Patents by Inventor Wen-Fon Wu

Wen-Fon Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip resistor and method for making the same
    Patent number: 8035476
    Abstract: The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance.
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: October 11, 2011
    Assignee: Yageo Corporation
    Inventors: Chih-Chung Yang, Wen-Fon Wu, Mei-Ling Lin, Wen-Cheng Wu, Tsai-Hu Chen, Wen-Hsing Kong
  • CHIP RESISTOR AND METHOD FOR MAKING THE SAME
    Publication number: 20100201477
    Abstract: The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance.
    Type: Application
    Filed: April 23, 2009
    Publication date: August 12, 2010
    Applicant: YAGEO CORPORATION
    Inventors: Chih-Chung Yang, Wen-Fon Wu, Mei-Ling Lin, Wen-Cheng Wu, Tsai-Hu Chen, Wen-Hsing Kong