Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.

Abstract: The invention is relative to an improved press machine which comprises a machine body, a frame, a hydraulically operating unit for raising and lowering the frame, a mechanically operating unit, a ramming means, and a slide body which are in such an arrangement that the frame can be slid up and down, and the slide body can be moved downward until it contacts with a workpiece before the ramming means delivers a blow when the frame is lowered, and can transmit the blow of the ramming means to the workpiece when the ramming means is operated.