Patents by Inventor Wen H. Hsieh

Wen H. Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6806593
    Abstract: An electret formed by micro-machining technology on a support surface, including a self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. The electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×10−5 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge. An open circuit sensitivity of about 0.5 mV/Pa has been achieved for a hybrid microphone package.
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: October 19, 2004
    Assignee: California Institute of Technology
    Inventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh
  • Publication number: 20010033670
    Abstract: An electret formed by micro-machining technology on a support surface, including a self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. The electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×10−5 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge. An open circuit sensitivity of about 0.5 mV/Pa has been achieved for a hybrid microphone package.
    Type: Application
    Filed: May 15, 2001
    Publication date: October 25, 2001
    Applicant: California Institute of Technology a California Institute of Technology
    Inventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh
  • Patent number: 6243474
    Abstract: A small, inexpensive, high quality electret formed by micro-machining technology on a support surface, and further including a small, inexpensive, high quality, self-powered electret sound transducer, preferably in the form of a microphone, formed by micro-machining technology. Each microphone is manufactured as a two-piece unit, comprising a microphone membrane unit and a microphone back plate, at least one of which includes an electret formed by micro-machining technology. When juxtaposed, the two units form a highly reliable, inexpensive microphone that can produce a signal without the need for external biasing, thereby reducing system volume and complexity. In the preferred embodiment, the electret material used is a thin film of spin-on polytetrafluoroethylene (PTFE). An electron gun preferably is used for charge implantation. The electret has a saturated charged density in the range of about 2×105 C/m2 to about 8×10−4 C/m2. Thermal annealing is used to stabilize the implanted charge.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: June 5, 2001
    Assignee: California Institute of Technology
    Inventors: Yu-Chong Tai, Tseng-Yang Hsu, Wen H. Hsieh