Patents by Inventor Wen-Hsien Lee

Wen-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130335276
    Abstract: An electronic communication device with an antenna structure includes a casing defining a receiving space therein, a circuit board, an antenna module, and at least an elastic conductive element. The circuit board is received in the receiving space and has a first electrically connecting portion. The antenna module is received in the receiving space and has a second electrically connecting portion corresponding in position to the first electrically connecting portion. The elastic conductive element is disposed between the circuit board and the antenna module and corresponds in position to the first and second electrically connecting portions.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 19, 2013
    Inventors: WEN-HSIEN LEE, SHIH-PO LO
  • Publication number: 20130235528
    Abstract: An assembled electromagnetic shielding case conducive to electromagnetic interference shielding and heat dissipation of an electronic component on a printed circuit board includes a body, a shielding element, and a fixing element. The body has an opening and an engagement portion. The engagement portion connects the body and the printed circuit board. The shielding element has a bottom side and a heat-dissipating side opposing thereto. The shielding element closes the opening for effectuating electromagnetic interference shielding. The shielding element dissipates heat generated from the electronic component by transferring the heat from the bottom side to the heat-dissipating side for dissipating the heat. The fixing element couples the body and the shielding element.
    Type: Application
    Filed: May 7, 2012
    Publication date: September 12, 2013
    Inventors: WEN-HSIEN LEE, SHIH-PO LO, CHING-FENG HSIEH
  • Patent number: D619925
    Type: Grant
    Filed: January 7, 2010
    Date of Patent: July 20, 2010
    Assignee: CIC Components Ind. Co., Ltd.
    Inventor: Wen-Hsien Lee
  • Patent number: D622786
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: August 31, 2010
    Assignee: CIC Components Ind. Co., Ltd.
    Inventor: Wen-Hsien Lee
  • Patent number: D633578
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: March 1, 2011
    Inventor: Wen-Hsien Lee
  • Patent number: D678426
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: March 19, 2013
    Inventor: Wen-Hsien Lee
  • Patent number: D679762
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: April 9, 2013
    Inventor: Wen-Hsien Lee
  • Patent number: D681134
    Type: Grant
    Filed: October 22, 2012
    Date of Patent: April 30, 2013
    Inventor: Wen-Hsien Lee