Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.

Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.

Abstract: A catheter for guiding a body fluid of a subject includes an elongated body, an adjusting mechanism, and a valve mechanism. Moreover, the elongated body further includes a first portion, a second portion and a flexible portion between the first and the second portions. The second portion includes a passageway for the body liquid. The valve mechanism closes to the inlet of the passageway. Furthermore, the flexible portion expands when the adjusting mechanism is in a first state to prevent the catheter from being removed from the subject, and the flexible portion retracts when the adjusting mechanism alters to a second state to allow the catheter to be removed from or inserted into the subject. Hence, the body fluid is directed to enter the passageway via the inlet and exit via the outlet when the adjusting mechanism is not in the second state.

Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.

Abstract: A device having color resists pattern and method for manufacturing are disclosed. The device includes a substrate, at least two color resist layers. The at least color resist layers are formed on the curved and construct a visible pattern, wherein at a boundary of the color resist pattern, the at least two color resist layers form a ramp structure and each of the at least two color resist layers contacts the substrate; and the ramp structure is formed in sequential order by one exposure process, one removal process and one baking process of the at least two color resist layers.

Abstract: The disclosure illustrates a curve-shaped mask, a curved device having color resist pattern and method for manufacturing the same. The curved device includes a curved substrate and at least two color resist layers. The at least two color resist layers are formed on the curved substrate, and construct a visible pattern together. The curved device is manufactured by a curve-shaped mask, which is a metal-containing material layer formed on the curved substrate and is visible.

Abstract: A thin-film mask, fitting aids, fitting and exposure assistant device and fitting method for the thin-film mask paste on a curved substrate is disclosed. The disclosure uses the fitting aids to apply pressure on the thin-film mask to paste on the curved substrate. After the template device had formed, send the template device to the exposure machine, and the high resolution color photoresist pattern is made on the curved substrate.

Abstract: A device having color resists pattern and method for manufacturing are disclosed. The device includes a substrate, at least two color resist layers. The at least color resist layers are formed on the curved and construct a visible pattern.

Abstract: The disclosure illustrates a curve-shaped mask, a curved device having color resist pattern and method for manufacturing the same. The curved device includes a curved substrate and at least two color resist layers. The at least two color resist layers are formed on the curved substrate, and construct a visible pattern together.