Patents by Inventor Wen Huang

Wen Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180098088
    Abstract: A method and apparatus for deriving a motion vector predictor (MVP) candidate set for a block are disclosed. Embodiments according to the present invention generate a complete full MVP candidate set based on the redundancy-removed MVP candidate set if one or more redundant MVP candidates exist. In one embodiment, the method generates the complete full MVP candidate set by adding replacement MVP candidates to the redundancy-removed MVP candidate set and a value corresponding to a non-redundant MVP is assigned to each replacement MVP candidate. In another embodiment, the method generates the complete full MVP candidate set by adding replacement MVP candidates to the redundancy-removed MVP candidate set and a value is assigned to each replacement MVP candidate according to a rule. The procedure of assigning value, checking redundancy, removing redundant MVP candidate are repeated until the MVP candidate set is complete and full.
    Type: Application
    Filed: December 6, 2017
    Publication date: April 5, 2018
    Inventors: Tzu-Der Chuang, Jian-Liang Lin, Yu-Wen Huang, Shaw-Min Lei
  • Publication number: 20180091829
    Abstract: A method of palette index map coding of blocks in a picture by grouping coded symbols of the same type is disclosed for video encoder and decoder. In one embodiment, all syntax elements corresponding to the pixel index are grouped into a pixel index group, and all syntax elements corresponding to the escape pixel are grouped into an escape pixel group. All syntax elements corresponding to the run type and run length are grouped into an interleaved run type/run length group, or grouped into separate run type group and run length group. In another embodiment, the system parses from the video bitstream a last-run mode syntax element for a current block, where the last-run mode syntax element indicates whether a last run mode is a copy-index mode or a copy-above mode. Information associated with the last-run mode syntax element is used for reconstructing palette index map.
    Type: Application
    Filed: February 3, 2016
    Publication date: March 29, 2018
    Inventors: Shan LIU, Xiaozhong XU, Tzu-Der CHUANG, Yu-Chen SUN, Wang-Lin LAI, Yu-Wen HUANG, Jing YE
  • Patent number: 9922800
    Abstract: Embodiments of a method for generating ions in an ion source are provided. The method for generating ions in an ion source includes introducing a dopant gas and a diluent gas into an ion source arc chamber. The method for generating ions in an ion source further includes generating plasma in the ion source arc chamber based on the dopant gas and the diluent gas. In addition, the dopant gas includes carbon monoxide, and the diluent gas includes xenon and hydrogen.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: March 20, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Ming-Hui Li, Stanley Chang, Po-Yi Tseng, Chia-Cheng Liu, Chang-Chun Wu, Shen-Han Lin, Chih-Wen Huang, Ming-Hsien Wu
  • Patent number: 9924181
    Abstract: A method and apparatus for inter-layer prediction for scalable video coding are disclosed. Embodiments of the present invention utilize weighted prediction for scalable coding. The weighted prediction is based on the predicted texture data and the inter-layer Intra prediction data derived from BL reconstructed data. The inter-layer Intra prediction data corresponds to the BL reconstructed data or up-sampled BL reconstructed data. The predicted texture data corresponds to spatial Intra prediction data or motion-compensated prediction data based on the second EL video data in the same layer as the current EL picture. Embodiments of the present invention also utilize the reference picture list including an inter-layer reference picture (ILRP) corresponding to BL reconstructed texture frame or up-sampled BL reconstructed texture frame for Inter prediction of EL video data. The motion vector is limited to a range around (0,0) when the ILRP is selected as a reference picture.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: March 20, 2018
    Assignee: HFI INNOVATION INC.
    Inventors: Tzu-Der Chuang, Yu-Wen Huang, Ching-Yeh Chen, Chia-Yang Tsai, Chih-Ming Fu, Shih-Ta Hsiang
  • Patent number: 9918696
    Abstract: Existing gas pocket detection approaches are based on visual observations of B-mode ultrasound images showing comparisons between normal soft tissue and gas pockets, which are time-consuming and dependent on operator experience. The present invention proposes an ultrasound system and a method of detecting a gas pocket. The ultrasound system comprises: an ultrasound probe (110) for transmitting an ultrasound signal toward the ROI and acquiring an ultrasound echo signal reflected from the ROI along a plurality of scanning lines; an obtaining unit (130) for obtaining a second harmonic component of the ultrasound echo signal for each depth of a plurality of depths along each scanning line of the plurality of scanning lines; and a deriving unit (140) for deriving a change in a center frequency of the second harmonic component along with the depth.
    Type: Grant
    Filed: January 13, 2015
    Date of Patent: March 20, 2018
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Jingping Xu, Balasundar Iyyavu Raju, Sheng-Wen Huang, Shougang Wang, Emil George Radulescu, Shiwei Zhou
  • Publication number: 20180076054
    Abstract: An anti-plasma adhesive tape utilized for manufacturing a semiconductor package includes a substrate; and an adhesive layer formed on the substrate, wherein the adhesive layer is selected from a group composed of acrylic adhesive, light-curable resin and photoinitiator. The anti-plasma adhesive tape is attached to a backside of a lead frame of the semiconductor package before a plasma-cleaning process and removed from the lead frame after a molding process. After the anti-plasma adhesive tape is cured by irradiating an energy ray and removed from the lead frame, there is no residual adhesive left on a molding compound of the semiconductor package.
    Type: Application
    Filed: September 12, 2016
    Publication date: March 15, 2018
    Inventors: Chih-Hsiang Kuo, Chih-Wen Huang
  • Publication number: 20180071546
    Abstract: Described herein are magnetic neural stimulation systems for the treatment of neurological disorders. One variation of a magnetic neural stimulation system includes magnetic stimulators shaped as helical or ramped coils, where each turn of the coil has an acute turning angle of less than 90 degrees. Also described herein are magnetic neural stimulation systems that include an array of stimulators and one or more shielding components. The shielding components modulate the density profile of the induced eddy currents to increase stimulation to targeted neural tissue regions while decreasing stimulation to non-targeted neural regions. Other variations of magnetic stimulation systems include one or more stimulators and a shield in which some of the induced eddy currents in the shield may act to attenuate the magnetic field in certain regions of the shield.
    Type: Application
    Filed: September 26, 2017
    Publication date: March 15, 2018
    Inventors: Hong-Tsz PAN, Zhaoyin WU, Hsiu-Wen HUANG
  • Publication number: 20180075956
    Abstract: An array of rolled-up power inductors for on-chip applications comprises at least two rolled-up power inductors connected in series and formed from a stack of multilayer sheets. The array includes a first rolled-up power inductor comprising a first multilayer sheet in a rolled configuration about a first longitudinal axis and second rolled-up power inductor comprising a second multilayer sheet in a rolled configuration about a second longitudinal axis. The first and second rolled-up power inductors are laterally spaced apart. The first multilayer sheet comprises a first patterned conductive layer on a first strain-relieved layer, and the second multilayer sheet comprises a second patterned conductive layer on a second strain-relieved layer. Prior to roll-up of the second and first multilayer sheets, the second multilayer sheet is disposed on the first multilayer sheet, and a through-thickness first via connects the second patterned conductive layer with the first patterned conductive layer.
    Type: Application
    Filed: September 14, 2017
    Publication date: March 15, 2018
    Inventors: Xiuling Li, Wen Huang
  • Patent number: 9918068
    Abstract: A method and apparatus for texture image compression in a 3D video coding system are disclosed. Embodiments according to the present invention derive depth information related to a depth map associated with a texture image and then process the texture image based on the depth information derived. The invention can be applied to the encoder side as well as the decoder side. The encoding order or decoding order for the depth maps and the texture images can be based on block-wise interleaving or picture-wise interleaving. One aspect of the present invent is related to partitioning of the texture image based on depth information of the depth map. Another aspect of the present invention is related to motion vector or motion vector predictor processing based on the depth information.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: March 13, 2018
    Assignee: MEDIA TEK INC.
    Inventors: Yu-Lin Chang, Shih-Ta Hsiang, Chi-Ling Wu, Chih-Ming Fu, Chia-Ping Chen, Yu-Pao Tsai, Yu-Wen Huang, Shaw-Min Lei
  • Publication number: 20180070077
    Abstract: A method of inter-layer or inter-view prediction for an inter-layer or inter-view video coding system is disclosed. The method includes receiving a to-be-processed block in the EL or the EV, determining a collocated block in the BL (Base layer) or the BV (Base View), wherein the collocated block is located at a location in the BL or the BV corresponding to the to-be-processed block in the EL (Enhancement Layer)or in the EV (Enhancement view), deriving a predictor for the to-be-processed block in the EL or the EV from the collocated block in the BL or the BV based on pixel data of the BL or the BV, wherein the predictor corresponds to a linear function of pixel data in the collocated block, and encoding or decoding the to-be-processed block in the EL or the EV using the predictor.
    Type: Application
    Filed: October 27, 2017
    Publication date: March 8, 2018
    Inventors: Chia-Yang TSAI, Tzu-Der CHUANG, Ching-Yeh CHEN, Yu-Wen HUANG
  • Publication number: 20180063966
    Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
    Type: Application
    Filed: May 30, 2017
    Publication date: March 1, 2018
    Inventors: Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang
  • Patent number: 9904326
    Abstract: A waterproof housing including a frame structure and a waterproof structure is provided. The frame structure includes an opening. The waterproof structure is fixed on the frame structure and covers whole of the external surface and the opening of the frame structure. The waterproof structure includes a plurality of ribs extending toward the opening correspondingly and located in the opening. An electronic device is further provided including the waterproof housing and a keyboard module. The keyboard module includes a plurality of keys. The keyboard module is disposed under the waterproof housing and passes into the opening from an underside of the frame structure. The waterproof structure covers the keyboard module disposed in the opening and is fixed between the keys via the ribs. Therefore, the electronic device and the waterproof housing thereof have an improved water-proof function and are convenient in use.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: February 27, 2018
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Tsui-Wei Lin, Tang-Lung Lo, Ping-Yu Chen, Yen-Chih Chen, Po-Wen Huang, Chiu-Lang Huang, Ming-Chih Huang
  • Patent number: 9907186
    Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: February 27, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chen-Wen Huang, Hsin-Lung Chung, Wen-Jung Tsai, Jia-Huei Hung, Fu-Tang Huang
  • Patent number: 9905023
    Abstract: A depth image processing method and a depth image processing system are provided. The depth image processing method includes: capturing a first image and a second image; performing a feature comparison to acquire a plurality of feature pairs between the first image and the second image, wherein each of the feature pairs includes a feature in the first image and a corresponding feature in the second image; computing disparities of the feature pairs; computing a depth image through the first image and the second image when the disparities of the feature pairs are all smaller than a disparity threshold.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 27, 2018
    Assignee: Wistron Corporation
    Inventors: Sheng-Shien Hsieh, Kai-Chung Cheng, Yu-Wen Huang, Tzu-Yao Lin, Pin-Hong Liou
  • Patent number: 9899436
    Abstract: An image sensor includes a semiconductor substrate with at least one recess disposed on its surface and in the photosensitive area defined on the surface of the semiconductor substrate, a first-conductivity-type doped region disposed in the semiconductor substrate and in the photosensitive area, and a second-conductivity-type doped region disposed on the surface of the first-conductivity-type doped region and on the surface of the recess. A photosensitive device of the image sensor is formed of the first-conductivity-type doped region and the second-conductivity-type doped region.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: February 20, 2018
    Assignee: Powerchip Technology Corporation
    Inventors: Shih-Ping Lee, Yu-An Chen, Hsiu-Wen Huang, Chuan-Hua Chang
  • Publication number: 20180048119
    Abstract: A light-emitting device is provided. The light-emitting device comprises: an epitaxial structure comprising a first DBR stack, a light-emitting stack and a second DBR stack and a contact layer in sequence; an electrode on the epitaxial structure; a current blocking layer between the contact layer and the electrode; a first opening formed in the current blocking layer; and a second opening formed in the electrode and within the first opening; wherein a part of the electrode fills in the first opening and contacts the contact layer.
    Type: Application
    Filed: October 26, 2017
    Publication date: February 15, 2018
    Inventors: Tzu-Chieh HSU, Yi-Wen HUANG, Yi-Hung LIN, Chih-Chiang LU
  • Publication number: 20180040651
    Abstract: An image sensor includes a semiconductor substrate with at least one recess disposed on its surface and in the photosensitive area defined on the surface of the semiconductor substrate, a first-conductivity-type doped region disposed in the semiconductor substrate and in the photosensitive area, and a second-conductivity-type doped region disposed on the surface of the first-conductivity-type doped region and on the surface of the recess. A photosensitive device of the image sensor is formed of the first-conductivity-type doped region and the second-conductivity-type doped region.
    Type: Application
    Filed: October 26, 2016
    Publication date: February 8, 2018
    Inventors: Shih-Ping Lee, Yu-An Chen, Hsiu-Wen Huang, Chuan-Hua Chang
  • Publication number: 20180041769
    Abstract: The techniques described herein relate to methods, apparatus, and computer readable media configured to receive compressed video data, wherein the compressed video data is related to a set of frames. A decoder-side predictor refinement technique is used to calculate a new motion vector for a current frame from the set of frames, wherein the new motion vector estimates motion for the current frame based on one or more reference frames. An existing motion vector associated with a different frame from a motion vector buffer is retrieved. The new motion vector is calculated based on the existing motion vector using a decoder-side motion vector prediction technique, such that the existing motion vector is in the motion vector buffer after calculating the new motion vector.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 8, 2018
    Applicant: MediaTek Inc.
    Inventors: Tzu-Der Chuang, Ching-Yeh Chen, Chih-Wei Hsu, Yu-Wen Huang
  • Patent number: 9881918
    Abstract: A method includes etching a semiconductor substrate to form trenches, with a portion of the semiconductor substrate between the trenches being a semiconductor strip, and depositing a dielectric dose film on sidewalls of the semiconductor strip. The dielectric dose film is doped with a dopant of n-type or p-type. The remaining portions of the trenches are filled with a dielectric material. A planarization is performed on the dielectric material. Remaining portions of the dielectric dose film and the dielectric material form Shallow Trench Isolation (STI) regions. A thermal treatment is performed to diffuse the dopant in the dielectric dose film into the semiconductor strip.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 30, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Wen Huang, Chia-Hui Lin, Shin-Yeu Tsai, Kai Hung Cheng
  • Patent number: 9877019
    Abstract: Implementations of the invention are provided in methods for filter-unit based in-loop filtering in a video decoder and encoder. In one implementation, filter parameters are selected from a filter parameter set for each filter based on a filter index. In another implementation, the picture is partitioned into filter units according to filter unit size, which can be selected between a default size and other size. When other size is selected, the filter unit size may be conveyed using direct size information or ratio information. In another implementation, a merge flag and a merge index are used to convey filter unit merge information. A method for filter-unit based in-loop filtering in a video encoder for color video is disclosed. In one embodiment, the method incorporates filter syntax in the video bitstream by interleaving the color-component filter syntax for the FUs.
    Type: Grant
    Filed: December 31, 2011
    Date of Patent: January 23, 2018
    Assignee: HFI INNOVATION INC.
    Inventors: Ching-Yeh Chen, Chih-Ming Fu, Chia-Yang Tsai, Yu-Wen Huang, Shaw-Min Lei