Patents by Inventor Wen-Hsiung JIANG

Wen-Hsiung JIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11788796
    Abstract: A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: October 17, 2023
    Assignee: NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION
    Inventors: Wen-Hsiung Jiang, Chun-An Shen, Chien-Cheng Huang
  • Publication number: 20230047466
    Abstract: A heat conduction device with an inner loop includes a vapor chamber having at least one hole edge and a heat pipe having an outer pipe and an inner pipe. The outer pipe has a closed end and an open end communicating with the hole edge. Two ends of the inner pipe are open. The inner pipe has one end communicating with the vapor chamber through the hole edge and the other end extended along the axial direction of the outer pipe to form at least one port for communicating the closed end of the outer pipe with the inner pipe. The inner pipe is located inside the outer pipe to form a gap annularly. The port communicates with the gap, so that the inner loop is formed between the vapor chamber and the heat pipe.
    Type: Application
    Filed: August 10, 2021
    Publication date: February 16, 2023
    Inventors: Wen-Hsiung JIANG, Chun-An SHEN, Chien-Cheng HUANG
  • Publication number: 20190301813
    Abstract: A sleeve-type heat conducting structure includes a heat conducting device (1), a sleeve (2), and a heat pipe (3). The heat conducting device (1) has a working portion (10) and a sleeve-connecting portion (11); a fitting hole (110) is disposed in the sleeve-connecting portion (11) such that the sleeve (2) is fastened in the fitting hole (110). The heat pipe (3) has an end disposed movably in the sleeve (2) and the other end exposed out of the sleeve (2) in which the end of the heat pipe (3) sleeved into the sleeve (2) can slide axially in the sleeve (2) and the heat pipe (3) can rotate with respect to the heat conducting device (1) through the sleeve (2).
    Type: Application
    Filed: March 15, 2019
    Publication date: October 3, 2019
    Inventors: Pang-Hung LIAO, Kuo-Feng TSENG, Wen-Hsiung JIANG