Abstract: An electronic package and a carrier structure thereof are provided, in which the carrier structure is used for disposing a semiconductor chip and defined with a die placement area and a peripheral area adjacent to the die placement area on a surface thereof, and a winding shape of conductive traces arranged at a boundary between the die placement area and the peripheral area is a continuous bending shape with notches to facilitate dispersion of thermal stress, thereby preventing the problem of breakage from occurring to line segments of the conductive traces.

Abstract: An electronic package is provided, in which an electronic element is arranged on a carrier structure having a plurality of wire-bonding pads arranged on a surface of the carrier structure, and a plurality of bonding wires are connected to a plurality of electrode pads of the electronic element and the plurality of wire-bonding pads. Further, among any three adjacent ones of the plurality of wire-bonding pads, a long-distanced first wire-bonding pad, a middle-distanced second wire-bonding pad and a short-distanced third wire-bonding pad are defined according to their distances from the electronic element. Therefore, even if the bonding wires on the first to third wire-bonding pads are impacted by an adhesive where a wire sweep phenomenon occurred when the flowing adhesive of a packaging layer covers the electronic element and the bonding wires, the bonding wires still would not contact each other, thereby avoiding short circuit problems.

Abstract: A touch pen includes a power supply circuit, a signal-receiving electrode, a noise-sensing electrode, an inverted amplifying circuit, and a signal-emitting electrode. The power supply circuit provides the touch pen with a working voltage, the signal-receiving electrode receiving at least one surface signal of a touch-sensing electrode structure of a capacitive touch-sensitive device, and the noise-sensing electrode receives at least one ambient noise signal. The inverted amplifying circuit reversely amplifies a difference between the surface signal and the ambient noise signal to generate a reversely amplified signal, and the signal-emitting electrode emits the reversely amplified signal to attenuate a detection signal of the capacitive touch-sensitive device in a position coinciding with a touch point of the touch pen.

Abstract: Electronic data exchange system includes a transmitting portable electronic device and a server. The transmitting portable electronic device has an application program. A user of the transmitting portable electronic device utilizes the application program to generate an electronic data transmission control command. The server includes a data base. The data base stores an electronic data album of the user. When the server transmits electronic data of the user to at least one receiving portable electronic device, and transmits electronic data of at least one user of the at least one receiving portable electronic device to the transmitting portable electronic device according to the electronic data transmission control command, the server updates the electronic data album according to the electronic data of the at least one user.

Abstract: A touch pen includes a power supply circuit, a signal-receiving electrode, an inverted amplifying circuit and a signal-emitting electrode. The power supply circuit provides the touch pen with a working voltage, and the signal-receiving electrode receives at least one surface signal of a touch-sensing structure of a capacitive touch-sensitive device. The inverted amplifying circuit reversely amplifies the surface signal to generate a reversely amplified signal, and the signal-emitting electrode emits the reversely amplified signal to attenuate a detection signal of the capacitive touch-sensitive device in a position coinciding with a touch point of the touch pen.

Abstract: An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.

Abstract: A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.

Abstract: An electrical device includes a housing, a circuit unit disposed in the housing, a waterproof keypad disposed in the housing at a position above the circuit unit, and a press member. The waterproof keypad includes a rigid layer, a resilient pad body, a waterproofing ring, and a plurality of keys. The press member is connected to the housing and presses against the rigid layer. The waterproofing ring is connected to a bottom face of the resilient pad body, abuts against the housing, and surrounds the circuit unit. A portion of a top face of the resilient pad body is connected immovably to a bottom face of the rigid layer. Another portion of the top face of the resilient pad body is exposed from the rigid layer. The keys are connected to the exposed portion of the top face of the resilient pad body and are exposed from the rigid layer.

Abstract: A waterproof press key includes a key body, a rigid support component, and a waterproofing ring. The key body is made of a resilient material, and includes a top wall and a surrounding wall extending downwardly from the top wall. The rigid support component includes a supporting portion that is disposed at the surrounding wall. The waterproofing ring projects from the outer wall surface of the surrounding wall. The supporting portion overlaps with at least a part of a height section of the surrounding wall from which the waterproofing ring projects to thereby enhance the waterproofing effect of the waterproof press key.

Abstract: A semiconductor package, and a fabrication method and a carrier thereof are provided. The fabrication method includes: preparing a core layer having a first surface and an opposed second surface, wherein the first and second surfaces are electrically connected to each other by a plurality of conductive vias; forming a plurality of bond pads on the second surface, wherein the bond pads are electrically connected to the conductive vias, and each of the conductive vias is partly located within a boundary of a corresponding one of the bond pads and is partly located out of the boundary of the corresponding bond pad, such that the carrier is fabricated; mounting and electrically connecting a chip to the first surface; forming an encapsulant on the first surface to encapsulate the chip; and forming solder joints on the bond pads of the second surface. By this arrangement, a popcorn effect is avoided.

Abstract: A debugging device for detecting or collecting data of a target system for analysis and debugging comprises a user interface, which is used to set triggering data to be recorded and for transfer them to a translator of triggering events. The translator gives a code or index to each triggering event and transfers it to control logic after logic simplification. The control logic sets the simplified data into a programmable comparator, which receives an input signal from the target system to check whether the input signal conforms to a previously set triggering condition. A corresponding code or index of the input data is transferred to the control logic and stored. An analyzer of triggering events retrieves and restores the codes into previously set triggering events from the storage to detect and pick up execution states of the target system operating in a real environment, and then analyzes and debugs them.

Abstract: An integrated-circuit package with a quick-to-count finger layout design on substrate is proposed, which can help fabrication engineers to visually check the total number of fingers on the substrate in a quick and accurate manner. The proposed integrated-circuit package is characterized by the provision of a line-up array of fingers which includes a plurality of first-shape fingers partitioned equally in number into a plurality of subgroups; and a plurality of second-shape fingers, which are substantially visually distinguishable in outer appearance from the first-shape fingers, and which are interposed between adjacent subgroups of the first-shape fingers to serve as count tokens. This finger layout design allows the fabrication engineers to visually check the total number of the line-up array of fingers on the substrate simply by counting through the second-shape fingers that serve as count tokens and then multiply the result by the number of first-shape fingers in each subgroup plus one.

Abstract: An integrated-circuit package with a quick-to-count finger layout design on substrate is proposed, which can help fabrication engineers to visually check the total number of fingers on the substrate in a quick and accurate manner. The proposed integrated-circuit package is characterized by the provision of a line-up array of fingers which includes a plurality of first-shape fingers partitioned equally in number into a plurality of subgroups; and a plurality of second-shape fingers, which are substantially visually distinguishable in outer appearance from the first-shape fingers, and which are interposed between adjacent subgroups of the first-shape fingers to serve as count tokens. This finger layout design allows the fabrication engineers to visually check the total number of the line-up array of fingers on the substrate simply by counting through the second-shape fingers that serve as count tokens and then multiply the result by the number of first-shape fingers in each subgroup plus one.

Abstract: An audio compact disc title with a high density format adapted to be used in a compact disc player is disclosed. The audio compact disc title includes a plurality of tracks, each of the tracks has a plurality of audio sectors for storing audio data, wherein the audio data are divided into a plurality of audio signals alternately stored in the audio sectors, and a compact disc identifying code for representing the relatively high density format of the audio compact disc title for the compact disc player. A method for recording audio data in an audio compact disc title with a high density format is also disclosed. The method includes steps of dividing the audio data into a plurality of audio signals, rearranging the plurality of audio signals to space any two continuous audio signals by other audio signals, and recording the rearranged audio signals in the audio compact disc title.