Patents by Inventor Wen-Hsien WU

Wen-Hsien WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF DIE BONDING AND APPARATUS THEREOF
    Publication number: 20140102616
    Abstract: A method of die bonding, the method has steps of: heating a substrate to a predetermined temperature; sucking at least one die, the at least one die with a base temperature, the base temperature being less than the predetermined temperature; the at least one die bonding on the substrate; cooling the substrate with the bonded die; and moving the substrate with the bonded die to a loading and unloading position, heating another substrate to a predetermined temperature, and repeating the said steps.
    Type: Application
    Filed: November 15, 2012
    Publication date: April 17, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Weng-Jung LU, Wen-Hsien WU, Chun-Hsien SU