Abstract: An electromagnetic interference (EMI) shield for reducing the electromagnetic interference and substantially uniformly distribute heat is disclosed. The EMI shield comprises a first layer configured to shield EMI and a second layer configured to dissipate heat. The EMI shield further comprises an interface. Some embodiments also provide methods for shielding EMI and uniformly dissipate heat of an electronic component.

Abstract: A base structure can support a monitor. A fixed portion is firmly disposed on the rear casing of the monitor and contains at least one slide rail. A slide portion can move up and down the slide rail. A spring is linked to the fixed portion and the slide portion. One end of the push bar is pivotally linked to the slide portion. A first stand is firmly disposed on the rear casing. A second stand is pivotally linked to the first stand. Another end of the push bar is pivotally linked to the second stand. In this manner, the monitor may adjust the expanding angle of the second stand so as to place the monitor on the desk or hang the monitor on the wall.

Abstract: The present invention is related to a base structure which can support a monitor. A fixed portion is firmly disposed on the rear casing of the monitor and contains at least one slide rail. A slide portion can move up and down by means of the slide rail. A spring is linked to the fixed portion and the slide portion. One end of the push bar is pivotally linked to the slide portion. A first stand is firmly disposed on the rear casing. A second stand is pivotally linked to the first stand. Another end of the push bar is pivotally linked to the second stand. In this manner, the monitor may adjust the expanding angle of the second stand so as to place the monitor on the desk or hang the monitor on the wall.

Abstract: A method for ground noise suppression is applied to a power loop of a circuit board by reducing the effects caused by electromagnetic interference (EMI). The power loop at least includes a switch driver and two or more passive components. The method of the present invention is to connect ground connecting pins of the passive components to a digital ground in an inner layer of the circuit board via a power ground in an outer layer of the circuit board, which is connected to a ground connecting pin of the switch driver connecting to the digital ground, restraining the loop path of the power loop. The connecting style of this power loop is used to actively implement more direct connections among the components in the power loop, thus preventing ground noise from radiating via different paths due to excessive loop path length. Therefore, the random distribution of power can be prevented and EMI interference to surrounding electronic components can be beneficially reduced.

Abstract: The present invention relates to a method for sorting and transmitting a data packet which is applied to a LAN.