Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a memory region and a logic region; forming a stack structure on the memory region and a gate structure on the logic region; forming a first cap layer on the stack structure and the gate structure; performing an oxidation process to form an oxide layer on the first cap layer; forming a second cap layer on the oxide layer; and removing part of the second cap layer, part of the oxide layer, and part of the first cap layer on the logic region to form a spacer adjacent to the gate structure.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a memory region and a logic region; forming a stack structure on the memory region and a gate structure on the logic region; forming a first cap layer on the stack structure and the gate structure; performing an oxidation process to form an oxide layer on the first cap layer; forming a second cap layer on the oxide layer; and removing part of the second cap layer, part of the oxide layer, and part of the first cap layer on the logic region to form a spacer adjacent to the gate structure.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a memory region and a logic region; forming a stack structure on the memory region and a gate structure on the logic region; forming a first cap layer on the stack structure and the gate structure; performing an oxidation process to form an oxide layer on the first cap layer; forming a second cap layer on the oxide layer; and removing part of the second cap layer, part of the oxide layer, and part of the first cap layer on the logic region to form a spacer adjacent to the gate structure.

Abstract: A method for fabricating semiconductor device includes the steps of: providing a substrate having a memory region and a logic region; forming a stack structure on the memory region and a gate structure on the logic region; forming a first cap layer on the stack structure and the gate structure; performing an oxidation process to form an oxide layer on the first cap layer; forming a second cap layer on the oxide layer; and removing part of the second cap layer, part of the oxide layer, and part of the first cap layer on the logic region to form a spacer adjacent to the gate structure.

Abstract: A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

Abstract: A touch substrate manufactured by three-dimensional printing and a method for manufacturing the same are disclosed. The method for manufacturing the touch substrate works together with a three-dimensional printer. The three-dimensional printer includes a first nozzle, a second nozzle, and a light source. The method includes the steps of: jetting a photocuring material by the first nozzle and exposing the photocuring material to the light source to form a base layer; jetting a conductive material on the base layer by the second nozzle and exposing the conductive material to the light source to form a touch electrode layer; and jetting the photocuring material on the base layer and the touch electrode layer by the first nozzle and exposing the photocuring material to the light source to form a protective layer. The touch electrode layer is embedded between the base layer and the protective layer.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.

Abstract: The present disclosure discloses a device having multiple printing layers and a printing method thereof, wherein said method comprises: seriatim stack-printing at least one printing layer on a protective substrate in an ascending order of size, wherein the protective substrate has an open surface exposed outward and a laminating surface laminated with a plate, and wherein the printing layer is printed on a part of the laminating surface and the closer the printing layer is to the laminating surface, the smaller area the printing layer has so as to reduce height difference between printing layers and make for the following lamination.

Abstract: The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.

Abstract: A multi-domain vertical alignment (MVA) liquid crystal display (LCD), including a first substrate and a second substrate, a common electrode, a number of pixel electrodes, a number of first switches and second switches, and liquid crystals (LCs). The common electrode is formed on one surface of the first substrate. The pixel electrodes are formed on a surface of the second substrate and are opposite to the common electrode. Each of the pixel electrodes includes a slit and a first sub-pixel electrode and a second sub-pixel electrode which are electrically isolated to each other by the slit. Each of the first switches is used for controlling corresponding first sub-pixel electrode, and each of the second switches is used for controlling corresponding second sub-pixel electrode. The liquid crystals (LCs) are sealed between the first substrate and the second substrate.

Abstract: A multi-domain vertical alignment (MVA) liquid crystal display (LCD), including a first substrate and a second substrate, a common electrode, a number of pixel electrodes, a number of first switches and second switches, and liquid crystals (LCs). The common electrode is formed on one surface of the first substrate. The pixel electrodes are formed on a surface of the second substrate and are opposite to the common electrode. Each of the pixel electrodes includes a slit and a first sub-pixel electrode and a second sub-pixel electrode which are electrically isolated to each other by the slit. Each of the first switches is used for controlling corresponding first sub-pixel electrode, and each of the second switches is used for controlling corresponding second sub-pixel electrode. The liquid crystals (LCs) are sealed between the first substrate and the second substrate.

Abstract: To control a switch device using a mobile terminal, the owner of the mobile terminal stores caller identification data that includes call numbers associated with an authorized caller group, and switching control identification data associated with predetermined ring tone parameters. During activation of the mobile terminal, the mobile terminal establishes a communications link with a communications network. When caller data associated with an incoming call received by the mobile terminal matches the pre-stored caller identification data while, upon termination of the incoming call, the characteristics of ring tones generated by the incoming call match one of the predetermined ring tone parameters, the switch device is switched to a desired mode in response to a control signal outputted by the mobile terminal and associated with the switching control identification data that corresponds to the matching predetermined ring tone parameter.