Patents by Inventor Wen Hua Lu
Wen Hua Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230387057Abstract: In an embodiment, a device includes: an interposer; a first integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a second integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a buffer layer around the first integrated circuit device and the second integrated circuit device, the buffer layer including a stress reduction material having a first Young's modulus; and an encapsulant around the buffer layer, the first integrated circuit device, and the second integrated circuit device, the encapsulant including a molding material having a second Young's modulus, the first Young's modulus less than the second Young's modulus.Type: ApplicationFiled: August 4, 2023Publication date: November 30, 2023Inventors: Wen-Chih Chiou, Chen-Hua Yu, Shih Ting Lin, Szu-Wei Lu
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Patent number: 11817410Abstract: In an embodiment, a device includes: an interposer; a first integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a second integrated circuit device bonded to the interposer with dielectric-to-dielectric bonds and with metal-to-metal bonds; a buffer layer around the first integrated circuit device and the second integrated circuit device, the buffer layer including a stress reduction material having a first Young's modulus; and an encapsulant around the buffer layer, the first integrated circuit device, and the second integrated circuit device, the encapsulant including a molding material having a second Young's modulus, the first Young's modulus less than the second Young's modulus.Type: GrantFiled: July 28, 2022Date of Patent: November 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wen-Chih Chiou, Chen-Hua Yu, Shih Ting Lin, Szu-Wei Lu
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Publication number: 20230273648Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.Type: ApplicationFiled: February 25, 2022Publication date: August 31, 2023Applicant: Dell Products L.P.Inventors: Kuan-Hua Chiou, Chunpo Chen, Wen-Hsing Lin, Chia-Ting Hu, Yu-Chun Hsieh, Bo-Wei Chu, Jou-Yen Lu
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Patent number: 11728254Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.Type: GrantFiled: May 22, 2020Date of Patent: August 15, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
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Patent number: 11698489Abstract: A method for fabricating a photonic package device is provided. The method includes patterning a semiconductor layer of a semiconductor-on-insulator (SOI) substrate into a waveguide structure and at least one first semiconductor pillar; forming a metal-dielectric stack over the waveguide structure and the first semiconductor pillar; etching an opening in the metal-dielectric stack to expose the first semiconductor pillar; etching an insulator layer of the SOI substrate to form at least one insulator cap below the first semiconductor pillar; and etching a base semiconductor substrate of the SOI substrate to form at least one second semiconductor pillar below the insulator cap.Type: GrantFiled: February 18, 2022Date of Patent: July 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ying-Hua Chen, Hau-Yan Lu, Wen-Chen Lu
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Publication number: 20230151145Abstract: A polymer resin includes a copolymer of polyethylene terephthalate (PET). In the process of preparing PET, part of ethylene glycol is replaced with other components to obtain the copolymer of PET.Type: ApplicationFiled: January 13, 2022Publication date: May 18, 2023Applicant: NAN YA PLASTICS CORPORATIONInventors: Te-Chao Liao, Wen-Hua Lu, Chi-Lin Chen
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Publication number: 20140054111Abstract: A ladder balance adjusting apparatus installed on an n-shaped ladder leg includes an assembly, a base cover, a fixing element, a base cup, a stand rod, and a control element. The assembly has a first component and a second component, and the second component has a side and a bottom to form an L-shaped structure, and after the ladder leg is installed between the two components, the ladder leg is locked by a plurality of locking elements. The base cover is coupled to the assembly and the base cup, and the fixing element is built in the base cover, and the stand rod is provided for passing the aforementioned elements to support the ladder leg, and the control element is provided for controlling the fixing element to adjust the height of the ladder leg, and to simplify the manufacturing process of components, the installation and disassembly of the apparatus.Type: ApplicationFiled: August 27, 2012Publication date: February 27, 2014Inventor: WEN-HUA LU
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Publication number: 20110194286Abstract: A lamp device includes a lamp seat defining a first through hole, a lamp main body defining a second through hole, and a holding mechanism. The holding mechanism includes a bolt, a first nut, and a second nut. The bolt includes a head and a spindle connecting to the head. The spindle defines first screw threads at the opposite end from the head and second screw threads adjacent to the first screw threads. The threads per inch of the first screw threads are smaller than that of the second screw threads. The spindle passes though the first through hole and the second through hole to connect with the lamp main body and the lamp seat. The first nut and the second nut are respectively fit over the first screw threads and the second screw threads.Type: ApplicationFiled: July 2, 2010Publication date: August 11, 2011Applicants: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO. LTD.Inventors: GANG CHENG, RUI LIU, MENG-HUA HE, TE-SHENG JAN, YU-TAO CHEN, CHUN-CHE YEN, WEN-HSIANG LU, TING DONG
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Patent number: 6781833Abstract: A heat dissipation connector capable of dissipating heat from electric appliances in relative close proximity, such as a personal computer and possesses one or more USB ports for connecting to other electrical appliances. Specifically, the present invention is provided with at least two USB ports. One USB port is capable of receiving electrical power supplied from a USB port of a connected electric appliance such as a personal computer for driving built-in fans of the present invention.Type: GrantFiled: April 26, 2002Date of Patent: August 24, 2004Inventor: Wen-Hua Lu
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Publication number: 20030174467Abstract: A heat dissipation connector of the invention is not only an externally auxiliary heat dissipation device used beside relative electric appliance such as PC or the like to do heat dissipated away from relative electric appliance, but also an externally auxiliary connector to provide one or more USB ports to be used for other electric appliance.Type: ApplicationFiled: April 26, 2002Publication date: September 18, 2003Inventor: Wen-Hua Lu
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Publication number: 20020079700Abstract: A fast rotation joint is disclosed. The fast rotation joint is engaged between a machine body and a joint of the transferring flexible tube. The fast rotation joint includes mainly a first main body, a second main body, and a third main body. A drain-preventing pad is illustrated between the first main body and the second main body. The drain-preventing pad is used to prevent air from drainage so that the pressure will be insufficient. A plurality of rollers are mounted between the second main body and the - :third main body for preventing the deformation from the engagement of the machine body with the transferring flexible tube so as to increase the lifetime of the transferring flexible tube and the joint.Type: ApplicationFiled: December 21, 2000Publication date: June 27, 2002Inventors: Wen Hua Lu, Tzu-Chuan Tien
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Patent number: 6409227Abstract: A fast rotation joint is disclosed. The fast rotation joint is engaged between a machine body and a joint of the transferring flexible tube. The fast rotation joint includes mainly a first main body, a second main body, and a third main body. A drain-preventing pad is illustrated between the first main body and the second main body. The drain-preventing pad is used to prevent air from drainage so that the pressure will be insufficient. A plurality of rollers are mounted between the second main body and the third main body for preventing the deformation from the engagement of the machine body with the transferring flexible tube so as to increase the lifetime of the transferring flexible tube and the joint.Type: GrantFiled: December 21, 2000Date of Patent: June 25, 2002Inventors: Wen Hua Lu, Tzu-Chuan Tien
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Patent number: D347069Type: GrantFiled: May 19, 1992Date of Patent: May 17, 1994Inventor: Wen-Hua Lu