Patents by Inventor Wen Heng Chung

Wen Heng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSABLE NEURAL NETWORK KERNELS
    Publication number: 20210117806
    Abstract: A technique for manipulating a generic tensor is provided. The technique includes receiving a first request to perform a first operation on a generic tensor descriptor associated with the generic tensor, responsive to the first request, performing the first operation on the generic tensor descriptor, receiving a second request to perform a second operation on generic tensor raw data associated with the generic tensor, and responsive to the second request, performing the second operation on the generic tensor raw data, the performing the second operation including mapping a tensor coordinate specified by the second request to a memory address, the mapping including evaluating a delta function to determine an address delta value to add to a previously determined address for a previously processed tensor coordinate.
    Type: Application
    Filed: December 30, 2020
    Publication date: April 22, 2021
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Chao Liu, Daniel Isamu Lowell, Wen Heng Chung, Jing Zhang
  • COMPOSABLE NEURAL NETWORK KERNELS
    Publication number: 20200410330
    Abstract: A technique for manipulating a generic tensor is provided. The technique includes receiving a first request to perform a first operation on a generic tensor descriptor associated with the generic tensor, responsive to the first request, performing the first operation on the generic tensor descriptor, receiving a second request to perform a second operation on generic tensor raw data associated with the generic tensor, and responsive to the second request, performing the second operation on the generic tensor raw data.
    Type: Application
    Filed: January 31, 2020
    Publication date: December 31, 2020
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Chao Liu, Daniel Isamu Lowell, Wen Heng Chung, Jing Zhang