Abstract: An integrated chip of a mobile device includes a substrate, a modulator installed on the substrate for modulating a voice signal, a transmitter installed on the substrate and coupled to the modulator for transmitting the modulated voice signal by radio, and a controller installed on the substrate and coupled to the modulator and the transmitter for controlling the modulator and the transmitter.

Abstract: An automatic-packaging apparatus which can package an optical sensing module with a preferred distance between a lens and an optical sensor includes a base, an image-analyzing module, a distance-adjusting module, and a stain-detecting module. The automatic-packaging apparatus packages a lens and an optical sensor separated in a preferred distance into an optical sensing module, and is able to detect if there are stains on the lens or there are flaws in the optical sensor. The advantages of the automatic-packaging apparatus are to package and detect optical modules quickly, efficiently and accurately.