Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.

Abstract: Induced surface reconstruction of silicone rubber by blending silicone gel reactants with a modified and curing with a mold having high critical surface tension was used to improve the adhesion of chemically inert silicone rubber to polyurethane. The modifier has the following formula wherein m=25˜50; R1, R2, R3, R4, R11 and R12 independently are alkyl; R′ is R or OR, wherein R is a polymer backbone having a molecular weight of 1000˜20000. The mold is formed with a material having a critical surface tension greater than that of a polymer having a repeating unit of said R.

Abstract: Induced surface reconstruction of silicone rubber by blending silicone gel reactants of addition type with a modifier and curing with a mold having a high critical surface tension was used to improve the adhesion of chemically inert silicone rubber to polyurethane. The modifier has the following formula wherein m=25˜50; R1, R2, R3, and R4 independently are alkyl; R′ is R or OR, wherein R is a polymer backbone having a molecular weight of 1000˜20000. The mold is formed with a material having a critical surface tension greater than that of a polymer having a repeating unit of said R.