Abstract: A method and system for multi-participant based conceptual design information modeling. The method includes the following steps. Initial design information generated by a plurality of design participants involved in different design stages during conceptual design of a target product is acquired. The initial design information is screened to obtain target design information in a target carrier form according to a carrier form corresponding to the initial design information. Subject information is extracted from the target design information. Based on a plurality of visualized forms under a plurality of dimensions, a plurality of visualized views of the subject information are generated under the plurality of dimension. A visualized view corresponding to a display authority of a design participant is displayed on the graphical user interface. The design participant can modify the design information based on the visualized view to obtain a target design information model.

Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.

Abstract: A media access control (MAC) address sending method, apparatus, and system, and a related device are provided. The method is implemented by a first network device connected to a first virtual machine and a second virtual machine. The first network device obtains a MAC address of the first virtual machine; and when the first virtual machine and the second virtual machine have a same MAC address and are located in different virtual local area networks, sends a route to a second network device, where the route includes route information, and the route information includes the MAC address, first virtual local area network information of the first virtual machine, and second virtual local area network information of the second virtual machine. In this method, information about virtual machines having a same MAC address in different virtual local area networks is aggregated to one route.

Abstract: The disclosure discloses a network device, an apparatus, and a network system. The network device receives a reply packet sent by a DHCP service device, and determines a first next-hop address from a plurality of next-hop addresses corresponding to a destination IP address of the reply packet, where the first next-hop address is a first tunnel endpoint IP address of the relay device and is different from a tunnel endpoint IP address of another relay device in a target anycast group to which the relay device belongs, and a communication connection is established between each relay device in the target anycast group and the client. The network device may forward the reply packet to the relay device based on the first next-hop address.

Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A manufacturing method for Package in Package (PiP) electronic device based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating IC chip for wire bonding, adhesive material, metal wire, chip pad and a plurality of leads to form a multi-row QFN package as an inner package. Flip-chip bonding IC chip with solder bumps on the first metal material layer of leads. Encapsulating IC chip with solder bumps, the multi-row QFN package, adhesive material, and leads to form an array of PiP electronic devices. Sawing and separating the PiP electronic device array, forming PiP electronic device unit.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.

Abstract: A manufacturing method for Flip Chip on Chip (FCoC) package based on multi-row Quad Flat No-lead (QFN) package is provided wherein the lower surface of plate metallic base material are half-etched to form grooves. Insulation filling material is filled in the half-etched grooves. The upper surface of plate metallic base material is half-etched to form chip pad and multi-row of leads. Encapsulating first IC chip, second IC chip, solder bumps, underfill material, and metal wire to form an array of FCoC package based on the type of multi-row QFN package. Sawing and separating the FCoC package array, and forming FCoC package unit.

Abstract: Development environments are commonly used to facilitate the development of user interfaces (e.g. windows forms, web forms, etc.). Drawing objects are components that may be used within the development environment to provide visual enhancements to the user interface. An effective method for drawing one or more drawing objects is disclosed herein to draw the drawing objects as windowless shapes within a shape container. The shape container may be configured to participate in a windows message loop (e.g. event handling system), wherein the windowless shapes do not participate in the windows message loop (e.g. lack a windows handle). The shape container listens, for example, within the windows message loop for operations pertaining to windowless shapes, and executes the operations upon the windowless shapes. Computer resources may be efficiently allocated, for example to the graphical user interface during runtime, instead of the windowless shapes consuming resources to participate in the windows message loop.

Abstract: Form controls can be reused so that the control can be bound to large volumes of data without adverse performance issues because of a large number of controls. A maximum number of rows of data N that can appear in a form are calculated. A container in memory is created for N+2 rows. The additional two rows are used to store the row after the last displayed row and the row previous to the first displayed row. In response to a user scroll or tab operation, rows within the container are reused. Child controls are hosted by the control and are also reused when the data is scrolled out of view.

Abstract: Form controls can be reused so that the control can be bound to large volumes of data without adverse performance issues because of a large number of controls. A maximum number of rows of data N that can appear in a form are calculated. A container in memory is created for N+2 rows. The additional two rows are used to store the row after the last displayed row and the row previous to the first displayed row. In response to a user scroll or tab operation, rows within the container are reused. Child controls are hosted by the control and are also reused when the data is scrolled out of view.

Abstract: Development environments are commonly used to facilitate the development of user interfaces (e.g. windows forms, web forms, etc.). Drawing objects are components that may be used within the development environment to provide visual enhancements to the user interface. An effective method for drawing one or more drawing objects is disclosed herein to draw the drawing objects as windowless shapes within a shape container. The shape container may be configured to participate in a windows message loop (e.g. event handling system), wherein the windowless shapes do not participate in the windows message loop (e.g. lack a windows handle). The shape container listens, for example, within the windows message loop for operations pertaining to windowless shapes, and executes the operations upon the windowless shapes. Computer resources may be efficiently allocated, for example to the graphical user interface during runtime, instead of the windowless shapes consuming resources to participate in the windows message loop.