Patents by Inventor Wen Huang Wang

Wen Huang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package structure and method for fabricating the same
    Patent number: 8154044
    Abstract: A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first material body comprises a tip, an inner surface and an outer surface. A second material body is formed on the lead frame to completely cover the outer surface of the first material body. Particularly, the first material body comprises hydrophilic polymer and the second material body comprises hydrophobic polymer.
    Type: Grant
    Filed: January 15, 2010
    Date of Patent: April 10, 2012
    Assignee: Everlight Electronics Co., Ltd.
    Inventor: Wen Huang Wang
  • LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20100176417
    Abstract: A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first material body comprises a tip, an inner surface and an outer surface. A second material body is formed on the lead frame to completely cover the outer surface of the first material body. Particularly, the first material body comprises hydrophilic polymer and the second material body comprises hydrophobic polymer.
    Type: Application
    Filed: January 15, 2010
    Publication date: July 15, 2010
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventor: Wen Huang Wang