Patents by Inventor Wen-Hsu Lien

Wen-Hsu Lien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11642506
    Abstract: Provided is a microneedle patch comprising a substrate part and multiple needle parts protruding from the substrate part. The substrate part consists of a diffusion-proof layer and a base, and each needle part consists of a needle tip, a diffusion-proof layer and a base. The diffusion-proof layer of each needle part is formed between the needle tip and the base of the corresponding needle part. The diffusion-proof layer of the substrate part and the diffusion-proof layer of needle part are one-piece structures, and so are the base of the substrate part and the base of the needle part. The diffusion-proof layer of the microneedle patch can prevent the active ingredients from diffusing to the base, limit the active ingredients to the needle tip and control the carrying quantity thereof.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: May 9, 2023
    Assignee: Win Coat Corporation
    Inventors: Ta-Jo Liu, Wan-Hua Li, Han-Yin Cheng, Yi-Jyun Liao, Wen-Hsu Lien, Shin-Yi Yin, Ying-Hua Hsu, Hsiu-Feng Yeh