Patents by Inventor Wen-Han Chen

Wen-Han Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230119904
    Abstract: The invention provides an iron-based metallic glass alloy powder including: Fe as the main component; a metalloid element group including Si, B, and C; a small amount of Mo to improve the degree-of-supercooling; and the addition of Cr and Ni to increase corrosion resistance, where the total amount of the metalloid element group, the amount of the degree-of-supercooling improvement element and the total amount of the elements to increase corrosion resistance are set within predetermined ranges.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 20, 2023
    Inventors: Wen-Han CHEN, Yen Shan TUNG, Chien-Hung YEH, Chang-Fu WANG, Leu-Wen TSAY
  • Patent number: 10489335
    Abstract: The invention introduces an apparatus for accessing a memory card to at least include a host interface and a processing unit. The processing unit is arranged to operably inspect whether a logical block length utilized in a memory card inserted into a card reader can be supported by a host; and reply to the host with sense data that advises the host not to perform a subsequent write into the memory card through the host interface in response to a request sense command when the logical block length utilized in the memory card cannot be supported by the host.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: November 26, 2019
    Assignee: SILICON MOTION, INC.
    Inventors: Wen-Han Chen, Hsing-Lang Huang, Guo-Rung Huang
  • Publication number: 20080035323
    Abstract: The present invention provides an internal and external connecting liquid cooled heat sink device, which includes a holding case, a water tank facility, a heat dissipating unit, pipes and a water cooled head. The holding case retains the water tank facility and the heat dissipating unit connected in series using the pipes. The pipes are connected to a water cooled head to enable circulating and dissipating of heat. The holding case can be removable inserted into a retaining slot of a host computer or independently connected to an outer case of the host computer. Moreover, a plurality of through holes are defined in each heat dissipating fin of a liquid cooled exchange device, thereby enabling the heat dissipating unit to effectively achieve increased heat dissipation effectiveness when circulating and dissipating heat.
    Type: Application
    Filed: August 11, 2006
    Publication date: February 14, 2008
    Inventor: Wen-Han Chen
  • Publication number: 20070215324
    Abstract: A liquid-cooled heat dissipater is composed of a fin, a substrate, and a plurality of screwing members. One or more than one interconnected grooves are concaved on a surface at one side of the fin, and are connected to a liquid inlet junction and a liquid outlet junction on the substrate, respectively. Accordingly, a heat exchange of the liquid between the liquid inlet junction and the liquid outlet junction can be performed through the grooves of fin, so as form a narrow and thin shape of entire heat dissipater, thereby achieving a function of space saving.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Inventor: Wen-Han Chen
  • Publication number: 20070047203
    Abstract: The invention provides an integral liquid cooling computer housing including a computer housing, which is provided with an accommodating platform and a movable cover at one side thereof. Component devices of a liquid cooling system are installed to the accommodating platform without needing additional space outside the computer housing for fully utilizing available space as well as giving an appealing appearance. The movable cover is for covering the accommodating platform for concealing or exposing the accommodating platform, and for shielding against noises, thereby facilitating installation thereof and minimizing usage noises. The movable cover is configured with a plurality of ventilation holes for a liquid cooling system installed to the accommodating platform to discharge hot air out of the computer housing, thereby obtaining optimal heat dissipating effects.
    Type: Application
    Filed: August 31, 2005
    Publication date: March 1, 2007
    Inventor: Wen-Han Chen