Abstract: A heat transferring device and a heat transferring component thereof are disclosed. The heat transferring device includes a heat transferring component, a lower plate, a positioning component and at least one support rod. The heat transferring component is in a shape of pouch and includes input end and an output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on and surrounding an exterior of the heat transferring component to restrict the shape and a position of the heat transferring component, wherein an end of the sleeve is connected to the lower plate. The support rod is connected to the lower plate. The heat transferring component further includes at least one protrusion on the periphery, and the protrusion is fixed on the support rod or the sleeve through at least one fastener.

Abstract: The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

Abstract: A susceptor is provided. The susceptor comprises: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring, wherein the outer ring comprises multiple sub-elements separated from each other and detachably connected to the base part; wherein the inner ring and the outer ring separate the holders from one another, and the inner ring comprises multiple first extensions each protruding outwardly toward the outer ring, and each sub-element comprises a second extension extending inwardly toward the inner ring.

Abstract: A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another. A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; a cover comprising a first surface facing the base part, and a second surface opposite to the first surface; a first positioning structure; a second positioning structure formed in the first surface; and a third positioning structure formed in the base part, wherein the cover connects to the base part by associating the first positioning structure with the second positioning structure and the third positioning structure.

Abstract: A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; an inner ring connected to the base part; and an outer ring detachably connected to the base part and separated from the inner ring; wherein the inner ring and the outer ring separate the holders from one another. A susceptor, comprising: a base part; multiple holders distributed on the base part for accommodating wafers; a cover comprising a first surface facing the base part, and a second surface opposite to the first surface; a first positioning structure; a second positioning structure formed in the first surface; and a third positioning structure formed in the base part, wherein the cover connects to the base part by associating the first positioning structure with the second positioning structure and the third positioning structure.

Abstract: An upright test apparatus for electronic assemblies includes a case assembly, first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a first sub-connector and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and is substantially perpendicular to the motherboard. The first sub-connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts the electronic assemblies into the first sub-connectors in a vertical direction, respectively, tests the electronic assemblies and removes the electronic assemblies after the electronic assemblies are tested.

Abstract: An adapted test apparatus for electronic components includes a case assembly, a plurality of first motherboard assemblies and a handler. The first motherboard assemblies are disposed in the case assembly. Each first motherboard assembly includes a motherboard, a first main connector, an adapter, a plurality of test connectors and a central processing unit (CPU). The motherboard is vertically disposed in the case assembly. The first main connector is disposed on the motherboard and electrically connected to the motherboard. The adapter is electrically connected to the first main connector and substantially perpendicular to the motherboard. The test connector is disposed on the adapter. The CPU is disposed on the motherboard and electrically connected to the motherboard. The handler inserts a plurality of electronic components into the test connectors in a vertical direction, tests the electronic components and removes the electronic components after the electronic components are tested.