Patents by Inventor Wen-hsiung Lee

Wen-hsiung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124528
    Abstract: The present invention relates to an antagonist of interleukin-17B receptor (IL-17RB) which features interruption of the interaction of IL-17RB and MLK4. The present invention also relates to use of such antagonist for treatment of diseases or disorders associated with IL-17RB activation. Further disclosed is a phosphorylated IL-17RB as a biomarker for predicting prognosis and/or monitoring progression of cancer.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 18, 2024
    Applicant: Academia Sinica
    Inventors: Wen-Hwa LEE, Heng-Hsiung WU, Chun-Mei HU, Chun-Kai HUANG
  • Publication number: 20240124298
    Abstract: Microelectromechanical devices and methods of manufacture are presented. Embodiments include bonding a mask substrate to a first microelectromechanical system (MEMS) device. After the bonding has been performed, the mask substrate is patterned. A first conductive pillar is formed within the mask substrate, and a second conductive pillar is formed within the mask substrate, the second conductive pillar having a different height from the first conductive pillar. The mask substrate is then removed.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 18, 2024
    Inventors: Yun-Chung Wu, Jhao-Yi Wang, Hao Chun Yang, Pei-Wei Lee, Wen-Hsiung Lu
  • Patent number: 11961762
    Abstract: A method includes forming a first conductive feature, depositing a passivation layer on a sidewall and a top surface of the first conductive feature, etching the passivation layer to reveal the first conductive feature, and recessing a first top surface of the passivation layer to form a step. The step comprises a second top surface of the passivation layer. The method further includes forming a planarization layer on the passivation layer, and forming a second conductive feature extending into the passivation layer to contact the first conductive feature.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Da Cheng, Tzy-Kuang Lee, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang
  • Publication number: 20240120207
    Abstract: A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lung-Kai Mao, Wen-Hsiung Lu, Pei-Wei Lee, Szu-Hsien Lee, Chieh-Ning Feng
  • Patent number: 10821728
    Abstract: A printing system includes a controller and a thermal printing head including multiple driving elements and an integrated transmission control interface. The thermal printing head is coupled to the controller. The driving elements are configured to print. The integrated transmission control interface coupled to the controller and driving elements is configured to receive from the controller at least one of a compensation data, a printing data, a clock signal, a data signal, a latch signal or a start-heating signal, and send to driving elements the at least one of the compensation data, the printing data, the clock signal, the data signal, the latch signal or the start-heating signal.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: November 3, 2020
    Assignee: Chien Hwa Coating Technology, Inc.
    Inventors: Wen-Hsiung Lee, Chun-Fei Lin, Shao-Ying Lu, Wei-Sheng Huang, Hsin-Kai Wang
  • Publication number: 20200108602
    Abstract: A printing system includes a controller and a thermal printing head including multiple driving elements and an integrated transmission control interface. The thermal printing head is coupled to the controller. The driving elements are configured to print. The integrated transmission control interface coupled to the controller and driving elements is configured to receive from the controller at least one of a compensation data, a printing data, a clock signal, a data signal, a latch signal or a start-heating signal, and send to driving elements the at least one of the compensation data, the printing data, the clock signal, the data signal, the latch signal or the start-heating signal.
    Type: Application
    Filed: October 25, 2018
    Publication date: April 9, 2020
    Inventors: Wen-Hsiung LEE, Chun-Fei LIN, Shao-Ying LU, Wei-Sheng HUANG, Hsin-Kai WANG
  • Patent number: 9718184
    Abstract: A tool box contains a body, at least one cover, and at least one fixer. The body includes at least one first accommodating portion for accommodating plural first tools and includes at least one display zone in which at least one holding portion is defined to hold at least one second tool. The at least one fixer is disposed in the at least one display zone of the body, and each of the at least one fixer includes at least one stopper to fix the at least one second tool in the at least one display zone. The at least one cover covers the body and includes at least one receiving groove formed therein and corresponding to the at least one display zone of the body to expose the at least one second tool in the at least one display zone of the body.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: August 1, 2017
    Inventor: Wen-Hsiung Lee
  • Publication number: 20170057078
    Abstract: A tool box contains a body, at least one cover, and at least one fixer. The body includes at least one first accommodating portion for accommodating plural first tools and includes at least one display zone in which at least one holding portion is defined to hold at least one second tool. The at least one fixer is disposed in the at least one display zone of the body, and each of the at least one fixer includes at least one stopper to fix the at least one second tool in the at least one display zone. The at least one cover covers the body and includes at least one receiving groove formed therein and corresponding to the at least one display zone of the body to expose the at least one second tool in the at least one display zone of the body.
    Type: Application
    Filed: August 24, 2015
    Publication date: March 2, 2017
    Inventor: Wen-Hsiung Lee
  • Publication number: 20120171417
    Abstract: The present invention relates to a method for producing a multi-function polyester film by monolayer extrusion or multilayer extrusion, comprising providing at least one polyester material and at least one polyester material having diffusion particles; melt extruding and then cooling the polyester material rapidly to form a polyester sheet; treating the polyester sheet with biaxially orientation and then cooling the polyester sheet to obtain the polyester film. The method of the present invention provides the multi-function polyester film with a haze value below 95%, and a surface roughness value (Ra) above 0.1 nm.
    Type: Application
    Filed: December 22, 2011
    Publication date: July 5, 2012
    Applicant: SHINKONG MATERIALS TECHNOLOGY CORPORATION
    Inventors: Wen-Hsiung LEE, Jui-Chang HSU, Wen-Hsiang HSU, Chia-Ping CHU
  • Publication number: 20030218669
    Abstract: Imaging offset problems in imaging systems, such as electrophotographic (EPG) printers and copiers, are overcome. Imaging offset results from misaligned exposure units that, when uncompensated, produce dots on a photoreceptor belt at exposure positions that are offset from ideal dot positions. An imaging-offset compensating method of the invention first determines the imaging offset, which is a distance that may include a magnitude and a direction. The imaging offset is determined with respect to the ideal dot position. A time factor is then determined based on the magnitude of the imaging offset for each exposure unit. The time at which each exposure unit is actuated is modified by a respective time factor so that a dot produced by each exposure unit matches the ideal dot location thereof.
    Type: Application
    Filed: March 7, 2003
    Publication date: November 27, 2003
    Inventor: Wen-Hsiung Lee
  • Patent number: 6532029
    Abstract: Imaging offset problems in imaging systems, such as electrophotographic (EPG) printers and copiers, are overcome. Imaging offset results from misaligned exposure units that, when uncompensated, produce dots on a photoreceptor belt at exposure positions that are offset from ideal dot positions. An imaging-offset compensating method of the invention first determines the imaging offset, which is a distance that may include a magnitude and a direction. The imaging offset is determined with respect to the ideal dot position. A time factor is then determined based on the magnitude of the imaging offset for each exposure unit. The time at which each exposure unit is actuated is modified by a respective time factor so that a dot produced by each exposure unit matches the ideal dot location thereof.
    Type: Grant
    Filed: November 21, 2000
    Date of Patent: March 11, 2003
    Assignee: Aetas Technology Incorporated
    Inventor: Wen-hsiung Lee