Abstract: A lens unit, a lens for a low-beam illumination module, a low-beam illumination module and a vehicle. The lens unit includes a rear surface and a front surface; the lens unit has a focal line, and the focal line is a straight line perpendicular to a light emitting direction of the lens unit; the rear surface and the front surface are adapted to project light rays passing through the focal line into parallel light rays, and the front surface is a free-form curved surface. The lens unit has the optical characteristics of a cylindrical lens, and is able to cause parallel incident light to be focused into a line instead of a focal point upon passing through the lens unit.

Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.

Abstract: A vehicle lighting apparatus comprising a headlight module comprising a light collecting part, a reflection part, a light outlet part, a first optical channel, and a second optical channel arranged in sequence along a light emitting direction, the first optical channel connecting the light collecting part and the reflection part, the second optical channel connecting the reflection part and the light output part, the connecting position of the lower surface of the second optical channel and the light output part provided with a low beam cut-off line structure for forming a low beam bright-dark cut-off line, the light collected by the light collecting part emitted toward the light outlet part after reflection by the reflection part. The present headlight module is miniaturised and has a high rate of light utilisation.

Abstract: A headlamp optical element with a III-region light shape forming structure that comprises a light collecting portion, a first light emitting portion, a reflecting portion, and optionally a second light emitting portion. The light collecting portion converges incident light and emits light via the first light emitting portion. Some light may be directly emitted to the second light emitting portion. The rest of the light may be reflected by the reflecting portion and emitted to the second light emitting portion. The reflecting portion is connected to the lower portion of the first light emitting portion, with a lower beam cut-off line structure at the other end thereof. The light emitting surface of the first light emitting portion comprises multiple step surfaces with segment differences or is a single curved surface.

Abstract: A vehicle light optical element assembly of a vehicle lamp, and a vehicle lighting device, a vehicle lamp and a vehicle comprising the vehicle light optical element assembly of the vehicle lamp. The vehicle light optical element assembly comprises a low-beam primary optical element, a high-beam primary optical element provided below the low-beam primary optical element, and a lens provided on the front end of the low-beam primary optical element and/or the high-beam primary optical element, wherein the low-beam primary optical element and/or the high-beam primary optical element are integrated with the lens, and the low-beam primary optical element and the high-beam primary optical element are suitable for light convergence and collimation to then pass through the lens to form a low-beam illumination light shape and a high-beam illumination light shape. The vehicle light optical element assembly has the advantages of a compact structure, small volume, and high assembly accuracy.

Abstract: An optical element, comprising a light guide body. The light guide body comprises a plurality of light-incident parts arranged along a length extension direction of the light guide body, a light guide part and a light-emitting part; each light-incident part is provided with at least one light-incident unit; the light guide part is configured to guide light received by each light-incident unit to be emitted toward the light-emitting part; the shape of a forward projection plane of the light-emitting part is of a strip shape. The optical element can reduce the occupied space and improve the space utilization rate, facilitates reducing positioning mounting errors, has an appearance with a narrow and elongated shape, and can be applied in vehicle lamp modules, vehicle lamps and vehicles.

Abstract: An automotive headlamp system and an automotive lamp. The automotive headlamp system comprises a light source, a primary optical element, an automotive signal lamp structure, and a secondary optical element arranged sequentially along the light emitting direction. The automotive signal lamp structure comprises a light-transmitting portion and a rotating shaft. The light-transmitting portion comprises at least one light-transmitting plate mounted on the rotating shaft which can be driven to rotate by the rotating shaft. By means of rotation, light from the light source exits from the primary optical element, then selectively passes through one of or none of the light-transmitting plates, and is then projected by means of the secondary optical element to achieve a corresponding signal lamp function. The light-transmitting plate mounted on the rotating shaft is used to replace an existing signal lamp, reducing the space occupied by the original signal lamp, decreasing the volume of a headlamp.

Abstract: A primary optical element, a primary optical assembly, an optical assembly, a vehicle lamp lighting device and a vehicle. The primary optical element comprises a primary optical element main body comprising a light guiding portion and a fusion light-emitting portion which are provided from rear to front, a front end surface of the fusion light-emitting portion is provided as a light-emitting surface, and the light guiding portion comprises a plurality of light guiding columns, the thickness of the fusion light-emitting portion in the up-down direction greater than the thickness of the light guiding portion in the up-down direction, and the fusion light-emitting portion able to fuse light transmitted by the plurality of light guiding columns to the fusion light-emitting portion, and then emit the light by means of the light-emitting surface. The primary optical assembly, the optical assembly, the vehicle lamp lighting device, and the vehicle comprise the optical assembly.

Abstract: A media access control (MAC) address sending method, apparatus, and system, and a related device are provided. The method is implemented by a first network device connected to a first virtual machine and a second virtual machine. The first network device obtains a MAC address of the first virtual machine; and when the first virtual machine and the second virtual machine have a same MAC address and are located in different virtual local area networks, sends a route to a second network device, where the route includes route information, and the route information includes the MAC address, first virtual local area network information of the first virtual machine, and second virtual local area network information of the second virtual machine. In this method, information about virtual machines having a same MAC address in different virtual local area networks is aggregated to one route.

Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.

Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.

Abstract: A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.

Abstract: Development environments are commonly used to facilitate the development of user interfaces (e.g. windows forms, web forms, etc.). Drawing objects are components that may be used within the development environment to provide visual enhancements to the user interface. An effective method for drawing one or more drawing objects is disclosed herein to draw the drawing objects as windowless shapes within a shape container. The shape container may be configured to participate in a windows message loop (e.g. event handling system), wherein the windowless shapes do not participate in the windows message loop (e.g. lack a windows handle). The shape container listens, for example, within the windows message loop for operations pertaining to windowless shapes, and executes the operations upon the windowless shapes. Computer resources may be efficiently allocated, for example to the graphical user interface during runtime, instead of the windowless shapes consuming resources to participate in the windows message loop.

Abstract: Form controls can be reused so that the control can be bound to large volumes of data without adverse performance issues because of a large number of controls. A maximum number of rows of data N that can appear in a form are calculated. A container in memory is created for N+2 rows. The additional two rows are used to store the row after the last displayed row and the row previous to the first displayed row. In response to a user scroll or tab operation, rows within the container are reused. Child controls are hosted by the control and are also reused when the data is scrolled out of view.