Abstract: A method of manufacturing a semiconductor structure including the following steps is provided. A substrate is provided. The substrate has a first region and a second region. A stacked structure is formed on the substrate in the first region. The stacked structure includes a first dielectric layer, a charge storage layer, a second dielectric layer, a first conductive layer, and a first hard mask layer. A dielectric material layer is formed on the substrate in the second region. A second conductive layer is formed on the dielectric material layer in the second region. A first patterned photoresist layer is formed. The first hard mask layer exposed by the first patterned photoresist layer and a portion of the dielectric material layer exposed by the first patterned photoresist layer are removed by using the first patterned photoresist layer as a mask.

Abstract: A manufacturing method of a semiconductor structure is provided. The manufacturing method of the semiconductor structure includes the following steps: providing a semiconductor substrate, wherein the semiconductor substrate has a first region and a second region surrounding the first region; forming a gate stack and a dummy gate stack in the first region, wherein the dummy gate stack surrounds the gate stack; forming an oxide layer on an exterior wall and a top surface of the dummy gate stack; forming a dummy conductive layer on the gate stack, the dummy gate stack and the oxide layer, wherein the dummy conductive layer has a concave bowl-shaped top surface in the first region; and performing a chemical mechanical polishing (CMP) process on the dummy conductive layer.

Abstract: The invention discloses a novel LED support structure, including a metal support terminal; an LED chip fixed on the metal support terminal; a bonding wire for connecting the surface of the metal support terminal with the LED chip; and a packaging adhesive for protecting the LED chip. The invention further includes a plastic material covered on the surface of the metal support terminal; and a plastic material reflector cup for coating the metal support terminal. The metal support terminal includes a metal pin embedded in the plastic material reflector cup and a metal tube pin disposed outside the plastic material reflector cup, wherein the metal pin is provided with a functional zone and a non-functional zone.

Abstract: Streaming audio is adjusted within one or more real-time digital signal processors (DSPs) by entering audio adjustment parameters using a smart phone application on a Bluetooth® enabled smart phone, receiving streaming audio from a Cloud server, and transmitting the adjustment parameters and streaming audio to a Bluetooth® chip in an audio system. The audio adjustment parameters and streaming audio then enter two real-time DSPs where the streaming audio is adjusted according to the audio adjustment parameters and then sent to amplifiers and/or transceivers. The application enables entry of lighting parameters for control of a plurality of RGB LEDS and one or more LED fixtures. The lighting parameters are transmitted to the Bluetooth® chip and adjustments are made, within the Bluetooth® chip, to the lighting control signals based on the lighting parameters, the streaming audio, and by adjusted streaming audio provided by at least one transceiver.

Abstract: Streaming audio is adjusted within one or more real-time digital signal processors (DSPs) by entering audio adjustment parameters using a smart phone application on a Bluetooth® enabled smart phone, receiving streaming audio from a Cloud server, and transmitting the adjustment parameters and streaming audio to a Bluetooth® chip in an audio system. The audio adjustment parameters and streaming audio then enter two real-time DSPs where the streaming audio is adjusted according to the audio adjustment parameters and then sent to amplifiers and/or transceivers. The application enables entry of lighting parameters for control of a plurality of RGB LEDS and one or more LED fixtures. The lighting parameters are transmitted to the Bluetooth® chip and adjustments are made, within the Bluetooth® chip, to the lighting control signals based on the lighting parameters, the streaming audio, and by adjusted streaming audio provided by at least one transceiver.

Abstract: Techniques to generate data models for an item master having a number of items. Each item is associated with a number of attributes and each attribute is associated with a set of values. In one method, the items in the item master are initially classified into a number of pagesets, with each pageset being defined by a unique combination of values for a first set of (classification) attributes. For each pageset, a second set of (selectable) attributes is determined to uniquely identify the items in the pageset. The selectable attributes may be selected from a list of candidate attributes, which may include mandatory attributes designated to be used as selectable attributes and optional attributes that may be selected for use. Data models are generated for each pageset based in part on the selectable attributes, and include a set of tables descriptive of the items in the pageset.

Abstract: An LED driving circuit that is directly activated by an AC power supply is disclosed. A driving circuit has a first and second pair of opposite branches. The first pair of opposite branches operates in a positive half cycle of the AC power supply and the second pair of branches operates in a negative half cycle of the AC power supply, so the lighting time for each LED is less than a half cycle time, in other words, the time for heat dissipation is prolonged.

Abstract: An LED driving circuit that is directly activated by an AC power supply is disclosed. A driving circuit has a first and second pair of opposite branches. The first pair of opposite branches operates in a positive half cycle of the AC power supply and the second pair of branches operates in a negative half cycle of the AC power supply, so the lighting time for each LED is less than a half cycle time, in other words, the time for heat dissipation is prolonged.