Patents by Inventor Wen-Heng Hu

Wen-Heng Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060223299
    Abstract: The fabricating process of an electrically conductive structure on a circuit board includes: providing a circuit board with a plurality of electrically connecting pads formed thereon; forming a first insulating layer on the circuit board, the first insulating layer covering the electrically connecting pads; forming a conductive layer on the first insulating layer; forming a second insulating layer on the conductive layer; applying an opening process to the first insulating layer, the conductive layer and the second insulating layer directly over the electrically connecting pads to form openings through the three layers corresponding in position to the electrically connecting pads; and forming bumps in the opening by electroplating. The fabricating process of the present invention can reduce the number of alignment steps and fabricating cost.
    Type: Application
    Filed: December 5, 2005
    Publication date: October 5, 2006
    Inventor: Wen-Heng Hu