Patents by Inventor Wen Han
Wen Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12292183Abstract: An illuminated keyboard includes a metal plate, an illuminated module, and an insulating heat-pressing sheet. The metal plate has an upper surface and a lower surface opposite to each other. The illuminated module includes a circuit structure and a plurality of illuminated elements, wherein the circuit structure has an upper surface and a lower surface opposite to each other, a substrate and a circuit formed on the substrate. The plurality of illuminated elements is electrically connected to the circuit. The insulating heat-pressing sheet is placed between the circuit structure and the metal plate, wherein the circuit structure is attached to either the upper surface or the lower surface of the metal plate through the insulating heat-pressing sheet.Type: GrantFiled: May 2, 2024Date of Patent: May 6, 2025Assignee: CHICONY ELECTRONICS CO., LTD.Inventors: Wen-Han Chang, Chao-Chin Hsieh
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Patent number: 12259406Abstract: An elastic electrical contact device and a contact conductor are introduced. The elastic electrical contact device includes two contact conductors. Each contact conductor includes a head and an electrical contact portion integrally connected with each other. The electrical contact portion has a cross section shaped as a curved bend and has a guide groove formed thereon. The electrical contact portion is bilaterally symmetrical along a second central axis, wherein a first central axis and the second central axis are parallel to each other and non-coaxial. The electrical contact portions of the two contact conductors are disposed to have openings thereof face each other and are mutually connected in respective guide grooves, are mutually slidable to extend and retract relative to each other, and are sleeved by an elastic reset member to enable the two contact conductors to be elastically reset when extending and retracting relative to each other.Type: GrantFiled: March 1, 2023Date of Patent: March 25, 2025Assignee: SUNLIT PRECISION TECHNOLOGY CO., LTD.Inventor: Wen-Han Liu
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Patent number: 12252691Abstract: Oligonucleotides are provided herein that inhibit apolipoprotein(a) (LPA) expression. Also provided are compositions including the same and uses thereof, particularly uses relating to treating diseases, disorders and/or conditions associated with LPA expression.Type: GrantFiled: August 16, 2024Date of Patent: March 18, 2025Assignee: Dicerna Pharmaceuticals, Inc.Inventors: Bob Dale Brown, Henryk T. Dudek, Marc Abrams, Wen Han, Anton Turanov
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Patent number: 12237282Abstract: A semiconductor device includes a device layer, a first passivation layer, an aluminum pad, a second passivation layer, an under-ball metallurgy (UBM) pad and a connector. The device layer is disposed over a substrate, wherein the device layer includes a top metal feature. The first passivation layer is disposed over the device layer. The aluminum pad penetrates through the first passivation layer and is electrically connected to the top metal feature. The second passivation layer is disposed over the aluminum pad. The UBM pad penetrates through the second passivation layer and is electrically connected to the aluminum pad. The connector is disposed over the UBM pad. In some embodiments, a first included angle between a sidewall and a bottom of the aluminum pad is greater than a second included angle between a sidewall and a bottom of the UBM pad.Type: GrantFiled: May 6, 2022Date of Patent: February 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Huan Fu, Ying-Tsung Chen, Jiun-Jie Huang, Wen-Han Hung, Jen-Pan Wang
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Patent number: 12234456Abstract: Oligonucleotides and compositions including the same are disclosed for inhibiting or reducing apolipoprotein C-III (APOC3) gene expression. Methods of making and using the oligonucleotides also are disclosed, particularly uses relating to treating diseases, disorders and/or conditions associated with APOC3 expression.Type: GrantFiled: December 1, 2022Date of Patent: February 25, 2025Assignee: Dicerna Pharmaceuticals, Inc.Inventors: Bob Dale Brown, Henryk Dudek, Utsav Saxena, Wen Han
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Publication number: 20250048914Abstract: The present application provides a foldable display module and a foldable display device. The foldable display module includes a foldable region and a non-foldable region adjacent to the foldable region, and further includes a display main body structure and a glass substrate. The glass substrate is disposed on a back side of a light emitting surface of the display main body structure, and a thickness of a portion of the glass substrate corresponding to the foldable region is less than or equal to 100 microns.Type: ApplicationFiled: May 12, 2023Publication date: February 6, 2025Applicant: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventor: Wen HAN
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Patent number: 12217134Abstract: A quantum charge-coupled device including a first ion, a second ion, a fixed ion trap, an adjustable ion trap, and an excitation light source is provided. The fixed ion trap is configured to stationarily trap the first ion. The adjustable ion trap works as an ion rail disposed beside the fixed ion trap, wherein the ion rail is configured to make the second ion move at a constant velocity along the ion rail. The excitation light source is configured to irradiate an incident light beam. The incident light beam includes a series of light pulses and covers the first ion and the second ion when a distance between them becomes less than or equal to a proximity range, such that a quantum entangled state is directly built between the first ion and the second ion in uniform motion.Type: GrantFiled: November 24, 2022Date of Patent: February 4, 2025Assignee: National Taiwan UniversityInventors: Guin-Dar Lin, Wen-Han Png
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Publication number: 20250029764Abstract: A magnetic component assembly and a manufacturing method thereof are disclosed. The magnetic component assembly includes a magnetic component and a peripheral structure. The magnetic component includes a magnetic core and a winding. The winding is embedded in the magnetic core, and passes through the top surface or the bottom surface of the magnetic core to form a pin. The peripheral structure is disposed adjacent to a peripheral side of the magnetic core. The magnetic component and the peripheral structure are combined to form a magnetic assembling body. The manufacturing method thereof includes a step of thinning the top surface or the bottom surface of the magnetic assembling body through a thinning process. The manufacturing method thereof includes another step of thinning the top surface or the bottom surface of the magnetic core through a thinning process, or thinning the pin through the thinning process.Type: ApplicationFiled: April 23, 2024Publication date: January 23, 2025Inventors: Quanguang Chen, Jinping Zhou, Min Zhou, Wen Han, Ganyu Zhou
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Patent number: 12207024Abstract: A method of an image sensor circuit includes: providing an event camera comprising at least one pixel unit; using the event camera to sense at least one current pixel value of the at least one pixel unit to detect whether at least one pixel value changes; when the at least one pixel value changes, using the event camera to trigger the digital processing circuit when the digital processing circuit is in a power saving mode and transmit information of the at least one pixel value to the digital processing circuit.Type: GrantFiled: February 20, 2023Date of Patent: January 21, 2025Assignee: PixArt Imaging Inc.Inventors: Chih-Huan Wu, Wen-Han Yao
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Patent number: 12204377Abstract: The present disclosure provides a flexible display device. A first supporting assembly and a second supporting assembly are configured to slide relatively to provide a supporting surface with variable area to a flexible display module. A limiting mechanism includes a limiting rotor and a limiting groove, wherein the limiting rotor is rotatably connected to the first supporting assembly, the limiting groove is defined in the second supporting assembly, and the limiting rotor is engaged with the limiting groove when an area of the supporting surface is a predetermined area.Type: GrantFiled: January 31, 2024Date of Patent: January 21, 2025Assignee: WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.Inventors: Wen Han, Zhuo Zhang
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Patent number: 12199033Abstract: A device includes a substrate, a first conductive layer on the substrate, a first conductive via, and further conductive layers and conductive vias between the first conductive via and the substrate. The first conductive via is between the substrate and the first conductive layer, and is electrically connected to the first conductive layer. The first conductive via extends through at least two dielectric layers, and has thickness greater than about 8 kilo-Angstroms. An inductor having high quality factor is formed in the first conductive layer and also includes the first conductive via.Type: GrantFiled: March 7, 2023Date of Patent: January 14, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Hung Hsun Lin, Wei-Chun Hua, Wen-Chu Huang, Yen-Yu Chen, Che-Chih Hsu, Chinyu Su, Wen Han Hung
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Publication number: 20250015153Abstract: A method for manufacturing a semiconductor device includes: forming a transistor on a semiconductor substrate, in which the transistor includes a gate structure and a source/drain structure; forming a patterned dielectric layer on the semiconductor substrate, in which the patterned dielectric layer includes an opening extending from a top surface of the patterned dielectric layer to a top surface of the source/drain structure; forming a dielectric contact spacer to cover a sidewall of the opening; and forming a conductive contact in the opening such that the conductive contact is connected to the source/drain structure and is isolated from the gate structure by the dielectric contact spacer and the patterned dielectric layer.Type: ApplicationFiled: July 5, 2023Publication date: January 9, 2025Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Guo-Zhou HUANG, Huan-Kuan SU, Wen Han HUNG, Ling-Sung WANG
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Patent number: 12189427Abstract: A display panel and a display device are provided. The display panel includes a panel body and a support plate. A plurality of groove sets are provided on the support plate. Each groove set includes a plurality of grooves. An area of one of any two adjacent groove sets that is away from the bending center line is greater than an area of the other groove set close to a bending center line. An arrangement density of the grooves in the groove set away from the bending center line is greater than an arrangement density of the grooves in the other groove set close to the bending center line.Type: GrantFiled: August 6, 2021Date of Patent: January 7, 2025Assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Wen Han, Hwajin Oh
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Patent number: 12187834Abstract: Disclosed herein are hydrogel compositions comprising a triblock copolymer having a formula A-B-A, wherein A is a polycaprolactone (PCL) block or a polyvalerolactone (PVL) block and B is a polyethylene glycol (PEG) block. Also disclosed are methods of making a hydrogel comprising providing a photoinitiator and a triblock copolymer having a formula A-B-A, wherein the triblock copolymer comprises one or more ethylenically unsaturated moieties; and photocrosslinking the triblock copolymer, thereby forming a hydrogel.Type: GrantFiled: December 13, 2023Date of Patent: January 7, 2025Assignees: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM, NORTHEASTERN UNIVERSITYInventors: Yi Hong, Guohao Dai, Cancan Xu, Wen-han Lee
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Publication number: 20240401794Abstract: An illuminated keyboard includes a metal plate, an illuminated module, and an insulating heat-pressing sheet. The metal plate has an upper surface and a lower surface opposite to each other. The illuminated module includes a circuit structure and a plurality of illuminated elements, wherein the circuit structure has an upper surface and a lower surface opposite to each other, a substrate and a circuit formed on the substrate. The plurality of illuminated elements is electrically connected to the circuit. The insulating heat-pressing sheet is placed between the circuit structure and the metal plate, wherein the circuit structure is attached to either the upper surface or the lower surface of the metal plate through the insulating heat-pressing sheet.Type: ApplicationFiled: May 2, 2024Publication date: December 5, 2024Inventors: WEN-HAN CHANG, CHAO-CHIN HSIEH
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Publication number: 20240401053Abstract: Oligonucleotides are provided herein that inhibit apolipoprotein (a) (LPA) expression. Also provided are compositions including the same and uses thereof, particularly uses relating to treating diseases, disorders and/or conditions associated with LPA expression.Type: ApplicationFiled: August 16, 2024Publication date: December 5, 2024Inventors: Bob Dale Brown, Henryk T. Dudek, Marc Abrams, Wen Han, Anton Turanov
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Publication number: 20240394832Abstract: An image down-sampling method, for down-sampling a sensing image comprising a plurality of first pixels and a plurality of second pixels which are alternatively arranged, comprising: generating a first output pixel value according to at least one pixel value of at least one of the first pixel in a first down-sampling group; wherein the first down-sampling group comprises an odd number of pixels. By this way, the saw-tooth image issue in prior art may be improved. If the image down-sampling method is applied to a surveillance camera, the accuracy of event detection of the surveillance camera may be increased.Type: ApplicationFiled: March 24, 2024Publication date: November 28, 2024Applicant: PixArt Imaging Inc.Inventor: Wen-Han Yao
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Publication number: 20240387272Abstract: A method for forming a semiconductor device. The method includes performing a first etching process to define one or more fins and corresponding device isolation structures on a substrate. The method further includes forming an enhancement layer on each of the fins, such that the enhancement layer encapsulates each fin. The method further performs a second etching process to remove one or more of the fins, and performs a third etching process to remove a portion of the enhancement layer. The method also includes depositing an STI material on the fins and the device isolation structures, followed by recessing the fins relative to the STI material.Type: ApplicationFiled: May 16, 2023Publication date: November 21, 2024Inventors: Zhen-Nong Wu, Mao-Chia Wang, Jia-Ren Chen, Li-Yi Chen, Wen Han Hung, Che-Li Lin, Yen-Ning Chen
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Patent number: D1061682Type: GrantFiled: August 4, 2022Date of Patent: February 11, 2025Assignee: GoPro, Inc.Inventors: Bessy Wen-Han Liang, Huy Phuong Nguyen, Akshay Shinde
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Patent number: D1069539Type: GrantFiled: August 10, 2022Date of Patent: April 8, 2025Assignee: GoPro, Inc.Inventors: Bessy Wen-Han Liang, Huy Phuong Nguyen, Nicholas D. Woodman