Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: An invisible light blocking structure includes a first transparent substrate, a metal layer, a transparent protecting layer and an invisible light blocking unit. The first transparent substrate has a first bottom side and a first upper side. The metal layer is disposed on the first bottom side and has a first metal side facing away from the first transparent substrate. The first upper side faces away from the metal layer. The transparent protecting layer is disposed on the first metal side. The transparent protecting layer has a first protecting side facing away from the first transparent substrate. The invisible light blocking unit is disposed on at least one of a first protecting side and the first upper side. The invisible light blocking unit has cesium tungstate.

Abstract: A method for solar tracking and light collection is revealed. Two motors are used to control a light collector rotating in the north-south direction and a frame rotating in the east-west direction respectively to aim the light collector toward the sun for collecting sunlight all the times. The two motors work according to a path table produced by calculation of elevation angles and roll angles.

Abstract: An apparatus of solar cell module is provided. The apparatus is large-scaled. A supporting frame is combined with solar cell modules. Thus, the present invention can be easily installed; material cost is saved; and the cost spent on adjusting levelness of the solar cell modules can be reduced.

Abstract: A leveling device for concentrated photovoltaic (CPV) modules rapidly adjusts a height level of CPV modules on a tracking system. The device makes the CPV modules receive most sunlight for outputting maximum power. The device rapidly adjusts the height level of CPV modules, reduces number of nuts required and, thus, shortens the adjusting time even after the CPV modules are installed.

Abstract: An adjustable device for supporting a sun-tracking unit includes a framework and first and second supporting elements. The framework includes lower and upper portions. The lower portion of the framework includes two transverse long tubes and a longitudinal long tube for interconnecting the transverse long tubes. The upper portion of the framework includes two vertical tubes each extending from a related one of the transverse long tubes, two transverse short tubes each extending from a related one of the vertical tubes, and a longitudinal short tube for interconnecting the transverse short tubes. The first supporting element is connected to the transverse short tubes. The second supporting element is adjustably connected to the first supporting element.

Abstract: There is disclosed an apparatus for testing concentration-type solar cells. The apparatus includes a light source for emitting light, a focusing unit for focusing the light emitted from the light source and turning the same into a light beam, a testing unit for testing any one of solar cells of a wafer; and a wafer-positioning unit for moving the wafer horizontally and vertically, thus brining a targeted one of the solar cells into contact with the testing unit.

Abstract: There is disclosed an apparatus for testing concentration-type solar cells. The apparatus includes a light source for emitting light, a focusing unit for focusing the light emitted from the light source and turning the same into a light beam, a testing unit for testing any one of solar cells of a wafer; and a wafer-positioning unit for moving the wafer horizontally and vertically, thus brining a targeted one of the solar cells into contact with the testing unit.

Abstract: A solar tracker does not need to stand high. The solar tracker has a strong structure and a stable center of gravity for tracking sunlight. Thus, the solar tracker does not need a foundation to be connected for standing upon. And the solar tracker is fit to be used on a bare ground or roof with a low cost.

Abstract: A wire bonder suitable for wire bonding a chip disposed on a carrier and bonding pads of the carrier is provided. The wire bonder includes a stage, a heater plate, a compression plate, a pair of clamping bases, a pair of extended blocks and a capillary. The heater plate is disposed on the stage. The compression plate arranged above the heater plate is able to move upward or downward for compressing the carrier. The clamping bases are arranged at two opposite sides of the compression plate, wherein the length of the compression plate does not match with the distance between the clamping bases. A pair of extended blocks is connected to a pair of clamping bases at one end, respectively, and connected to the compression plate at the other. The capillary is arranged above the compression plate for forming the bonding wires electrically connecting the chip and the carrier.