Abstract: In one example, a keyboard housing may include a chassis, a plurality of keys exposed through a top surface of the chassis, and an input device assembly connected to the chassis. The input device assembly may include a flexible touch sensing component to receive a touch input and a support structure. The support structure may include a first portion and a second portion foldable onto the first portion. The first portion and the second portion may support the flexible touch sensing component.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a plurality of heat conducting components, a pipe connected to the evaporator to form a loop, and a working fluid filled in the loop. An exterior of the evaporator has a heat conducting zone thermally contacted with the heat source to absorb heat generated from the heat source. The heat conducting components are disposed in the evaporator, located at an interior of the evaporator corresponding to the heat conducting zone. The heat conducting components are in pillar shape or rib shape respectively. The working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator. Each of the heat conducting components in rib shape is oriented in a flow direction of the working fluid.

Abstract: A voltage level shifting circuit includes two PMOS transistors and four NMOS transistors. Sources of the PMOS transistors receive a first supply voltage value, a first PMOS transistor gate coupled with drains of second PMOS and NMOS transistors is a first output, and a second PMOS transistor gate coupled with drains of first PMOS and NMOS transistors is a second output. The first NMOS transistor source is coupled with a third NMOS transistor drain, and the third NMOS transistor gate is a first input. The second NMOS transistor source is coupled with a fourth NMOS transistor drain, and the fourth NMOS transistor gate is a second input. A voltage generating circuit generates a voltage at first and second NMOS transistor gates based on the first supply voltage value and on a signal, the signal behaving based on the first supply voltage value and a different second supply voltage value.

Abstract: A circuit includes a power-on control circuit and a voltage generating circuit. The power-on control circuit is configured to cause a power-on control signal to follow a voltage level of a first supply voltage during a first time period that a voltage level of a second supply voltage is less than a threshold value, and to set the power-on control signal to have a voltage level of a reference voltage during a second time period that the voltage level of the second supply voltage is greater than the threshold value. The voltage generating circuit is configured to generate a voltage signal responsive to the power-on control signal.

Abstract: A voltage level shifting circuit includes two PMOS transistors and four NMOS transistors. Sources of the PMOS transistors receive a first supply voltage value, a first PMOS transistor gate coupled with drains of second PMOS and NMOS transistors is a first output, and a second PMOS transistor gate coupled with drains of first PMOS and NMOS transistors is a second output. The first NMOS transistor source is coupled with a third NMOS transistor drain, and the third NMOS transistor gate is a first input. The second NMOS transistor source is coupled with a fourth NMOS transistor drain, and the fourth NMOS transistor gate is a second input. A voltage generating circuit generates a voltage at first and second NMOS transistor gates based on the first supply voltage value and on a signal, the signal behaving based on the first supply voltage value and a different second supply voltage value.

Abstract: A voltage generating circuit includes a first supply voltage node, a first switching device, a sub voltage generating circuit, and a second switching device. The first supply voltage node is configured to have a first supply voltage value, and is coupled with the first switching device. The sub voltage generating circuit is coupled in between the first switching device and the second switching device. The first switching circuit and the second switching circuit are configured to receive a control signal behaving based on the first supply voltage value and a second supply voltage value different from the first supply voltage value.

Abstract: Some embodiments of the present disclosure relate to a low-power, area efficient ESD protection device that provides ESD protection to an ESD susceptible circuit. The ESD protection device has a trigger circuit with a resistor. The resistor has a first terminal connected to the first external pin and a second terminal connected directly to a gate of a SiGe based PMOS shunt transistor. The trigger circuit generates a trigger signal that drives the gate of the PMOS device to shunt power away from the ESD susceptible circuit when an ESD event is present. The SiGe based PMOS shunt transistor has a lower gate leakage than a conventional NMOS shunt transistors, thereby providing for an ESD circuit with a low leakage current at small gate lengths.

Abstract: A circuit includes a power-on control circuit and a voltage generating circuit. The power-on control circuit is configured to cause a power-on control signal to follow a voltage level of a first supply voltage during a first time period that a voltage level of a second supply voltage is less than a threshold value, and to set the power-on control signal to have a voltage level of a reference voltage during a second time period that the voltage level of the second supply voltage is greater than the threshold value. The voltage generating circuit is configured to generate a voltage signal responsive to the power-on control signal.

Abstract: A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs.

Abstract: A voltage generating circuit includes a first supply voltage node, a first switching device, a sub voltage generating circuit, and a second switching device. The first supply voltage node is configured to have a first supply voltage value, and is coupled with the first switching device. The sub voltage generating circuit is coupled in between the first switching device and the second switching device. The first switching circuit and the second switching circuit are configured to receive a control signal behaving based on the first supply voltage value and a second supply voltage value different from the first supply voltage value.

Abstract: Some embodiments of the present disclosure relate to a low-power, area efficient ESD protection device that provides ESD protection to an ESD susceptible circuit. The ESD protection device has a trigger circuit with a resistor. The resistor has a first terminal connected to the first external pin and a second terminal connected directly to a gate of a SiGe based PMOS shunt transistor. The trigger circuit generates a trigger signal that drives the gate of the PMOS device to shunt power away from the ESD susceptible circuit when an ESD event is present. The SiGe based PMOS shunt transistor has a lower gate leakage than a conventional NMOS shunt transistors, thereby providing for an ESD circuit with a low leakage current at small gate lengths.

Abstract: A device includes a metal-oxide-semiconductor (MOS) device, which includes a gate electrode and a source/drain region adjacent the gate electrode. A first and a second contact plug are formed directly over and electrically connected to two portions of a same MOS component, wherein the same MOS component is one of the gate electrode and the source/drain region. The same MOS component is configured to be used as a resistor that is connected between the first and the second contact plugs.

Abstract: A leakage current reduction circuit comprising a transmission gate, a feedback channel and a controller is placed between a first device supplied with a first voltage potential and a second device supplied with a second voltage potential. The voltage potential mismatch between the first device and the second device may cause a leakage current flowing through the input stage of the second device. By employing the low leakage power detection circuit, a logic high state generated from the first device can be converted into a logic high state having an amplitude approximately equal to the second voltage potential.

Abstract: A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.

Abstract: A phase change memory device and fabricating method are provided. A disk-shaped phase change layer is buried within the insulating material. A center via and ring via are formed by a lithography. The center via is located in the center of the phase change layer and passes through the phase change layer, and the ring via takes the center via as a center. A heating electrode within the center via performs Joule heating of the phase change layer, and the contact area between the phase change layer and the heating electrode is reduced by controlling the thickness of the phase change layer. Furthermore, a second electrode within the ring via dissipates the heat transmitted to the contact interface between the phase change layers, so as to avoid transmitting the heat to the etching boundary at the periphery of the phase change layer.

Abstract: A phase change memory (PCM) cell fabricated by etching a tapered structure into a phase change layer, and planarizing a dielectric layer on the phase change layer until a tip of the tapered structure is exposed for contacting a heating electrode. Therefore, the area of the exposed tip of the phase change layer is controlled to be of an extremely small size, the contact area between the phase change layer and the heating electrode is reduced, thereby lowering the operation current.

Abstract: A phase change memory device and fabricating method are provided. A disk-shaped phase change layer is buried within the insulating material. A center via and ring via are formed by a lithography. The center via is located in the center of the phase change layer and passes through the phase change layer, and the ring via takes the center via as a center. A heating electrode within the center via performs Joule heating of the phase change layer, and the contact area between the phase change layer and the heating electrode is reduced by controlling the thickness of the phase change layer. Furthermore, a second electrode within the ring via dissipates the heat transmitted to the contact interface between the phase change layers, so as to avoid transmitting the heat to the etching boundary at the periphery of the phase change layer.

Abstract: A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.

Abstract: A phase-change memory comprises a bottom electrode formed on a substrate. A first isolation layer is formed on the bottom electrode. A top electrode is formed on the isolation layer. A first phase-change material is formed in the first isolation layer, wherein the top electrode and the bottom electrode are electrically connected via the first phase-change material. Since the phase-change material can have a diameter less than the resolution limit of the photolithography process, an operating current for a state conversion of the phase-change material pattern may be reduced so as to decrease a power dissipation of the phase-change memory device.