Abstract: A device includes: a substrate having a semiconductor fin; a stack of semiconductor channels on the substrate and positioned over the fin; a gate structure wrapping around the semiconductor channels; a source/drain abutting the semiconductor channels; an inner spacer positioned between the stack of semiconductor channels and the fin; an undoped semiconductor layer vertically adjacent the source/drain and laterally adjacent the fin; and an isolation structure that laterally surrounds the undoped semiconductor layer, the isolation structure being between the source/drain and the inner spacer.

Abstract: Semiconductor structures and methods of forming the same are provided. In an embodiment, an exemplary semiconductor structure includes a first transistor. The first transistor includes a first gate structure wrapping around a plurality of first nanostructures disposed over a substrate, a first source/drain feature electrically coupled to a topmost nanostructure of the plurality of first nanostructures and isolated from a bottommost nanostructure of the plurality of first nanostructures by a first dielectric layer, and a first semiconductor layer disposed between the substrate and the first source/drain feature, wherein the first source/drain feature is in direct contact with a top surface of the first semiconductor layer.

Abstract: The disclosure provides a viewing angle control module including a first liquid crystal panel, a first polarizer, a second polarizer, and a phase retarder. The first liquid crystal panel includes a first substrate, a second substrate, a first alignment layer, a second alignment layer, a first liquid crystal layer, a first electrode layer, and a second electrode layer. A second alignment direction of the second alignment layer is antiparallel to a first alignment direction of the first alignment layer. The first electrode layer has multiple electrode patterns arranged at intervals along a first direction and extending along a second direction. A first absorption axis of the first polarizer is perpendicular to a second absorption axis of the second polarizer. An included angle between the first absorption axis and the first alignment direction is 45 degrees. A display apparatus including the viewing angle control module is also provided.

Abstract: A semiconductor device includes a device layer, a first passivation layer, an aluminum pad, a second passivation layer, an under-ball metallurgy (UBM) pad and a connector. The device layer is disposed over a substrate, wherein the device layer includes a top metal feature. The first passivation layer is disposed over the device layer. The aluminum pad penetrates through the first passivation layer and is electrically connected to the top metal feature. The second passivation layer is disposed over the aluminum pad. The UBM pad penetrates through the second passivation layer and is electrically connected to the aluminum pad. The connector is disposed over the UBM pad. In some embodiments, a first included angle between a sidewall and a bottom of the aluminum pad is greater than a second included angle between a sidewall and a bottom of the UBM pad.

Abstract: A voltage level shifting circuit includes two PMOS transistors and four NMOS transistors. Sources of the PMOS transistors receive a first supply voltage value, a first PMOS transistor gate coupled with drains of second PMOS and NMOS transistors is a first output, and a second PMOS transistor gate coupled with drains of first PMOS and NMOS transistors is a second output. The first NMOS transistor source is coupled with a third NMOS transistor drain, and the third NMOS transistor gate is a first input. The second NMOS transistor source is coupled with a fourth NMOS transistor drain, and the fourth NMOS transistor gate is a second input. A voltage generating circuit generates a voltage at first and second NMOS transistor gates based on the first supply voltage value and on a signal, the signal behaving based on the first supply voltage value and a different second supply voltage value.

Abstract: A circuit includes a power-on control circuit and a voltage generating circuit. The power-on control circuit is configured to cause a power-on control signal to follow a voltage level of a first supply voltage during a first time period that a voltage level of a second supply voltage is less than a threshold value, and to set the power-on control signal to have a voltage level of a reference voltage during a second time period that the voltage level of the second supply voltage is greater than the threshold value. The voltage generating circuit is configured to generate a voltage signal responsive to the power-on control signal.

Abstract: A voltage level shifting circuit includes two PMOS transistors and four NMOS transistors. Sources of the PMOS transistors receive a first supply voltage value, a first PMOS transistor gate coupled with drains of second PMOS and NMOS transistors is a first output, and a second PMOS transistor gate coupled with drains of first PMOS and NMOS transistors is a second output. The first NMOS transistor source is coupled with a third NMOS transistor drain, and the third NMOS transistor gate is a first input. The second NMOS transistor source is coupled with a fourth NMOS transistor drain, and the fourth NMOS transistor gate is a second input. A voltage generating circuit generates a voltage at first and second NMOS transistor gates based on the first supply voltage value and on a signal, the signal behaving based on the first supply voltage value and a different second supply voltage value.

Abstract: A voltage generating circuit includes a first supply voltage node, a first switching device, a sub voltage generating circuit, and a second switching device. The first supply voltage node is configured to have a first supply voltage value, and is coupled with the first switching device. The sub voltage generating circuit is coupled in between the first switching device and the second switching device. The first switching circuit and the second switching circuit are configured to receive a control signal behaving based on the first supply voltage value and a second supply voltage value different from the first supply voltage value.

Abstract: Some embodiments of the present disclosure relate to a low-power, area efficient ESD protection device that provides ESD protection to an ESD susceptible circuit. The ESD protection device has a trigger circuit with a resistor. The resistor has a first terminal connected to the first external pin and a second terminal connected directly to a gate of a SiGe based PMOS shunt transistor. The trigger circuit generates a trigger signal that drives the gate of the PMOS device to shunt power away from the ESD susceptible circuit when an ESD event is present. The SiGe based PMOS shunt transistor has a lower gate leakage than a conventional NMOS shunt transistors, thereby providing for an ESD circuit with a low leakage current at small gate lengths.

Abstract: A circuit includes a power-on control circuit and a voltage generating circuit. The power-on control circuit is configured to cause a power-on control signal to follow a voltage level of a first supply voltage during a first time period that a voltage level of a second supply voltage is less than a threshold value, and to set the power-on control signal to have a voltage level of a reference voltage during a second time period that the voltage level of the second supply voltage is greater than the threshold value. The voltage generating circuit is configured to generate a voltage signal responsive to the power-on control signal.

Abstract: A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs.

Abstract: A voltage generating circuit includes a first supply voltage node, a first switching device, a sub voltage generating circuit, and a second switching device. The first supply voltage node is configured to have a first supply voltage value, and is coupled with the first switching device. The sub voltage generating circuit is coupled in between the first switching device and the second switching device. The first switching circuit and the second switching circuit are configured to receive a control signal behaving based on the first supply voltage value and a second supply voltage value different from the first supply voltage value.

Abstract: Some embodiments of the present disclosure relate to a low-power, area efficient ESD protection device that provides ESD protection to an ESD susceptible circuit. The ESD protection device has a trigger circuit with a resistor. The resistor has a first terminal connected to the first external pin and a second terminal connected directly to a gate of a SiGe based PMOS shunt transistor. The trigger circuit generates a trigger signal that drives the gate of the PMOS device to shunt power away from the ESD susceptible circuit when an ESD event is present. The SiGe based PMOS shunt transistor has a lower gate leakage than a conventional NMOS shunt transistors, thereby providing for an ESD circuit with a low leakage current at small gate lengths.

Abstract: A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs.

Abstract: A leakage current reduction circuit comprising a transmission gate, a feedback channel and a controller is placed between a first device supplied with a first voltage potential and a second device supplied with a second voltage potential. The voltage potential mismatch between the first device and the second device may cause a leakage current flowing through the input stage of the second device. By employing the low leakage power detection circuit, a logic high state generated from the first device can be converted into a logic high state having an amplitude approximately equal to the second voltage potential.

Abstract: A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.

Abstract: A phase change memory device and fabricating method are provided. A disk-shaped phase change layer is buried within the insulating material. A center via and ring via are formed by a lithography. The center via is located in the center of the phase change layer and passes through the phase change layer, and the ring via takes the center via as a center. A heating electrode within the center via performs Joule heating of the phase change layer, and the contact area between the phase change layer and the heating electrode is reduced by controlling the thickness of the phase change layer. Furthermore, a second electrode within the ring via dissipates the heat transmitted to the contact interface between the phase change layers, so as to avoid transmitting the heat to the etching boundary at the periphery of the phase change layer.

Abstract: A phase change memory (PCM) cell fabricated by etching a tapered structure into a phase change layer, and planarizing a dielectric layer on the phase change layer until a tip of the tapered structure is exposed for contacting a heating electrode. Therefore, the area of the exposed tip of the phase change layer is controlled to be of an extremely small size, the contact area between the phase change layer and the heating electrode is reduced, thereby lowering the operation current.

Abstract: A phase change memory device and fabricating method are provided. A disk-shaped phase change layer is buried within the insulating material. A center via and ring via are formed by a lithography. The center via is located in the center of the phase change layer and passes through the phase change layer, and the ring via takes the center via as a center. A heating electrode within the center via performs Joule heating of the phase change layer, and the contact area between the phase change layer and the heating electrode is reduced by controlling the thickness of the phase change layer. Furthermore, a second electrode within the ring via dissipates the heat transmitted to the contact interface between the phase change layers, so as to avoid transmitting the heat to the etching boundary at the periphery of the phase change layer.

Abstract: A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.