Patents by Inventor Wen-Hsin Wang

Wen-Hsin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240107414
    Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for switching a secondary cell to a primary cell. A user equipment (UE) monitors a first radio condition of the UE for beams of a primary cell and a second radio condition for beams of one or more secondary cells configured for the UE in carrier aggregation. The UE transmits a request to configure a candidate beam of at least one candidate secondary cell as a new primary cell in response to the first radio condition not satisfying a first threshold and the second radio condition for the at least one candidate secondary cell satisfying a second threshold. A base station determines to reconfigure at least one secondary cell as the new primary cell. The base station and the UE perform a handover of the UE to the new primary cell.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 28, 2024
    Inventors: Yu-Chieh HUANG, Kuhn-Chang LIN, Jen-Chun CHANG, Wen-Hsin HSIA, Chia-Jou LU, Sheng-Chih WANG, Chenghsin LIN, Yeong Leong CHOO, Chun-Hsiang CHIU, Chihhung HSIEH, Kai-Chun CHENG, Chung Wei LIN
  • Patent number: 11931187
    Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 19, 2024
    Assignees: Chang Gung Medical Foundation Chang Gung Memorial Hospital at Keelung, Chang Gung Memorial Hospital, Linkou, Chang Gung University
    Inventors: Jiun-Jie Wang, Yi-Hsin Weng, Shu-Hang Ng, Jur-Shan Cheng, Yi-Ming Wu, Yao-Liang Chen, Wey-Yil Lin, Chin-Song Lu, Wen-Chuin Hsu, Chia-Ling Chen, Yi-Chun Chen, Sung-Han Lin, Chih-Chien Tsai
  • Patent number: 11929434
    Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 12, 2024
    Assignee: eMemory Technology Inc.
    Inventors: Chih-Hsin Chen, Shih-Chen Wang, Tsung-Mu Lai, Wen-Hao Ching, Chun-Yuan Lo, Wei-Chen Chang
  • Publication number: 20240047336
    Abstract: An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. Further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. Therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.
    Type: Application
    Filed: November 7, 2022
    Publication date: February 8, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Ching-Chih Lin, Wen-Hsin Wang, Chieh-Yi Hsieh, Shin-Yu Wang, Yi-Chien Huang, Hsiu-Fang Chien
  • Publication number: 20150022493
    Abstract: A touch pen includes a power supply circuit, a signal-receiving electrode, a noise-sensing electrode, an inverted amplifying circuit, and a signal-emitting electrode. The power supply circuit provides the touch pen with a working voltage, the signal-receiving electrode receiving at least one surface signal of a touch-sensing electrode structure of a capacitive touch-sensitive device, and the noise-sensing electrode receives at least one ambient noise signal. The inverted amplifying circuit reversely amplifies a difference between the surface signal and the ambient noise signal to generate a reversely amplified signal, and the signal-emitting electrode emits the reversely amplified signal to attenuate a detection signal of the capacitive touch-sensitive device in a position coinciding with a touch point of the touch pen.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 22, 2015
    Inventors: Shyh-Jeng CHEN, Chong-Wei LI, Wen-Hsin WANG, Tsung-Yu WANG, Chih-Chiang LIN
  • Publication number: 20130339444
    Abstract: Electronic data exchange system includes a transmitting portable electronic device and a server. The transmitting portable electronic device has an application program. A user of the transmitting portable electronic device utilizes the application program to generate an electronic data transmission control command. The server includes a data base. The data base stores an electronic data album of the user. When the server transmits electronic data of the user to at least one receiving portable electronic device, and transmits electronic data of at least one user of the at least one receiving portable electronic device to the transmitting portable electronic device according to the electronic data transmission control command, the server updates the electronic data album according to the electronic data of the at least one user.
    Type: Application
    Filed: June 13, 2013
    Publication date: December 19, 2013
    Inventors: Ming-Chuan Lin, Wen-Hung Wang, Hsuan-Kuang Chen, Li-Sheng Lu, Yuan-Siang Song, Wen-Hsin Wang
  • Publication number: 20120223919
    Abstract: A touch pen includes a power supply circuit, a signal-receiving electrode, an inverted amplifying circuit and a signal-emitting electrode. The power supply circuit provides the touch pen with a working voltage, and the signal-receiving electrode receives at least one surface signal of a touch-sensing structure of a capacitive touch-sensitive device. The inverted amplifying circuit reversely amplifies the surface signal to generate a reversely amplified signal, and the signal-emitting electrode emits the reversely amplified signal to attenuate a detection signal of the capacitive touch-sensitive device in a position coinciding with a touch point of the touch pen.
    Type: Application
    Filed: March 1, 2012
    Publication date: September 6, 2012
    Inventors: Ming-Chuan LIN, Wen-Hung Wang, Chih-Chiang Lin, Shyh-Jeng Chen, Jer-Yann Huang, Wen-Hsin Wang
  • Patent number: 8168902
    Abstract: An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: May 1, 2012
    Assignee: Wistron Corporation
    Inventors: Wen-Lang Tang, Wen-Hsin Wang
  • Patent number: 8138434
    Abstract: A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: March 20, 2012
    Assignee: Wistron Corporation
    Inventors: Wen-Lang Tang, Wen-Hsin Wang
  • Publication number: 20100059347
    Abstract: An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.
    Type: Application
    Filed: January 8, 2009
    Publication date: March 11, 2010
    Inventors: Wen-Lang TANG, Wen-Hsin Wang
  • Publication number: 20100044198
    Abstract: A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.
    Type: Application
    Filed: June 16, 2009
    Publication date: February 25, 2010
    Inventors: Wen-Lang Tang, Wen-Hsin Wang
  • Publication number: 20060060958
    Abstract: A semiconductor package, and a fabrication method and a carrier thereof are provided. The fabrication method includes: preparing a core layer having a first surface and an opposed second surface, wherein the first and second surfaces are electrically connected to each other by a plurality of conductive vias; forming a plurality of bond pads on the second surface, wherein the bond pads are electrically connected to the conductive vias, and each of the conductive vias is partly located within a boundary of a corresponding one of the bond pads and is partly located out of the boundary of the corresponding bond pad, such that the carrier is fabricated; mounting and electrically connecting a chip to the first surface; forming an encapsulant on the first surface to encapsulate the chip; and forming solder joints on the bond pads of the second surface. By this arrangement, a popcorn effect is avoided.
    Type: Application
    Filed: September 7, 2005
    Publication date: March 23, 2006
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Chien-Te Chen, Wen-Hsin Wang
  • Publication number: 20030037257
    Abstract: A debugging device for detecting or collecting data of a target system for analysis and debugging comprises a user interface, which is used to set triggering data to be recorded and for transfer them to a translator of triggering events. The translator gives a code or index to each triggering event and transfers it to control logic after logic simplification. The control logic sets the simplified data into a programmable comparator, which receives an input signal from the target system to check whether the input signal conforms to a previously set triggering condition. A corresponding code or index of the input data is transferred to the control logic and stored. An analyzer of triggering events retrieves and restores the codes into previously set triggering events from the storage to detect and pick up execution states of the target system operating in a real environment, and then analyzes and debugs them.
    Type: Application
    Filed: August 16, 2002
    Publication date: February 20, 2003
    Inventor: Wen Hsin Wang
  • Patent number: 6465891
    Abstract: An integrated-circuit package with a quick-to-count finger layout design on substrate is proposed, which can help fabrication engineers to visually check the total number of fingers on the substrate in a quick and accurate manner. The proposed integrated-circuit package is characterized by the provision of a line-up array of fingers which includes a plurality of first-shape fingers partitioned equally in number into a plurality of subgroups; and a plurality of second-shape fingers, which are substantially visually distinguishable in outer appearance from the first-shape fingers, and which are interposed between adjacent subgroups of the first-shape fingers to serve as count tokens. This finger layout design allows the fabrication engineers to visually check the total number of the line-up array of fingers on the substrate simply by counting through the second-shape fingers that serve as count tokens and then multiply the result by the number of first-shape fingers in each subgroup plus one.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: October 15, 2002
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Wen-Hsin Wang, Chih-Chin Liao
  • Publication number: 20020096788
    Abstract: An integrated-circuit package with a quick-to-count finger layout design on substrate is proposed, which can help fabrication engineers to visually check the total number of fingers on the substrate in a quick and accurate manner. The proposed integrated-circuit package is characterized by the provision of a line-up array of fingers which includes a plurality of first-shape fingers partitioned equally in number into a plurality of subgroups; and a plurality of second-shape fingers, which are substantially visually distinguishable in outer appearance from the first-shape fingers, and which are interposed between adjacent subgroups of the first-shape fingers to serve as count tokens. This finger layout design allows the fabrication engineers to visually check the total number of the line-up array of fingers on the substrate simply by counting through the second-shape fingers that serve as count tokens and then multiply the result by the number of first-shape fingers in each subgroup plus one.
    Type: Application
    Filed: January 19, 2001
    Publication date: July 25, 2002
    Inventors: Wen-Hsin Wang, Chih-Chin Liao
  • Patent number: 6396784
    Abstract: An audio compact disc title with a high density format adapted to be used in a compact disc player is disclosed. The audio compact disc title includes a plurality of tracks, each of the tracks has a plurality of audio sectors for storing audio data, wherein the audio data are divided into a plurality of audio signals alternately stored in the audio sectors, and a compact disc identifying code for representing the relatively high density format of the audio compact disc title for the compact disc player. A method for recording audio data in an audio compact disc title with a high density format is also disclosed. The method includes steps of dividing the audio data into a plurality of audio signals, rearranging the plurality of audio signals to space any two continuous audio signals by other audio signals, and recording the rearranged audio signals in the audio compact disc title.
    Type: Grant
    Filed: April 16, 1999
    Date of Patent: May 28, 2002
    Assignee: Winbond Electronics Corp.
    Inventors: Hung-Min Wang, Chung-Ying Chen, Wen-Hsin Wang