Abstract: A method for manufacturing the light emitting diode utilizing the transparent substrate and the metal bonding technology is provided. The method includes steps of providing a growing substrate, forming a semiconductor structure on the growing substrate, forming a metal bonding layer on the semiconductor structure, bonding a transparent substrate to the semiconductor structure via the metal bonding layer, removing the growing substrate, and forming a first electrode and a second electrode on the semiconductor structure and the transparent substrate respectively.

Abstract: A blue LED epitaxial wafer grown on an Al2O3 substrate, the blue LED epitaxial wafer having a contact electrode on the bottom side after removal of the Al2O3 substrate, conducting terminals formed on the top side, and a substitute substrate selected from chrome, tungsten, molybdenum, copper, copper chrome alloy, copper molybdenum alloy, copper tungsten alloy, molybdenum tungsten alloy, or their combination alloy and bonded to the top side and connected to the conducting terminals.

Abstract: A method for manufacturing the light emitting diode utilizing the transparent substrate and the metal bonding technology is provided. The method includes steps of providing a growing substrate, forming a semiconductor structure on the growing substrate, forming a metal bonding layer on the semiconductor structure, bonding a transparent substrate to the semiconductor structure via the metal bonding layer, removing the growing substrate, and forming a first electrode and a second electrode on the semiconductor structure and the transparent substrate respectively.

Abstract: A method for fabricating a light emitting diode with transparent substrate. The method comprises forming a first type cladding layer on a substrate, forming an active layer on the first type cladding layer, forming a second type cladding layer on the active layer, forming a second type transparent semiconductor layer on the second type cladding layer to serve as the transparent substrate, removing the substrate, and forming a first type contact layer on the surface of the first type cladding layer previously connected to the substrate. The transparent substrate does not absorb the emitted light, thereby the light emitting efficiency is increased by as much as double, and thus the performance of opto-electronic devices is improved.

Abstract: A chair includes a bottom board having a channel for receiving an extension of an arm of a seat back, a mounting plate secured to the bottom board and engaged on the extension of the arm, and a supporting base device secured to the mounting plate and the bottom board. The mounting plate includes one or more cusps engaged with the bottom board for forming a gap between the mounting plate and the bottom board and for allowing the base device to be solidly secured to the mounting plate. The bottom board includes a reinforcing bulge for reinforcing the bottom board of the chair.

Abstract: A chair includes a bottom board having a channel for receiving an extension of an arm of a seat back, a mounting plate secured to the bottom board and engaged on the extension of the arm, and a supporting base device secured to the mounting plate and the bottom board. The mounting plate includes one or more cusps engaged with the bottom board for forming a gap between the mounting plate and the bottom board and for allowing the base device to be solidly secured to the mounting plate. The bottom board includes a reinforcing bulge for reinforcing the bottom board of the chair.