Patents by Inventor Wen-Han TAN

Wen-Han TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer container and method for holding wafer
    Patent number: 11315815
    Abstract: A wafer container includes at least one shelf and a frame. The shelf is capable of holding at least one wafer, and has at least one opening therein. The opening is at least partially exposed by the wafer when the wafer is hold by the shelf. The frame carries the shelf and allows access to the shelf.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: April 26, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Hsun Tseng, Yan-Hong Liu, Wen-Han Tan, Hung-Wen Chen
  • WAFER CONTAINER AND METHOD FOR HOLDING WAFER
    Publication number: 20170194180
    Abstract: A wafer container includes at least one shelf and a frame. The shelf is capable of holding at least one wafer, and has at least one opening therein. The opening is at least partially exposed by the wafer when the wafer is hold by the shelf. The frame carries the shelf and allows access to the shelf.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 6, 2017
    Inventors: Po-Hsun TSENG, Yan-Hong LIU, Wen-Han TAN, Hung-Wen CHEN
  • Mechanisms for forming protection layer on back side of wafer
    Patent number: 9425084
    Abstract: Embodiments of mechanisms of forming a semiconductor device structure are provided. The semiconductor device structure is provided. The semiconductor device structure includes a substrate having a front side and a back side. The semiconductor device structure also includes devices formed on the front side of the substrate and interconnect structures formed on the devices. The semiconductor device structure further includes a protection layer formed on the back side of the substrate, and the protection layer has a thickness over about 10 A.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: August 23, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Shyang Tsai, Wen-Han Tan, Wen-Lung Ho
  • MECHANISMS FOR FORMING PROTECTION LAYER ON BACK SIDE OF WAFER
    Publication number: 20150108633
    Abstract: Embodiments of mechanisms of forming a semiconductor device structure are provided. The semiconductor device structure is provided. The semiconductor device structure includes a substrate having a front side and a back side. The semiconductor device structure also includes devices formed on the front side of the substrate and interconnect structures formed on the devices. The semiconductor device structure further includes a protection layer formed on the back side of the substrate, and the protection layer has a thickness over about 10 A.
    Type: Application
    Filed: October 17, 2013
    Publication date: April 23, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Shyang TSAI, Wen-Han TAN, Wen-Lung HO