Patents by Inventor Wen-Herng Su

Wen-Herng Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10516250
    Abstract: A near-infrared vertical-cavity surface-emitting laser is provided, which utilizes a conventional distributed Bragg reflector and a complex Bragg reflector which consists of a dielectric Bragg reflector and a reflective metal layer to construct a cavity. With the disposition of a confining layer, the light emitted from an active layer is confined in the cavity to resonate so as to emit a laser light. The thickness of the complex Bragg reflector is much thinner than that of the conventional distributed Bragg reflector, thereby lowering the cost of manufacture. In addition, with the transfer method, the laser is transferred to the substrate with high thermal conductivity to increase the heat dissipation efficiency. Therefore, the present invention can maintain operation while emitting a high-power laser.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: December 24, 2019
    Assignee: EPILEDS TECHNOLOGIES, INC.
    Inventors: Wen-Herng Su, Ming-Sen Hsu
  • Patent number: 8692281
    Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: April 8, 2014
    Assignee: DiCon Fiberoptics Inc.
    Inventors: Wen-Herng Su, Junying Lu, Ho-Shang Lee
  • Publication number: 20120032226
    Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
    Type: Application
    Filed: October 12, 2011
    Publication date: February 9, 2012
    Inventors: Wen-Herng SU, Junying LU, Ho-Shang LEE
  • Patent number: 8044427
    Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
    Type: Grant
    Filed: June 24, 2008
    Date of Patent: October 25, 2011
    Assignee: DiCon Fiberoptics, Inc.
    Inventors: Wen-Herng Su, Junying Lu, Ho-Shang Lee
  • Publication number: 20090315062
    Abstract: This invention relates to the thermal management, extraction of light, and cost effectiveness of Light Emitting Diode, or LED, electrical circuits. An integrated circuit LED submount is described, for the packaging of high power LEDs. The LED submount provides high thermal conductivity while preserving electrical insulation. In particular, a process is described for anodizing a high thermal conductivity aluminum alloy sheet to form a porous aluminum oxide layer and a non-porous aluminum oxide layer. This anodized aluminum alloy sheet acts as a superior electrical insulator, and also provides surface morphology and mechanical properties that are useful for the fabrication of high-density and high-power multilevel electrical circuits.
    Type: Application
    Filed: June 24, 2008
    Publication date: December 24, 2009
    Inventors: Wen-Herng Su, Junying Lu, Ho-Shang Lee
  • Patent number: 6005995
    Abstract: In order to tune the frequencies of radiation sources, a frequency locker is provided having equally spaced periodic frequencies with a spectral range substantially equal to the frequency spacing of a plurality of radiation sources with equally spaced apart frequencies. The periodic frequencies of the locker are slightly offset from those of the radiation sources. Radiation from each of the sources is passed through the locker and the radiation passed by the locker is detected and used to adjust the frequencies of the sources in order to tune the sources. The frequency locker includes an etalon with dimensions accurate to 0.5 microns or better. The dimension of the etalon may be controlled by controlling the thickness of spacers for maintaining vacuum or air gaps where the dimensions may be altered by thin film deposition and etching techniques. The optical path length of the etalon may also be changed by altering the angle of incidence of an incoming beam with the reflective surfaces of the etalon.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: December 21, 1999
    Assignee: Dicon Fiberoptics, Inc.
    Inventors: George C. K. Chen, Ho-Shang Lee, Wen-Herng Su, Feng Ye, David Polinsky