Abstract: A display module includes a display panel, a stress buffer layer, a protective layer and a first light-shielding layer. The display panel includes a planar area and a curved surface area. The stress buffer layer is disposed on a light exit side of the display panel and opposite to the planar area and part of the curved surface area. The protective layer is disposed on a surface of the stress buffer layer away from the display panel, and includes a planar portion opposite to the planar area and a curved portion opposite to the curved surface area. The first light-shielding layer is disposed in the stress buffer layer or between the stress buffer layer and the display panel, and is opposite to part of the curved portion. An edge of the first light-shielding layer is aligned with an edge of the stress buffer layer.

Abstract: A semiconductor device and method of manufacturing that includes a first etch stop layer and a second etch stop layer to prevent delamination and damage to underlying components. A first passivation layer and a second passivation layer are disposed on a substrate, with a metal pad exposed through the passivation layers and contacting a top metal component of the substrate. The first etch stop layer is then formed on the second passivation layer and the metal pad. A third passivation layer is then formed on the substrate with an opening to the metal pad, which is covered by the first etch stop layer. The second etch stop layer is then formed on the third passivation layer and in the opening on the second etch stop layer. A bottom metal film/conductive component is then formed on the second etch stop layer, photoresist is applied, and wet etching is performed. The metal pad is protected from damage caused by delamination of the second etch stop layer by the first etch stop layer.

Abstract: A camera mount, comprising: a base and a bottom. The bottom is movably connected to the base. The bottom includes recesses configured to receive flexible fasteners. The bottom and the base are movable to a closed position where the recesses are inaccessible and the flexible fasteners are held between the base and the bottom and an open position where the recesses are exposed so that the flexible fasteners are at least one of insertable, removable, or interchangeable.

Abstract: There is provided an imaging system including a camera and a control host. The camera identifies ambient light intensity and performs trigger event detection in a low power mode. When the camera detects a trigger event in the low power mode, the control host is woken up. The camera also determines an exposure mode according the ambient light intensity and informs the exposure mode to the control host such that an operating mode of the control host after being woken up matches the exposure mode of the camera.

Abstract: A display panel and a display device are disclosed in the present application. The display panel further includes a panel body, a back plate, and a bending protecting layer. The panel body includes a display portion, and the display portion is located in a planar display area and a curved display area. The back plate is provided on a side of the display portion and in the planar display area and the curved display area. The bending protecting layer is disposed on a side of the back plate away from the display portion and at least in the corner curved sub-area. Material of the bending protecting layer includes a plastic metal material.

Abstract: A camera housing includes a first surface and a second surface noncoplanar with the first surface. A first interconnect mechanism is coupled to the first surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the first interconnect mechanism extend parallel to the first surface. In the extended position, the protrusions of the first interconnect mechanism extend in a perpendicular manner away from the first surface. A second interconnect mechanism is coupled to the second surface and rotatable between a collapsed position and an extended position. In the collapsed position, protrusions of the second interconnect mechanism include coplanar surfaces and extend adjacent to the second surface. In the extended position, the protrusions of the second interconnect mechanism extend in a perpendicular manner away from the second surface.

Abstract: An illuminated keyboard includes a metal plate, an illuminated module, and an insulating heat-pressing sheet. The metal plate has an upper surface and a lower surface opposite to each other. The illuminated module includes a circuit structure and a plurality of illuminated elements, wherein the circuit structure has an upper surface and a lower surface opposite to each other, a substrate and a circuit formed on the substrate. The plurality of illuminated elements is electrically connected to the circuit. The insulating heat-pressing sheet is placed between the circuit structure and the metal plate, wherein the circuit structure is attached to either the upper surface or the lower surface of the metal plate through the insulating heat-pressing sheet.

Abstract: An elastic electrical contact device and a contact conductor are introduced. The elastic electrical contact device includes two contact conductors. Each contact conductor includes a head and an electrical contact portion integrally connected with each other. The electrical contact portion has a cross section shaped as a curved bend and has a guide groove formed thereon. The electrical contact portion is bilaterally symmetrical along a second central axis, wherein a first central axis and the second central axis are parallel to each other and non-coaxial. The electrical contact portions of the two contact conductors are disposed to have openings thereof face each other and are mutually connected in respective guide grooves, are mutually slidable to extend and retract relative to each other, and are sleeved by an elastic reset member to enable the two contact conductors to be elastically reset when extending and retracting relative to each other.

Abstract: Oligonucleotides are provided herein that inhibit apolipoprotein(a) (LPA) expression. Also provided are compositions including the same and uses thereof, particularly uses relating to treating diseases, disorders and/or conditions associated with LPA expression.

Abstract: A semiconductor device includes a device layer, a first passivation layer, an aluminum pad, a second passivation layer, an under-ball metallurgy (UBM) pad and a connector. The device layer is disposed over a substrate, wherein the device layer includes a top metal feature. The first passivation layer is disposed over the device layer. The aluminum pad penetrates through the first passivation layer and is electrically connected to the top metal feature. The second passivation layer is disposed over the aluminum pad. The UBM pad penetrates through the second passivation layer and is electrically connected to the aluminum pad. The connector is disposed over the UBM pad. In some embodiments, a first included angle between a sidewall and a bottom of the aluminum pad is greater than a second included angle between a sidewall and a bottom of the UBM pad.

Abstract: Oligonucleotides and compositions including the same are disclosed for inhibiting or reducing apolipoprotein C-III (APOC3) gene expression. Methods of making and using the oligonucleotides also are disclosed, particularly uses relating to treating diseases, disorders and/or conditions associated with APOC3 expression.

Abstract: The present application provides a foldable display module and a foldable display device. The foldable display module includes a foldable region and a non-foldable region adjacent to the foldable region, and further includes a display main body structure and a glass substrate. The glass substrate is disposed on a back side of a light emitting surface of the display main body structure, and a thickness of a portion of the glass substrate corresponding to the foldable region is less than or equal to 100 microns.

Abstract: A quantum charge-coupled device including a first ion, a second ion, a fixed ion trap, an adjustable ion trap, and an excitation light source is provided. The fixed ion trap is configured to stationarily trap the first ion. The adjustable ion trap works as an ion rail disposed beside the fixed ion trap, wherein the ion rail is configured to make the second ion move at a constant velocity along the ion rail. The excitation light source is configured to irradiate an incident light beam. The incident light beam includes a series of light pulses and covers the first ion and the second ion when a distance between them becomes less than or equal to a proximity range, such that a quantum entangled state is directly built between the first ion and the second ion in uniform motion.

Abstract: A magnetic component assembly and a manufacturing method thereof are disclosed. The magnetic component assembly includes a magnetic component and a peripheral structure. The magnetic component includes a magnetic core and a winding. The winding is embedded in the magnetic core, and passes through the top surface or the bottom surface of the magnetic core to form a pin. The peripheral structure is disposed adjacent to a peripheral side of the magnetic core. The magnetic component and the peripheral structure are combined to form a magnetic assembling body. The manufacturing method thereof includes a step of thinning the top surface or the bottom surface of the magnetic assembling body through a thinning process. The manufacturing method thereof includes another step of thinning the top surface or the bottom surface of the magnetic core through a thinning process, or thinning the pin through the thinning process.

Abstract: The present disclosure provides a flexible display device. A first supporting assembly and a second supporting assembly are configured to slide relatively to provide a supporting surface with variable area to a flexible display module. A limiting mechanism includes a limiting rotor and a limiting groove, wherein the limiting rotor is rotatably connected to the first supporting assembly, the limiting groove is defined in the second supporting assembly, and the limiting rotor is engaged with the limiting groove when an area of the supporting surface is a predetermined area.

Abstract: A method of an image sensor circuit includes: providing an event camera comprising at least one pixel unit; using the event camera to sense at least one current pixel value of the at least one pixel unit to detect whether at least one pixel value changes; when the at least one pixel value changes, using the event camera to trigger the digital processing circuit when the digital processing circuit is in a power saving mode and transmit information of the at least one pixel value to the digital processing circuit.

Abstract: A device includes a substrate, a first conductive layer on the substrate, a first conductive via, and further conductive layers and conductive vias between the first conductive via and the substrate. The first conductive via is between the substrate and the first conductive layer, and is electrically connected to the first conductive layer. The first conductive via extends through at least two dielectric layers, and has thickness greater than about 8 kilo-Angstroms. An inductor having high quality factor is formed in the first conductive layer and also includes the first conductive via.

Abstract: A method for manufacturing a semiconductor device includes: forming a transistor on a semiconductor substrate, in which the transistor includes a gate structure and a source/drain structure; forming a patterned dielectric layer on the semiconductor substrate, in which the patterned dielectric layer includes an opening extending from a top surface of the patterned dielectric layer to a top surface of the source/drain structure; forming a dielectric contact spacer to cover a sidewall of the opening; and forming a conductive contact in the opening such that the conductive contact is connected to the source/drain structure and is isolated from the gate structure by the dielectric contact spacer and the patterned dielectric layer.