Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.

Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.

Abstract: The present disclosure provides a device for ultrasonic sensing, which includes a driver circuit configured to generate an ultrasonic signal, a piezoelectric element having a first electrode and a second electrode, a blocking transistor configured to connect the piezoelectric element with the second electrode to a fixed bias voltage, and a source rectifier including a gate, a drain, and a source electrically connected to the piezoelectric element and the blocking transistor. The piezoelectric element is coupled with the driver circuit with the first electrode. The blocking transistor includes a gate for receiving a blocking control signal, a drain electrically connected to the second electrode of the piezoelectric element, and a source electrically connected to the fixed bias voltage, wherein, in response to the blocking signal, the blocking transistor is configured to be turned on within a transmission period and to be turned off within a receiving period.

Abstract: A touch system, a stylus, a touch apparatus, and a control method of the touch apparatus are provided. The control method includes following steps. At least one characteristic data of at least one input tool is obtained. An identifier of the input tool is generated according to the characteristic data. If a touch operation on the touch panel is performed with the input tool, a specific function of the touch apparatus is determined according to the identifier of the input tool.

Abstract: A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.

Abstract: A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.

Abstract: A touch apparatus and a touch method are provided. The touch apparatus includes a touch panel and a processing unit. The touch panel includes a plurality of sensing electrodes. The touch panel has a first contact surface and a second contact surface. The processing unit is configured to the touch panel. The processing unit receives a touch signal generated by the touch panel sensing a touch operation. The processing unit determines whether the operation is located on the first contact surface or on the second contact surface of the touch panel according to the touch signal and a preset condition. The preset condition is determined by a sensing signal generated by sensing the touch operation touching first contact surface or the second contact surface of the touch panel using at least one of the sensing electrodes.

Abstract: A switched-capacitor circuit comprising a differential operational amplifier and a feedback circuit is described. In some embodiments, the feedback circuit may be configured to provide a reference voltage that is insensitive to temperature and/or process variations. In some embodiments, the feedback circuit may be configured to mitigate the time delay associated with one or more capacitors of the switched-capacitor circuit. The switched-capacitor circuit may be controlled by a pair of control signals. During a first phase, one or more capacitors may be charged, or discharged, through an input signal. During a second phase, the electric charge of the one or more capacitors may be retained.

Abstract: A comparator circuit having an offset voltage includes a first input circuit, a second input circuit and a control circuit. The first input circuit includes a first input terminal receiving a first input signal. The second input circuit includes a second input terminal receiving a second input signal. The control circuit is coupled to a first intermediate terminal and a second intermediate terminal and resets a voltage at the first intermediate terminal and a voltage at the second intermediate terminal according to an offset cancellation voltage. The first intermediate terminal is coupled between the first input terminal and a first output terminal of the comparator circuit, the second intermediate terminal is coupled between the second input terminal and a second output terminal of the comparator circuit, and the first intermediate terminal and the second intermediate terminal are symmetric terminals in the comparator circuit.

Abstract: A current amplifier and a transmitter using the same. The current amplifier has a first and second transistor and a voltage level shifting unit. The first transistor has a gate receiving an input current and a drain receiving a driving current. The voltage level shifting unit providing a voltage shift is coupled between the drain of the first transistor and the gate of the second transistor. An output current is generated at the drain of the second transistor.

Abstract: A switched-capacitor circuit comprising a differential operational amplifier and a feedback circuit is described. In some embodiments, the feedback circuit may be configured to provide a reference voltage that is insensitive to temperature and/or process variations. In some embodiments, the feedback circuit may be configured to mitigate the time delay associated with one or more capacitors of the switched-capacitor circuit. The switched-capacitor circuit may be controlled by a pair of control signals. During a first phase, one or more capacitors may be charged, or discharged, through an input signal. During a second phase, the electric charge of the one or more capacitors may be retained.

Abstract: A touch input device includes a planar location sensing board, a depth sensing layer, a first interpretation unit, a second interpretation unit, and a processing unit. The planar location sensing board senses a first electrical variation of different locations in the directions parallel to the planar location sensing board due to an object approaching or touching the planar location sensing board. The depth sensing layer is disposed below the planar location sensing board and separated by a distance from the planar location sensing board. The depth sensing layer senses a second electrical variation corresponding to a degree in which the object presses the planar location sensing board. The first interpretation unit is electrically connected to the planar location sensing board. The second interpretation unit is electrically connected to the depth sensing layer. The processing unit determines a three-dimensional touch location of the object. A touch sensing method is also provided.

Abstract: A line driver and a method for driving a load are proposed. The line driver includes a current amplifier and a feedback network. The current amplifier has an input node arranged to receive an input current of the line driver, and an output node arranged to produce an output current. The feedback network is coupled between the input node and the output node of the current amplifier, wherein a portion of the output current of the line driver is guided to the feedback network, and an equivalent impedance obtained by looking into the output node of the current amplifier with the feedback network substantially equals an impedance of the load.

Abstract: A touch input device includes a planar location sensing board, a depth sensing layer, a first interpretation unit, a second interpretation unit, and a processing unit. The planar location sensing board senses a first electrical variation of different locations in the directions parallel to the planar location sensing board due to an object approaching or touching the planar location sensing board. The depth sensing layer is disposed below the planar location sensing board and separated by a distance from the planar location sensing board. The depth sensing layer senses a second electrical variation corresponding to a degree in which the object presses the planar location sensing board. The first interpretation unit is electrically connected to the planar location sensing board. The second interpretation unit is electrically connected to the depth sensing layer. The processing unit determines a three-dimensional touch location of the object. A touch sensing method is also provided.

Abstract: An ADC is provided. The ADC includes a plurality of pre-amplifiers, dynamic comparators coupled to the pre-amplifiers, interpolators and an encoder. Each pre-amplifier provides a pair of differential outputs according to a pair of differential analog signals and a first reference voltage and a second reference voltage different from the first reference voltage. Each dynamic comparator provides a first comparing signal and a second comparing signal according to the pair of differential outputs of the corresponding pre-amplifier. Each interpolator provides an interpolating signal according to the first and second comparing signals of two of the dynamic comparators. The encoder provides a digital output according to the interpolating signals. The first and second comparing signals are the same in a reset phase, and the first and second comparing signals are complementary according to the pair of differential outputs of the corresponding pre-amplifier in an evaluation phase.

Abstract: A touch input device including a carrying board, a plurality of first electrode pads, and a plurality of conductive lines is provided. The carrying board includes a plurality of cantilever portions and a plurality of connecting portions. The connecting portions are respectively connected to the cantilever portions. The first electrode pads are respectively disposed on the cantilever portions and configured to sense capacitance variation due to an object approaching or touching the carrying board. The conductive lines extend on the connecting portions and are respectively connected to the first electrode pads. A manufacturing method of a touch input device and a touch sensing method are also provided.

Abstract: A current amplifier and a transmitter using the same. The current amplifier includes: a first transistor having a gate coupled to a former-stage circuit, a drain coupled to a current source, and a source biased at a constant voltage level; a second transistor having a gate coupled to the current source and having a source and a drain; a first impedance circuit coupled between the gate of the first transistor and the source of the second transistor; and a second impedance circuit coupled between the source of the second transistor and a ground terminal. The current amplifier receives an input current from the former-stage circuit and generates an output current at the drain of the second transistor. Note that no current source is connected to the source of the first transistor.

Abstract: A line driver and a method for driving a load are proposed. The line driver includes a current amplifier and a feedback network. The current amplifier has an input node arranged to receive an input current of the line driver, and an output node arranged to produce an output current. The feedback network is coupled between the input node and the output node of the current amplifier, wherein a portion of the output current of the line driver is guided to the feedback network, and an equivalent impedance obtained by looking into the output node of the current amplifier with the feedback network substantially equals an impedance of the load.

Abstract: A grinding wheel includes a base disk, and a plurality of teeth protruding beyond a surface of the base disk. The plurality of teeth is aligned to an elongated ring encircling a center of the grinding wheel.

Abstract: An ADC is provided. The ADC includes a plurality of pre-amplifiers, dynamic comparators coupled to the pre-amplifiers, interpolators and an encoder. Each pre-amplifier provides a pair of differential outputs according to a pair of differential analog signals and a first reference voltage and a second reference voltage different from the first reference voltage. Each dynamic comparator provides a first comparing signal and a second comparing signal according to the pair of differential outputs of the corresponding pre-amplifier. Each interpolator provides an interpolating signal according to the first and second comparing signals of two of the dynamic comparators. The encoder provides a digital output according to the interpolating signals. The first and second comparing signals are the same in a reset phase, and the first and second comparing signals are complementary according to the pair of differential outputs of the corresponding pre-amplifier in an evaluation phase.