively. The first sprocket has a first outer portion and a first inner portion, the first outer portion provided with a plurality of first teeth, the first inner portion provided with a plurality of first insertion members, and the first insertion members disposed in the first connection holes. The second sprocket has a second outer portion and a second inner portion, the second outer portion provided with a plurality of second teeth, the second inner portion provided with a plurality of second insertion members, and the second insertion members disposed in the second connection holes.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 28, 2016
    Inventors: WEN-FENG TSAI, WEN-NAN LIAO
  • Patent number: 9273824
    Abstract: An adjustable support structure includes a mounting base, a support arm pivotally connected to the mounting base, two swivel arms respectively pivotally connected to opposing left and right sides of the support arm for hooking on a respective post, and two chucks respectively slidably coupled to respective shanks of the swivel arms and movable by respective locknuts for stopping one respective post in the hooks of the swivel arms to lock the swivel arms to the posts.
    Type: Grant
    Filed: March 20, 2015
    Date of Patent: March 1, 2016
    Inventors: Wen-Feng Tsai, Cheng-Che Yu
  • Patent number: 9077079
    Abstract: An electronic device including a shell, an antenna unit, an insulating layer and an isolating conductor is provided. The material of the shell includes conductive material. The antenna unit is disposed on the shell and includes a first antenna and a second antenna. The first antenna and the second antenna are grounded to the shell. The insulating layer is disposed on the shell and located between a ground plane of the first antenna and a ground plane of the second antenna. The isolating conductor is disposed on the insulating layer and has a slot.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: July 7, 2015
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yun-Lung Ke, Wen-Feng Tsai, Cheng-Chi Chen, Huang-Wei Chen
  • Patent number: 8684471
    Abstract: A bicycle rim includes a body having an axis defining a center thereof. The body includes an outer periphery and an inner periphery. The outer periphery and the axis have an outer radius therebetween, and the outer radius is constant. The inner periphery includes a first portion having a non-constant diameter.
    Type: Grant
    Filed: January 31, 2011
    Date of Patent: April 1, 2014
    Assignee: Tien Hsin Industries Co., Ltd.
    Inventor: Wen-Feng Tsai
  • Publication number: 20140062797
    Abstract: An electronic device including a shell, an antenna unit, an insulating layer and an isolating conductor is provided. The material of the shell includes conductive material. The antenna unit is disposed on the shell and includes a first antenna and a second antenna. The first antenna and the second antenna are grounded to the shell. The insulating layer is disposed on the shell and located between a ground plane of the first antenna and a ground plane of the second antenna. The isolating conductor is disposed on the insulating layer and has a slot.
    Type: Application
    Filed: October 2, 2012
    Publication date: March 6, 2014
    Inventors: Yun-Lung Ke, Wen-Feng Tsai, Cheng-Chi Chen, Huang-Wei Chen