Patents by Inventor Wen Hsien Lai

Wen Hsien Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11297735
    Abstract: A heat exchange device includes a heat exchanger and two pumps. The heat exchanger defines a heat exchange pathway, an inflow pathway communicated with the heat exchange pathway for guiding a cooling liquid to flow into the heat exchange pathway, and an outflow pathway opposite to the inflow pathway for guiding the cooling liquid to flow out from the heat exchange pathway. Each of the pumps includes a case body defining a flow-guiding chamber communicated with and disposed between the heat exchange pathway and the outflow pathway, a rotor mounted in the flow-guiding chamber, and a stator mounted to the case body for driving rotation of the rotor, facilitating flowing movement of the cooling liquid toward the outflow pathway.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: April 5, 2022
    Assignee: IN WIN DEVELOPMENT INC.
    Inventor: Wen-Hsien Lai
  • Publication number: 20200344912
    Abstract: A heat exchange device includes a heat exchanger and two pumps. The heat exchanger defines a heat exchange pathway, an inflow pathway communicated with the heat exchange pathway for guiding a cooling liquid to flow into the heat exchange pathway, and an outflow pathway opposite to the inflow pathway for guiding the cooling liquid to flow out from the heat exchange pathway. Each of the pumps includes a case body defining a flow-guiding chamber communicated with and disposed between the heat exchange pathway and the outflow pathway, a rotor mounted in the flow-guiding chamber, and a stator mounted to the case body for driving rotation of the rotor, facilitating flowing movement of the cooling liquid toward the outflow pathway.
    Type: Application
    Filed: December 27, 2019
    Publication date: October 29, 2020
    Inventor: Wen-Hsien LAI
  • Patent number: 10712222
    Abstract: An air pressure and temperature measurement system of the present invention includes a 90-degree interleaved lattice of metal wires embedded on a frame, wherein a pressure sensor and a temperature sensor are installed at each of the areas where the metal wires are connected to the frame. All the sensor modules are connected to a MCU (microcontroller unit) mounted within the frame. When air driven by fans blows over the reticulated metal wires, the sensor modules use the heat and pressure produced therefrom to enable calculating the temperature and pressure distribution at the fan openings, and then the data is transferred to an external system through a communication interface to perform more precise management and monitoring.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: July 14, 2020
    Assignee: IN WIN DEVELOPMENT, INC.
    Inventor: Wen-Hsien Lai
  • Publication number: 20190293076
    Abstract: A control method for adjusting rotating speed of multiple fans according to temperature of the present invention includes a micro controller circuit board and one or more fans. The circuit board is connected with one or more fans. The rotating speed of the fans are controlled by a PWM duty cycle and the signals of rotating speed are transmitted back to an MCU. Therefore, the rotating speed is adjusted consistently and proportionally with respect to the change in temperature, allowing a computer or server casing to have optimized cooling efficiency.
    Type: Application
    Filed: March 26, 2018
    Publication date: September 26, 2019
    Inventor: Wen-Hsien Lai
  • Publication number: 20190293512
    Abstract: An air pressure and temperature measurement system of the present invention includes a 90-degree interleaved lattice of metal wires embedded on a frame, wherein a pressure sensor and a temperature sensor are installed at each of the areas where the metal wires are connected to the frame. All the sensor modules are connected to a MCU (microcontroller unit) mounted within the frame. When air driven by fans blows over the reticulated metal wires, the sensor modules use the heat and pressure produced therefrom to enable calculating the temperature and pressure distribution at the fan openings, and then the data is transferred to an external system through a communication interface to perform more precise management and monitoring.
    Type: Application
    Filed: March 26, 2018
    Publication date: September 26, 2019
    Inventor: WEN-HSIEN LAI
  • Patent number: 10184478
    Abstract: The present invention relates to a fan device with modular functionality, whereby an output end and input end of the fan are respectively provided with terminal joints. Two connector joints on the I/O module connecting wires are connected respectively to the terminal joints of the output end and the input end of the fan. Therefore, the output/input terminals are modularized by means of the separated wires to reduce the problems of wire trimming.
    Type: Grant
    Filed: May 12, 2016
    Date of Patent: January 22, 2019
    Assignee: IN WIN DEVELOPMENT, INC.
    Inventor: Wen-Hsien Lai
  • Publication number: 20180340550
    Abstract: The present invention relates to a fan with a relocatable frame, A connecting rod of the fan is pivoted on a pivot of a base and can rotate by 300° against the pivot. A frame of the fan is pivoted on a rotating shaft which is then pivoted on the connecting rod. The frame can rotate by 360° against the rotating shaft and the rotating shaft can also rotate by 360° on the connecting rod. In addition to being put up on a desktop by itself, the fan can also be installed inside a computer.
    Type: Application
    Filed: May 25, 2017
    Publication date: November 29, 2018
    Inventor: WEN-HSIEN LAI
  • Publication number: 20170331346
    Abstract: The present invention relates to a fan device with modular functionality, whereby an output end and input end of the fan are respectively provided with terminal joints. Two connector joints on the I/O module connecting wires are connected respectively to the terminal joints of the output end and the input end of the fan. Therefore, the output/input terminals are modularized by means of the separated wires to reduce the problems of wire trimming.
    Type: Application
    Filed: May 12, 2016
    Publication date: November 16, 2017
    Inventor: WEN-HSIEN LAI
  • Publication number: 20170314777
    Abstract: The present invention discloses a multiLED fan controller apparatus, which is provided with various addressable RGB (Red-Green-Blue) LEDs. Each addressable RGB LED is built in with an IC (Integrated Circuit) control chip, which is equipped with a one-wire bus control function and can be connected in a series freely. The LED fans are only provided with windows of a single input and a single output that all the addressable RGB LEDs can be controlled. In addition, all the addressable RGB LEDs are controlled individually by a controller to result in various lighting effects through the change in output signals. The lighting can be adjusted remotely by the controller, or can be adjusted by a dedicated software program.
    Type: Application
    Filed: April 29, 2016
    Publication date: November 2, 2017
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20170280592
    Abstract: The present invention is a new computer housing heat dissipating configuration provided with both a heat dissipation function and the function to hide the upper power source. The upper portion of the computer housing is also installed with one to three fans that blow toward the corresponding ventilation holes in the side panel. A fan is further installed in the rear portion of the computer housing. The aforementioned fans all expel heat outwardly from the computer system, thereby causing the lower portion of the computer housing to form negative air pressure that draws air upwards from the bottom portion, whereupon the fans expel the high temperature air flow to the outside air of the computer, thus achieving premium heat dissipation.
    Type: Application
    Filed: March 24, 2016
    Publication date: September 28, 2017
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Patent number: 9625957
    Abstract: The present invention discloses a tool-free fastening device for a glass side panel of computer. A glass side panel at an end of the computer is provided with a movable handle, an interior of the computer is provided with a movable plate, and the glass side panel is fixed on the computer by locking lock hooks on the movable handle into through-holes of the movable plate for positioning. When the glass side panel is to be dismantled from the computer, only the movable handle needs to be pressed to displace the movable plate, and then the glass side panel can be unlocked and release from the computer.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: April 18, 2017
    Assignee: IN WIN DEVELOPMENT, INC.
    Inventor: Wen-Hsien Lai
  • Publication number: 20160187947
    Abstract: The present invention discloses a controlling the operational state of a connected device powered by a mutually connected power source, in which a PD (Powered Device) Module is installed in a general computer system, and via PSE (Power Source Equipment) supply power to a PD Module, via Connected Device Control the synchronous power of the PD Module to detect and control turning on and turning off the power supply.
    Type: Application
    Filed: December 28, 2014
    Publication date: June 30, 2016
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20160179154
    Abstract: The present invention discloses controlling the operating state of a system based on the operating state of a connected peripheral or system, in which a powered device module (PD module) is installed in a general computer system, and via power source equipment (PSE) supply power to a PD module, via connected device (CD) Control the synchronous power of the PD module to detect and control turning on and turning off the power supply.
    Type: Application
    Filed: December 19, 2014
    Publication date: June 23, 2016
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20160134332
    Abstract: The present invention disclosed a using a POE (Power over Ethernet) device to supply multiple DC (direct current) power to connected devices and application thereof, which is enables supplying different DC (direct current) voltages produced by a PD (Powered Device) module from a PSE (Power Source Equipment) of a POE (Power over Ethernet) device. The different DC voltage output is supplied for use by external devices, and uses a single POE power connection to enable supplying power to separated or interconnected type external devices.
    Type: Application
    Filed: November 10, 2014
    Publication date: May 12, 2016
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20160064939
    Abstract: The present invention uses the power over ethernet protocol to augment a DC/AC power module inverter with application thereof, in which the original power over ethernet protocol is used as the basis for a DC power supply, and augments an ethernet powered device module with a DC-AC module inverter, thereby forming a device having two different output applications that is equivalent to a module having both a DC to DC and DC to AC at the same time.
    Type: Application
    Filed: August 27, 2014
    Publication date: March 3, 2016
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20150295732
    Abstract: The present invention discloses an Ethernet powered device. A PoE splitter is added with an RJ45 connector which is connected synchronously with another non-PoE device through an Ethernet cable. Accordingly, the PoE splitter can transmit power to a non-PoE device, including a wireless AP, a CPE, a router, etc., through the Ethernet cable, and is also able to connect another non-PoE device, such as a monitor.
    Type: Application
    Filed: April 9, 2014
    Publication date: October 15, 2015
    Applicant: IN WIN DEVELOPMENT, INC.
    Inventor: WEN-HSIEN LAI
  • Publication number: 20130303072
    Abstract: A computer case with ventilation and heat dissipation effects of the present invention is characterized in that the computer case is assembled by a plate-shaped first and second outer board, plural inner boards, plural sleeves and plural pillars. Upper, lower, left and right sides of the computer case that is assembled by the plate-shaped board material are opened to air, which is able to improve cooling and heat dissipation effects of the computer.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Inventor: WEN-HSIEN LAI
  • Patent number: D412497
    Type: Grant
    Filed: June 17, 1998
    Date of Patent: August 3, 1999
    Inventor: Wen Hsien Lai
  • Patent number: D797730
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: September 19, 2017
    Assignee: IN WIN DEVELOPMENT, INC.
    Inventor: Wen-Hsien Lai
  • Patent number: D798295
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: September 26, 2017
    Assignee: IN WIN DEVELOPMENT, INC.
    Inventor: Wen-Hsien Lai