Patents by Inventor Wen-Hsin Chen

Wen-Hsin Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11227272
    Abstract: A business method of providing trade and data and analyzing suggestion to product and service platform includes following steps: a step of providing at least one vending machine, wherein a cash flow for a payment is processed by a consumer via the vending machine, and the vending machine provides a logistic flow of supplying product to the buyer; a step of listing at least one supplier; a step of establishing at least one payment mode means; a step of establishing at least one platform; and a step of establishing at least one data analysis; accordingly, the buyer and the supplier can both be provided with the product and the purchase payment in a safe means, the supplier can be prevented from wasting the product via a product data analysis or suggestion, so that the platform and the supplier can both have benefits and share the financial gains.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: January 18, 2022
    Assignee: EZ PLATFORM
    Inventors: Wen-Hsin Chen, Jack Tseng, Hai-Wei Lin
  • Patent number: 9484649
    Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: November 1, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.
    Inventors: Brian Samuel Beaman, Wen Hsin Chen
  • Publication number: 20160226166
    Abstract: An electromechanical assembly includes a socket housing having a cavity for seating an integrated circuit and a first plurality of electrical contacts in the cavity to electrically connect an integrated circuit seated in the socket housing with a circuit board upon which the electromechanical assembly is mounted. The socket housing has a supporting body on a different plane than a bottom surface of the cavity. The socket housing has a second plurality of electrical contacts that form a first row across the supporting body and a third plurality of electrical contacts that form a second row across the supporting body. The socket housing has alignment elements. The electromechanical assembly also includes a card edge connector having slots that accept the alignment elements of the socket housing, a fourth plurality of electrical contacts that form a third row, and a fifth plurality of electrical contacts that form a fourth row.
    Type: Application
    Filed: January 30, 2015
    Publication date: August 4, 2016
    Inventors: Brian Samuel Beaman, Wen Hsin Chen
  • Publication number: 20160036153
    Abstract: A system contains a land grid array socket with a first set of socket interconnections configured to connect to a set of circuit board electrical connectors, each socket interconnection in the first set extending from a top surface to a bottom surface. A second set of socket interconnections are configured to reversibly connect to a set of circuit card electrical connectors. A circuit board can include a mounting surface fastened to the land grid array socket. A set of electrical connectors within a socket connector zone can be connected to at least some of the first set of socket interconnections. A board cutout section is located beneath a second interconnection zone and configured to receive a circuit card.
    Type: Application
    Filed: August 4, 2014
    Publication date: February 4, 2016
    Inventors: Brian S. Beaman, Wen-Hsin Chen
  • Patent number: 9252521
    Abstract: A system contains a land grid array socket with a first set of socket interconnections configured to connect to a set of circuit board electrical connectors, each socket interconnection in the first set extending from a top surface to a bottom surface. A second set of socket interconnections are configured to reversibly connect to a set of circuit card electrical connectors. A circuit board can include a mounting surface fastened to the land grid array socket. A set of electrical connectors within a socket connector zone can be connected to at least some of the first set of socket interconnections. A board cutout section is located beneath a second interconnection zone and configured to receive a circuit card.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: February 2, 2016
    Assignee: Lenovo Enterprise Solutions (Singapore) PTE. LTD.
    Inventors: Brian S. Beaman, Wen-Hsin Chen
  • Publication number: 20110104939
    Abstract: A flexible circuit board connector with anti-disengagement movable cover collectively assembled and structured to include a lengthwise insulator, a U-shaped movable cover, a number of connecting terminals, and a pair of anti-disengagement panels. When the movable cover is pulled up, frontal sections of wing panels configured on left and right sides of the movable cover are subjected to confinement by blocking panels provided with functionality to fence therein, therewith preventing the wing panels of the movable cover from flexing or deformation, thereby preventing disengagement of the movable cover, and extending applicable life-span of the flexible circuit board connector, as well as enhancing an electrical connection of a flexible flat cable and the flexible circuit board connector therebetween.
    Type: Application
    Filed: January 22, 2004
    Publication date: May 5, 2011
    Inventors: Hsien-Yu Chiu, Wen-Hsin Chen
  • Patent number: 7381077
    Abstract: A connector module for communication includes a main body, a slider, a holder, a protrusion and an elastic member. The slider is telescoped into the protrusion and connected with the holder. The holder slides the slider, enabling the protrusion to move in and out from the main body, so that the main body can be detachably assembled with a casing.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: June 3, 2008
    Assignee: Delta Electronics, Inc.
    Inventors: Wen-Hsin Chen, Chih-Hslao Chen
  • Publication number: 20060281357
    Abstract: A connector module for communication includes a main body, a slider, a holder, a protrusion and an elastic member. The slider is telescoped into the protrusion and connected with the holder. The holder slides the slider, enabling the protrusion to move in and out from the main body, so that the main body can be detachably assembled with a casing.
    Type: Application
    Filed: March 7, 2006
    Publication date: December 14, 2006
    Inventors: Wen-Hsin Chen, Chih-Hslao Chen
  • Patent number: 6971901
    Abstract: A flexible circuit board connector engaging structure capable of preventing a movable cover from disengaging with an insulation body includes inverted L-shaped ribs at front ends of flanks at the movable cover and for retaining movements of the movable cover. When the movable cover is moved to a located position, the inverted L-shaped ribs are retained by block panels of locating members, such that the movable cover cannot be further pulled outward. Meanwhile, front sections of the flanks at the movable cover are also tugged by the block panels of the locating members without being expanded outward, thereby preventing deformation and bending of the flanks at the movable cover as well as preventing the movable cover disengaging from the flexible circuit board connector. Thus, lifespan of the flexible circuit board connector is prolonged while also enhancing electric connection between a flexible flat cable (FFC) and the flexible circuit board connector.
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: December 6, 2005
    Assignee: P-Two Industries Inc.
    Inventors: Hsien-Yu Chiu, Wen-Hsin Chen
  • Publication number: 20050095894
    Abstract: A flexible circuit board connector engaging structure capable of preventing a movable cover from disengaging with an insulation body includes inverted L-shaped ribs at front ends of flanks at the movable cover and for retaining movements of the movable cover. When the movable cover is moved to a located position, the inverted L-shaped ribs are retained by block panels of locating members, such that the movable cover cannot be further pulled outward. Meanwhile, front sections of the flanks at the movable cover are also tugged by the block panels of the locating members without being expanded outward, thereby preventing deformation and bending of the flanks at the movable cover as well as preventing the movable cover disengaging from the flexible circuit board connector. Thus, lifespan of the flexible circuit board connector is prolonged while also enhancing electric connection between a flexible flat cable (FFC) and the flexible circuit board connector.
    Type: Application
    Filed: February 2, 2004
    Publication date: May 5, 2005
    Inventors: Hsien-Yu Chiu, Wen-Hsin Chen
  • Patent number: 5421853
    Abstract: A binder composition for use in making metal parts via a metal powder injection molding process containing the following components: (a) a first polymer with a relatively low solubility parameter such as polyethylene and polypropylene; (b) a second polymer with a relatively high solubility parameter such as polystyrene and poly(methyl methacrylate); and (c) a block copolymer containing blocks of the first and second, or other structurally similar, constituting monomeric units. Examples of the block copolymers include ethylene/styrene copolymer, propylene/styrene copolymer, and isoprene/styrene copolymer, etc. The binder composition is dispersed in an appropriate dispersant, such as an oil or wax, then blended with a metal powder to form a metal powder injection composition. The metal powder injection composition forms a green compact with a predetermined shape and dimension using an injection molding machine. Finally the green compact is sintered to form the final product.
    Type: Grant
    Filed: August 9, 1994
    Date of Patent: June 6, 1995
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Hsin Chen, Minh-Jhy Jiang, Chao-Shiun Lin, Kuo-Yao Weng, Ming-Shyong Lai, Jiann-Tsair Jeng
  • Patent number: D502143
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: February 22, 2005
    Assignee: P-Two Industries Inc.
    Inventors: Hsien-Yu Chiu, Wen-Hsin Chen
  • Patent number: D502686
    Type: Grant
    Filed: February 2, 2004
    Date of Patent: March 8, 2005
    Assignee: P-Two Industries Inc.
    Inventors: Hsien-Yu Chiu, Wen-Hsin Chen