Patents by Inventor Wen-Hsieh Hsieh

Wen-Hsieh Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Internet phone system
    Patent number: 11050868
    Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: June 29, 2021
    Assignee: Pegatron Corporation
    Inventors: Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Hsiao-Wen Lee, Ching-Jen Wang
  • INTERNET PHONE SYSTEM
    Publication number: 20190312963
    Abstract: An internet phone system includes an internet phone main body, an expansion device and a multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card. The expansion device is capable of combining with another expansion device by another multiple-layer connecting card.
    Type: Application
    Filed: June 24, 2019
    Publication date: October 10, 2019
    Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG
  • Internet phone system
    Patent number: 10397385
    Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: August 27, 2019
    Assignee: PEGATRON CORPORATION
    Inventors: Yu-Ti Kuo, Wen-Hsieh Hsieh, Chao-Tang Chiu, Chien-Yi Lee, Hsiao-Wen Lee, Ching-Jen Wang
  • INTERNET PHONE SYSTEM
    Publication number: 20170180525
    Abstract: An internet phone system includes an internet phone main body, at least one expansion device and at least one multiple-layer connecting card. The internet phone main body includes a first connecting port. The at least one expansion device includes a second connecting port. One end of the multiple-layer connecting card is connected to the first connecting port, and the other end is connected to the second connecting port such that the internet phone main body can be electrically connected to the expansion device via the multiple-layer connecting card.
    Type: Application
    Filed: September 14, 2016
    Publication date: June 22, 2017
    Inventors: Yu-Ti KUO, Wen-Hsieh HSIEH, Chao-Tang CHIU, Chien-Yi LEE, Hsiao-Wen LEE, Ching-Jen WANG
  • Electronic device
    Patent number: 8553387
    Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: October 8, 2013
    Assignee: Pegatron
    Inventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh
  • ELECTRONIC DEVICE
    Publication number: 20110317378
    Abstract: This invention provides an electronic device including a casing and a circuit board. The casing has an opening. The circuit board is located in the casing and at least includes a conductive layer and a surface insulating layer. The conductive layer includes a signal transmission portion and a static induction portion. The static induction portion is electrically disconnected with the signal transmission portion at the conductive layer, and the static induction portion is closer to the opening than the signal transmission portion. The surface insulating layer covers the signal transmission portion on the circuit board and exposes the static induction portion.
    Type: Application
    Filed: March 7, 2011
    Publication date: December 29, 2011
    Inventors: Ching-Jen Wang, Fang-Teng Chung, Wen-Hsieh Hsieh