Abstract: Examples disclosed herein relate to device. The device includes a substrate, a plurality of adjacent pixel-defining layer (PDL structures disposed over the substrate, and a plurality of sub-pixels. The PDL structure have a top surface coupled to adjacent sidewalls of the PDL structure. The plurality of sub-pixels are defined by the PDL structures. Each sub-pixel includes an anode, an organic light emitting diode (OLED), a cathode, and an encapsulation layer. The organic light emitting diode (OLED) material disposed over the anode. The OLED material extends over the top surface of the PDL structure past the adjacent sidewalls. The cathode is disposed over the OLED material. The cathode extends over the top surface of the PDL structure past the adjacent sidewalls. The encapsulation layer is disposed over the cathode. The encapsulation layer has a first sidewall and a second sidewall.

Abstract: A display panel includes a circuit substrate, light emitting elements, a side wire, and a chip-on-film package structure. The circuit substrate includes a circuit structure located on a first surface. The side wire includes a first bonding portion disposed on the first surface of the circuit substrate and bonded to the circuit structure, a first extension portion, a second extension portion, and a second bonding portion that are sequentially connected and have the same resistivity. The first extension portion is disposed on a side surface of the circuit substrate. The second extension portion is disposed on a second surface of the circuit substrate and overlapped with a peripheral region. The second bonding portion is disposed on the second surface of the circuit substrate. An orthogonal projection of the second bonding portion is overlapped with a display region. The chip-on-film package structure is bonded to the second bonding portion.

Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.

Abstract: A cell includes a membrane and an actuating layer. The membrane includes a first membrane subpart and a second membrane subpart, wherein the first membrane subpart and the second membrane subpart are opposite to each other. The actuating layer is disposed on the first membrane subpart and the second membrane subpart. The first membrane subpart includes a first anchored edge which is fully or partially anchored, and edges of the first membrane subpart other than the first anchored edge are non-anchored. The second membrane subpart includes a second anchored edge which is fully or partially anchored, and edges of the second membrane subpart other than the second anchored edge are non-anchored.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.

Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: A business method of providing trade and data and analyzing suggestion to product and service platform includes following steps: a step of providing at least one vending machine, wherein a cash flow for a payment is processed by a consumer via the vending machine, and the vending machine provides a logistic flow of supplying product to the buyer; a step of listing at least one supplier; a step of establishing at least one payment mode means; a step of establishing at least one platform; and a step of establishing at least one data analysis; accordingly, the buyer and the supplier can both be provided with the product and the purchase payment in a safe means, the supplier can be prevented from wasting the product via a product data analysis or suggestion, so that the platform and the supplier can both have benefits and share the financial gains.

Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.

Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.

Abstract: A system contains a land grid array socket with a first set of socket interconnections configured to connect to a set of circuit board electrical connectors, each socket interconnection in the first set extending from a top surface to a bottom surface. A second set of socket interconnections are configured to reversibly connect to a set of circuit card electrical connectors. A circuit board can include a mounting surface fastened to the land grid array socket. A set of electrical connectors within a socket connector zone can be connected to at least some of the first set of socket interconnections. A board cutout section is located beneath a second interconnection zone and configured to receive a circuit card.

Abstract: A system contains a land grid array socket with a first set of socket interconnections configured to connect to a set of circuit board electrical connectors, each socket interconnection in the first set extending from a top surface to a bottom surface. A second set of socket interconnections are configured to reversibly connect to a set of circuit card electrical connectors. A circuit board can include a mounting surface fastened to the land grid array socket. A set of electrical connectors within a socket connector zone can be connected to at least some of the first set of socket interconnections. A board cutout section is located beneath a second interconnection zone and configured to receive a circuit card.

Abstract: A flexible circuit board connector with anti-disengagement movable cover collectively assembled and structured to include a lengthwise insulator, a U-shaped movable cover, a number of connecting terminals, and a pair of anti-disengagement panels. When the movable cover is pulled up, frontal sections of wing panels configured on left and right sides of the movable cover are subjected to confinement by blocking panels provided with functionality to fence therein, therewith preventing the wing panels of the movable cover from flexing or deformation, thereby preventing disengagement of the movable cover, and extending applicable life-span of the flexible circuit board connector, as well as enhancing an electrical connection of a flexible flat cable and the flexible circuit board connector therebetween.

Abstract: A connector module for communication includes a main body, a slider, a holder, a protrusion and an elastic member. The slider is telescoped into the protrusion and connected with the holder. The holder slides the slider, enabling the protrusion to move in and out from the main body, so that the main body can be detachably assembled with a casing.

Abstract: A connector module for communication includes a main body, a slider, a holder, a protrusion and an elastic member. The slider is telescoped into the protrusion and connected with the holder. The holder slides the slider, enabling the protrusion to move in and out from the main body, so that the main body can be detachably assembled with a casing.

Abstract: A flexible circuit board connector engaging structure capable of preventing a movable cover from disengaging with an insulation body includes inverted L-shaped ribs at front ends of flanks at the movable cover and for retaining movements of the movable cover. When the movable cover is moved to a located position, the inverted L-shaped ribs are retained by block panels of locating members, such that the movable cover cannot be further pulled outward. Meanwhile, front sections of the flanks at the movable cover are also tugged by the block panels of the locating members without being expanded outward, thereby preventing deformation and bending of the flanks at the movable cover as well as preventing the movable cover disengaging from the flexible circuit board connector. Thus, lifespan of the flexible circuit board connector is prolonged while also enhancing electric connection between a flexible flat cable (FFC) and the flexible circuit board connector.

Abstract: A flexible circuit board connector engaging structure capable of preventing a movable cover from disengaging with an insulation body includes inverted L-shaped ribs at front ends of flanks at the movable cover and for retaining movements of the movable cover. When the movable cover is moved to a located position, the inverted L-shaped ribs are retained by block panels of locating members, such that the movable cover cannot be further pulled outward. Meanwhile, front sections of the flanks at the movable cover are also tugged by the block panels of the locating members without being expanded outward, thereby preventing deformation and bending of the flanks at the movable cover as well as preventing the movable cover disengaging from the flexible circuit board connector. Thus, lifespan of the flexible circuit board connector is prolonged while also enhancing electric connection between a flexible flat cable (FFC) and the flexible circuit board connector.