Patents by Inventor Wen-Hung LIN
Wen-Hung LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136472Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.Type: ApplicationFiled: December 29, 2023Publication date: April 25, 2024Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Tzu-Yao TSENG, Tsung-Hsun CHIANG, Bo-Jiun HU, Wen-Hung CHUANG, Yu-Ling LIN
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Publication number: 20240128233Abstract: A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed on the substrate, a sensor chip adhered to the fixing adhesive layer, an annular adhering layer disposed on the sensor chip, a light-permeable sheet adhered to the annular adhering layer, and a plurality of metal wires that are electrically coupled to the substrate and the sensor chip. The size of the light-permeable sheet is smaller than that of the sensor chip.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, WEN-FU YU, BAE-YINN HWANG, WEI-LI WANG, CHIEN-HUNG LIN
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Publication number: 20240128291Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer has two adhering surfaces having a same area and a middle cross section located at a middle position between the two adhering surfaces. An area of the middle cross section is 115% to 200% of an area of any one of the two adhering surfaces. The adhesive layer can provide for light to travel therethrough, and enables the light therein to change direction and to attenuate. The sensor chip, the adhesive layer, and the light-permeable layer are embedded in the encapsulant, and an outer surface of the light-permeable layer is at least partially exposed from the encapsulant.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: CHIA-SHUAI CHANG, CHIEN-HUNG LIN, WEI-LI WANG, WEN-FU YU, BAE-YINN HWANG
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Publication number: 20240128139Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate along a predetermined direction for being electrically coupled to each other, a light-permeable layer, an adhesive layer having a ring-shape and sandwiched between the sensor chip and the light-permeable layer, and an encapsulant formed on the substrate. The adhesive layer is formed with at least one type of a buffering cavity, wave-shaped slots, and rectangular slots, which penetrate therethrough along the predetermined direction. The buffering cavity can be located in the adhesive layer, and any one type of the wave-shaped slots and the rectangular slots can be respectively recessed in an inner side and an outer side of the adhesive layer. A minimum width of the adhesive layer is greater than or equal to 50% of a predetermined width between the inner side and the outer side.Type: ApplicationFiled: June 6, 2023Publication date: April 18, 2024Inventors: WEI-LI WANG, JYUN-HUEI JIANG, WEN-FU YU, BAE-YINN HWANG, CHIEN-HUNG LIN
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Patent number: 11957722Abstract: The present invention discloses an anti-aging composition, which includes: (a) isolated lactic acid bacterial strains or a fermented product thereof; and (b) an excipient, a diluent, or a carrier; wherein the isolated lactic acid bacterial strains include: Bifidobacterium bifidum VDD088 strains, Bifidobacterium breve Bv-889 strains, and Bifidobacterium longum BLI-02 strains. The present invention further provides a method for preventing aging by administering the foregoing anti-aging composition to a subject in need thereof.Type: GrantFiled: March 7, 2022Date of Patent: April 16, 2024Assignee: GLAC BIOTECH CO., LTDInventors: Hsieh-Hsun Ho, Yi-Wei Kuo, Wen-Yang Lin, Jia-Hung Lin, Yen-Yu Huang, Chi-Huei Lin, Shin-Yu Tsai
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Publication number: 20240120337Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.Type: ApplicationFiled: January 15, 2023Publication date: April 11, 2024Inventors: Ta-Chun LIN, Chih-Hung HSIEH, Chun-Sheng LIANG, Wen-Chiang HONG, Chun-Wing YEUNG, Kuo-Hua PAN, Chih-Hao CHANG, Jhon Jhy LIAW
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Publication number: 20240102561Abstract: A proportional valve includes a casing and a valve trim. The casing has at least one fluid inlet, a fluid outlet, at least one first connection passageway, at least one second connection passageway and an accommodating space. The first connection passageway is connected with the fluid inlet. The second connection passageway is connected with the fluid outlet. The valve trim is located in the accommodating space, including a flow splitter an adjusting rotor. The flow splitter has at least one third connection passageway and at least one fourth connection passageway. The third connection passageway is connected with the first connection passageway. The fourth connection passageway is connected with the second connection passageway. The adjusting rotor has a channel and at least one blocking portion. The adjusting rotor is rotatably disposed on the flow splitter so that the blocking portion blocks a part of the third connection passageway.Type: ApplicationFiled: November 3, 2022Publication date: March 28, 2024Applicant: COOLER MASTER CO., LTD.Inventors: Chiu Yu YEH, Wen-Hsien LIN, Wen-Hung CHEN
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Patent number: 11929767Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.Type: GrantFiled: August 16, 2022Date of Patent: March 12, 2024Assignee: MEDIATEK INC.Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
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Publication number: 20240076422Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.Type: ApplicationFiled: September 1, 2023Publication date: March 7, 2024Inventors: Jing-Cherng TSAI, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Jing-Yu LEE, Jun-Ye HONG, Zih-Yu SHIH, Cheng-Hung CHIANG, Gang-Wei SHEN, Yu-Chuan SUNG, Chung-Hua WENG, Hsing-Ya CHEN
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Publication number: 20240069618Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.Type: ApplicationFiled: April 27, 2023Publication date: February 29, 2024Inventors: Wen Che CHUNG, Hui Chuan LO, Hao-Hsuan LIN, Chun TSAO, Jun-Fu CHEN, Ming-Hung YAO, Jia-Wei ZHANG, Kuan-Lun CHEN, Ting-Chao LIN, Cheng-Yen LIN, Chunyen LAI
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Patent number: 11913047Abstract: A method for producing ?-aminobutyric acid includes cultivating, in a culture medium containing glutamic acid or a salt thereof, a probiotic composition including at least one lactic acid bacterial strain selected from the group consisting of Bifidobacterium breve CCFM1025 which is deposited at the Guangdong Microbial Culture Collection Center under an accession number GDMCC 60386, Lactobacillus acidophilus TYCA06, Lactobacillus plantarum LPL28, and Bifidobacterium longum subsp. infantis BLI-02 which are deposited at the China General Microbiological Culture Collection Center respectively under accession numbers CGMCC 15210, CGMCC 17954, and CGMCC 15212, Lactobacillus salivarius subsp. salicinius AP-32 which is deposited at the China Center for Type Culture Collection under an accession number CCTCC M 2011127, and combinations thereof.Type: GrantFiled: January 7, 2022Date of Patent: February 27, 2024Assignee: GLAC BIOTECH CO., LTD.Inventors: Hsieh-Hsun Ho, Ching-Wei Chen, Yu-Fen Huang, Chen-Hung Hsu, Wen-Yang Lin, Yi-Wei Kuo, Shin-Yu Tsai
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Patent number: 11911421Abstract: Disclosed herein is a probiotic composition that includes Lactobacillus salivarius subsp. salicinius AP-32, Lactobacillus johnsonii MH-68, and Bifidobacterium animalis subsp. lactis CP-9, which are deposited at the China Center for Type Culture Collection (CCTCC) respectively under accession numbers CCTCC M 2011127, CCTCC M 2011128, and CCTCC M 2014588. A number ratio of Lactobacillus salivarius subsp. salicinius AP-32, Lactobacillus johnsonii MH-68, and Bifidobacterium animalis subsp. lactis CP-9 ranges from 1:0.1:0.1 to 1:1:8. Also disclosed herein is use of the probiotic composition for alleviating type 1 diabetes mellitus (T1DM).Type: GrantFiled: November 18, 2021Date of Patent: February 27, 2024Assignee: GLAC BIOTECH CO., LTD.Inventors: Hsieh-Hsun Ho, Wen-Yang Lin, Yi-Wei Kuo, Yen-Yu Huang, Jia-Hung Lin
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Patent number: 11555880Abstract: An intelligent bed monitoring device and method are provided in this disclosure. The device is applied to a bed frame, and the bed frame includes a first bed board and a second bed board. The intelligent bed monitoring device includes a plurality of audio sensors, a processor and a controlling module. The processor is electrically connected to the audio sensors and the controlling module. The audio sensors are configured to detect a plurality of audio signals. The processor is configured to receive the audio signals, and calculate an audio source direction according to the audio signals. The controlling module is configured to control one of the first bed board and the second bed board according to the audio source direction to adjust one of the first bed board and the second bed board into a plurality of modes.Type: GrantFiled: June 16, 2020Date of Patent: January 17, 2023Assignees: AI. SLEEP CO., LTD.Inventor: Wen-Hung Lin
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Patent number: 11516564Abstract: A speaker includes a sound box, a speaker module, and a heat pipe. The sound box includes a first opening and a second opening. The speaker module is hermetically connected to the first opening. The heat pipe is hermetically connected to the second opening. The heat pipe includes a first end and a second end. The first end is located in the sound box. The second end is exposed to the second opening. The speaker module is fixedly connected to at least part of an outer wall of the heat pipe. In the speaker, a hollow heat pipe is fixedly connected to the speaker module, and vibration of the speaker module drives air in the heat pipe to flow to dissipate heat from the heat pipe. Further, the cold heat pipe carries heat away from the speaker module through heat transfer, thereby dissipating heat from the speaker.Type: GrantFiled: June 5, 2020Date of Patent: November 29, 2022Assignee: ASUSTEK COMPUTER INC.Inventor: Wen-Hung Lin
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Patent number: 11490738Abstract: An electrical bed is provided. The electrical bed includes a frame, a plurality of bed plates, a first connector and a first driving unit. The frame includes a plurality of bed stands, and the bed plates are arranged on the bed stands. The first connector includes a first rotating member, a first connecting arm, a first transmission bar and a second connecting arm. The first rotating member is pivotally connected with the first connecting arm, and the first connecting arm is sleeved with the first transmission bar and fixed relative to each other, and the second connecting arm is sleeved with the first transmission bar and fixed relative to each other. The first driving unit is arranged to drive the first transmission bar to rotate and adjust one of the bed plates.Type: GrantFiled: July 17, 2020Date of Patent: November 8, 2022Assignees: AI. SLEEP CO., LTD.Inventor: Wen-Hung Lin
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Publication number: 20210120963Abstract: An electrical bed is provided in this disclosure. The electrical bed includes a frame, a plurality of bed plates, a first connector and a first driving unit. The frame includes a plurality of bed stands, and the bed plates are arranged on the bed stands. The first connector includes a first rotating member, a first connecting arm, a first transmission bar and a second connecting arm. The first rotating member is pivotally connected with the first connecting arm, and the first connecting arm is sleeved with the first transmission bar and fixed relative to each other, and the second connecting arm is sleeved with the first transmission bar and fixed relative to each other. The first driving unit is arranged to drive the first transmission bar to rotate and adjust one of the bed plates.Type: ApplicationFiled: July 17, 2020Publication date: April 29, 2021Inventor: Wen-Hung LIN
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Publication number: 20210124008Abstract: An intelligent bed monitoring device and method are provided in this disclosure. The device is applied to a bed frame, and the bed frame includes a first bed board and a second bed board. The intelligent bed monitoring device includes a plurality of audio sensors, a processor and a controlling module. The processor is electrically connected to the audio sensors and the controlling module. The audio sensors are configured to detect a plurality of audio signals. The processor is configured to receive the audio signals, and calculate an audio source direction according to the audio signals. The controlling module is configured to control one of the first bed board and the second bed board according to the audio source direction to adjust one of the first bed board and the second bed board into a plurality of modes.Type: ApplicationFiled: June 16, 2020Publication date: April 29, 2021Inventor: Wen-Hung LIN
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Publication number: 20210120962Abstract: An intelligent bed monitoring system and device are provided in this disclosure. The system is applied to a bed frame, and the bed frame includes a bed board. The intelligent bed monitoring system includes a first server, an intelligent bed monitoring device and an electronic device. The intelligent bed monitoring device is communicated with the first server and the electronic device. The intelligent bed monitoring device further includes a pressure sensor, a processor, and a controlling module. The processor is electrically connected with the pressure sensor and the controlling module. The pressure sensor is configured to detect a vibration signal. The processor is configured to generate a physiological information according to the vibration signal, and transmit the physiological information to the first server via a communication interface. The controlling module is configured to control the bed board to adjust the bed board into a plurality of modes.Type: ApplicationFiled: July 2, 2020Publication date: April 29, 2021Inventor: Wen-Hung LIN
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Publication number: 20200404402Abstract: A speaker includes a sound box, a speaker module, and a heat pipe. The sound box includes a first opening and a second opening. The speaker module is hermetically connected to the first opening. The heat pipe is hermetically connected to the second opening. The heat pipe includes a first end and a second end. The first end is located in the sound box. The second end is exposed to the second opening. The speaker module is fixedly connected to at least part of an outer wall of the heat pipe. In the speaker, a hollow heat pipe is fixedly connected to the speaker module, and vibration of the speaker module drives air in the heat pipe to flow to dissipate heat from the heat pipe. Further, the cold heat pipe carries heat away from the speaker module through heat transfer, thereby dissipating heat from the speaker.Type: ApplicationFiled: June 5, 2020Publication date: December 24, 2020Inventor: Wen-Hung LIN
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Patent number: 9900717Abstract: A thermal protecting device of a speaker is provided. The thermal protecting device includes an amplifier and a temperature detecting unit. An input end of the amplifier receives an audio reference signal, an output end of the amplifier provides an audio output signal to the speaker. The temperature detecting unit receives an audio input signal to provide the audio reference signal, and detects an operation temperature of the speaker to determine an amplitude of the audio reference signal. The amplitude is inversely proportional to the operation temperature.Type: GrantFiled: October 28, 2016Date of Patent: February 20, 2018Assignee: ASUSTeK COMPUTER INC.Inventor: Wen-Hung Lin