Patents by Inventor Wen-Hsiang Chen

Wen-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240424691
    Abstract: Disclosed is a gripping mechanism including a first bracket, a second bracket, a first guide rod, a third bracket, an actuating module, a gripping block and a gripper. The second bracket is pivotally connected to the first bracket. The first guide rod is fixed on the second bracket. The third bracket is slidably connected to the first guide rod. The actuating module is disposed on the third bracket. The gripping block is slidably disposed on the third bracket, wherein the gripping block is connected to the actuating module. The gripper is fixed on the third bracket, wherein the actuating module is located between the first guide rod and the gripping block, and the gripping block is located between the actuating module and the gripper. A mobile robot is also disclosed.
    Type: Application
    Filed: June 20, 2024
    Publication date: December 26, 2024
    Applicant: Unicom Global, Inc.
    Inventors: Sheng-Kai Lai, Wen-Yi Kuo, Wen-Hsiang Chen, Chen-Wei Yang, Ting-Cheng Sun
  • Publication number: 20240424690
    Abstract: Disclosed is a gripping mechanism including a first bracket, a second bracket, a first guide rod, a third bracket, an actuating module, a gripping block and two grippers. The second bracket is connected to the first bracket. The third bracket is connected to the second bracket. The actuating module is disposed on the third bracket. The gripping block is slidably disposed on the third bracket and is connected to the actuating module. The two grippers are fixed on the terminal end of the third bracket distal from the first bracket and the second bracket, wherein the gripping block is located between the actuating module and the two grippers and the actuating module is adapted to drive the gripping block to slide close to or slide away from the two grippers. A mobile robot is also disclosed.
    Type: Application
    Filed: June 20, 2024
    Publication date: December 26, 2024
    Applicant: Unicom Global, Inc.
    Inventors: Sheng-Kai Lai, Wen-Yi Kuo, Wen-Hsiang Chen, Chen-Wei Yang, Ting-Cheng Sun
  • Patent number: 11964409
    Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 23, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Wen-Ching Lin, Ting-Yu Wang, Fa-Chih Ke, Yu-Ling Lin, Wen-Hsiang Chen
  • Patent number: 11739445
    Abstract: A temperature-responsive material having a structure represented by formula (I): is provided, where in formula (I), X has a structure represented by formula (i) or formula (ii): x and y are in a molar ratio of 9:1 to 1:3, n is an integer of 7 to 120, and m is an integer of 10 to 1,000.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: August 29, 2023
    Assignee: Taiwan Textile Research Institute
    Inventors: Wen-Hsiang Chen, Chun-Hung Lin
  • Publication number: 20220388202
    Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.
    Type: Application
    Filed: August 31, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Wen-Ching Lin, Ting-Yu Wang, Fa-Chih Ke, Yu-Ling Lin, Wen-Hsiang Chen
  • Publication number: 20220026949
    Abstract: An example support structure for a laptop computer is disclosed. The support structure is extendable and connected to the rear surface of the laptop. The support structure has conduits, a foot assembly, and pairs of magnets. The foot assembly includes a foot section and a connection member. The pair of magnet holds the connection member in a way that the foot remains at a closed or retracted position, and the second pair magnet holds the connection member in a way that the foot remains in an open or extended position. The support structure also has a heat dissipation section under the foot which enhances the heat dissipation property of the laptop when the foot is in the open or extended position.
    Type: Application
    Filed: December 14, 2018
    Publication date: January 27, 2022
    Inventors: YI-TE LIU, WEN-HSIANG CHEN, HUNG-WEN CHANG
  • Publication number: 20210010165
    Abstract: A temperature-responsive material having a structure represented by formula (I): is provided, where in formula (I), X has a structure represented by formula (i) or formula (ii): x and y are in a molar ratio of 9:1 to 1:3, n is an integer of 7 to 120, and m is an integer of 10 to 1,000.
    Type: Application
    Filed: March 31, 2020
    Publication date: January 14, 2021
    Applicant: Taiwan Textile Research Institute
    Inventors: Wen-Hsiang Chen, Chun-Hung Lin
  • Publication number: 20160376321
    Abstract: Embodiments of the disclosure concern immunogenic compositions and methods for treating or preventing Severe acute respiratory syndrome (SARS). The compositions and methods concern a portion of the receptor-binding domain (RBD) of the SARS-CoV spike protein. In at least particular cases, a mutated version of a portion of the RBD is utilized, such as a deglycosylated mutant of the RBD.
    Type: Application
    Filed: November 21, 2014
    Publication date: December 29, 2016
    Applicant: BAYLOR COLLEGE OF MEDICINE
    Inventors: Peter Jay Hotez, Maria Elena Bottazzi, Bin Zhan, Wen-Hsiang Chen, Shivali Chag
  • Publication number: 20150094430
    Abstract: A dinitro compound I, a diamine compound II and polyimides are provided. The diamine compound II is a reduction product of the dinitro compound I. The polyimides using the diamine compound II as one of the monomers can increase the solubility of the polyimides in various organic solvents and make the color of the polyimides to be transparent and colorless.
    Type: Application
    Filed: April 7, 2014
    Publication date: April 2, 2015
    Applicant: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventor: Wen-Hsiang Chen
  • Patent number: 8981038
    Abstract: A polyimide including a structure shown as Formula II is provided, wherein X is halogen, A1 is selected from one of Formula 1 to Formula 18, and n is from 2 to 500,
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: March 17, 2015
    Assignee: Taiwan Textile Research Institute
    Inventors: Der-Jang Liaw, Wen-Hsiang Chen, Ying-Chi Huang, Bo-Cheng Tao
  • Publication number: 20140179878
    Abstract: A polyimide including a structure shown as Formula II is provided, wherein X is halogen, A1 is selected from one of Formula 1 to Formula 18, and n is from 2 to 500,
    Type: Application
    Filed: December 25, 2012
    Publication date: June 26, 2014
    Applicant: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Der-Jang Liaw, Wen-Hsiang Chen, Ying-Chi Huang, Bo-Cheng Tao
  • Patent number: 8349394
    Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.
    Type: Grant
    Filed: June 18, 2008
    Date of Patent: January 8, 2013
    Assignee: Tripod Technology Corporation
    Inventors: Chao Peng, Jo-Lin Lan, Ya-Huei Chang, Wen-Chi Hsu, Hai-Peng Cheng, Shien-Ping Feng, Wen-Hsiang Chen, Tzu-Chien Wei
  • Patent number: 8298434
    Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed. The method includes etching a surface of a substrate, followed by immersing the substrate in a solution containing surfactants to form a conditioner layer on the surface of the substrate, and immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioner layer.
    Type: Grant
    Filed: October 29, 2009
    Date of Patent: October 30, 2012
    Assignee: Tripod Technology Corporation
    Inventors: Tzu-Chien Wei, Hai-Peng Cheng, Shien-Ping Feng, Jo-Lin Lan, Chao Peng, Wen-Chi Hsu, Ya-Huei Chang, Wen-Hsiang Chen
  • Patent number: 8241372
    Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing a plurality of polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: August 14, 2012
    Assignee: Tripod Technology Corporation
    Inventors: Hai-Peng Cheng, Shien-Ping Feng, Jo-Lin Lan, Chao Peng, Tzu-Chien Wei, Wen-Chi Hsu, Ya-Huei Chang, Wen-Hsiang Chen
  • Patent number: 7829403
    Abstract: A method for fabricating a semiconductor device is provided. A first active region and a second active region are defined in a substrate. An electrode covering the first active region and the second active region is formed on the substrate. A first sacrificial layer is formed on the second active layer. A first work function electrode is formed on the first active layer by performing a first doping process to a portion of the electrode. The first sacrificial layer is removed. A second sacrificial layer is formed on the first active layer.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: November 9, 2010
    Assignee: Inotera Memories, Inc.
    Inventors: Wen-Hsiang Chen, Cheng-Yeh Hsu
  • Publication number: 20100108240
    Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed. The method includes etching a surface of a substrate, followed by immersing the substrate in a solution containing surfactants to form a conditioner layer on the surface of the substrate, and immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioner layer.
    Type: Application
    Filed: October 29, 2009
    Publication date: May 6, 2010
    Applicant: TRIPOD TECHNOLOGY CORPORATION
    Inventors: Tzu-Chien WEI, Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
  • Patent number: 7709374
    Abstract: The invention provides a method for fabricating a memory device. At first, a substrate having a plurality of gate electrode stacks and a source/drain region is provided, and a barrier layer and a sacrificial layer are sequentially formed on the substrate and cover the gate electrode stacks. A portion of the sacrificial layer is removed to form a sacrificial plug between the gate electrode stacks, and then a filling layer is formed over the substrate. Next, the sacrificial plug is removed, and a contact hole is formed. A clean step with a solution containing ammonia is carried out. The barrier layer at the bottom of the contact hole is removed, and a metal plug is then formed in the contact hole to electrically contact with the source/drain region.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: May 4, 2010
    Assignee: Inotera Memories, Inc.
    Inventors: Wen-Hsiang Chen, Hsin-Yu Hsiao
  • Publication number: 20100101623
    Abstract: A packaging structure with a box for containing at least a portable electronic device is provided. The box has plates, which are connected to one another and surrounded to form an opening for the portable electronic device passing through, and a lid selectively covering or exposing the opening. First solar cells each fastened on an inner surface of each plate in the box. At least a cable electrically connects the first solar cells and is operated for electrically connecting the portable electronic device.
    Type: Application
    Filed: March 10, 2009
    Publication date: April 29, 2010
    Applicant: TRIPOD TECHNOLOGY CORPORATION
    Inventors: Tzu-Chien WEI, Chao PENG, Jo-Lin LAN, Ya-Huei CHANG, Wen-Chi HSU, Hai-Peng CHENG, Shien-Ping FENG, Wen-Hsiang CHEN
  • Publication number: 20100101644
    Abstract: Disclosed herein is a dye-sensitized solar cell. The dye-sensitized solar cell includes a semiconductor electrode with a dye adsorbed thereon; a counter electrode; and an electrolyte composition provided between the semiconductor electrode and the counter electrode; wherein the electrolyte composition comprises an oxidation-reduction mediator and a eutectic ionic liquid including a choline halide or derivatives thereof mixed with alcohols or urea.
    Type: Application
    Filed: October 23, 2009
    Publication date: April 29, 2010
    Applicant: TRIPOD TECHNOLOGY CORPORATION
    Inventors: Huei-Ru JHONG, Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Tzu-Chien WEI, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
  • Publication number: 20100071759
    Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.
    Type: Application
    Filed: February 10, 2009
    Publication date: March 25, 2010
    Applicant: TRIPOD TECHNOLOGY CORPORATION
    Inventors: Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Tzu-Chien WEI, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN