Abstract: A tire pressure gauge includes a holder, an air intake seat, and a detection device coupled with the air intake seat. The holder and air intake seat have respectively a first positioning ring and a second positioning ring. A fastening and unfastening tool of the tire pressure gauge includes an outer barrel and an inner barrel held in the outer barrel. The outer barrel has a first anchor portion to latch the first positioning ring. The inner barrel has a second anchor portion to latch the second positioning ring. The outer barrel and inner barrel respectively drive the holder and air intake seat to be fastened to an air nozzle of a vehicle tire, and the holder and air intake seat are butted tightly to allow the tire pressure gauge to be securely installed on the air nozzle of any type of vehicles through the fastening and unfastening tool.

Abstract: The present invention includes a base, a rectification chip, a conductive element and a coupling collar. The base has an installation pedestal to hold the rectification chip. The conductive element has a root portion to hold the rectification chip. The coupling collar is located at one end of the base to hold a package. The coupling collar has a plurality of anchor portions in contact with the package. Each anchor portion has a convex portion and a concave portion extended to two ends of the coupling collar. The convex portion and concave portion of two neighboring anchor portions are formed in a staggered manner. The cross section area of the convex portion on the annular edge of the coupling collar is different from the cross section area of the inner wall of the coupling collar. Hence fabrication and assembly are easier. Turning and loosening of the package can be prevented.

Abstract: A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. The base deck and the bearing deck are interposed by an elevation difference section. On the elevation difference section, there is an annular retaining structure. The package member is located on the base and covers at least the bearing deck and the retaining structure. The package member has an anchor structure corresponding to the retaining structure. The retaining structure and the anchor structure are coupled together to harness the base and the package member from moving against each other. Thus the base and package member form a reinforced bonding between them without separating from each other when subject to external forces, therefore provide improved protection for the light emitting element.

Abstract: A tire pressure detector, which is installed on an air tap of a wheel to detect the tire pressure, comprises an air-intake device, a bidirectional sleeve and a cap. The air-intake device includes an air-intake seat. The air-intake seat has an air-intake member and an engagement member. The air-intake seat is installed on the air tap via the air-intake member. The bidirectional sleeve has a first connection member and a second connection member, which are respectively formed on two sides of a separating member. The first connection member engages with the engagement member of the air-intake seat to form an air chamber accommodating a detection device detecting the tire pressure. The cap has a connection wall, which cooperates with the second connection member to form an accommodation space receiving a power source powering the detection device.

Abstract: The present invention includes a base, a rectification chip, a conductive element and a coupling collar. The base has an installation pedestal to hold the rectification chip. The conductive element has a root portion to hold the rectification chip. The coupling collar is located at one end of the base to hold a package. The coupling collar has a plurality of anchor portions in contact with the package. Each anchor portion has a convex portion and a concave portion extended to two ends of the coupling collar. The convex portion and concave portion of two neighboring anchor portions are formed in a staggered manner. The cross section area of the convex portion on the annular edge of the coupling collar is different from the cross section area of the inner wall of the coupling collar. Hence fabrication and assembly are easier. Turning and loosening of the package can be prevented.

Abstract: A rectifying diode package structure includes a base which has a holding deck to hold a diode chip and a protective portion on the perimeter of the base to form sealing space filled by a filling material to seal the diode chip in an integrated manner. The diode chip has a conductive element extended outside the sealing space. The holding deck and the protective portion are interposed by a buffer ring embedded in the filling material. The buffer ring has at least one retaining ridge which has at least one first end and one second end of different cross sections formed in an upright manner to form a retaining relationship between the buffer ring and the filling material.

Abstract: A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. The base deck and the bearing deck are interposed by an elevation difference section. On the elevation difference section, there is an annular retaining structure. The package member is located on the base and covers at least the bearing deck and the retaining structure. The package member has an anchor structure corresponding to the retaining structure. The retaining structure and the anchor structure are coupled together to harness the base and the package member from moving against each other. Thus the base and package member form a reinforced bonding between them without separating from each other when subject to external forces, therefore provide improved protection for the light emitting element.

Abstract: The present invention includes a base, a rectification chip, a conductive element and a coupling collar. The base has an installation pedestal to hold the rectification chip surrounded by an insulation portion. The conductive element has a root portion to connect the rectification chip. The root portion is extended to form a buffer section. The coupling collar is located at one end of the base to hold the package. The installation pedestal and the inner rim of the base are interposed by a gap. At least one hook portion is formed between the installation pedestal and the bottom of the gap. Thus the base does not turn against the package. The coupling collar has two ends formed an area different from any cross section area of the inner wall thereof.

Abstract: A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent bending and deformation under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent the GPP from fracturing when the packaging material is heated and expanded or prevent the conductive element from bending and deforming under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can prevent the GPP from fracturing when the packaging material is heated and expanded and be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent bending and deformation under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a conductive element which has a buffer portion and a base seat to prevent the GPP from fracturing when the packaging material is heated and expanded or prevent the conductive element from bending and deforming under external forces, and has a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can prevent the GPP from fracturing when the packaging material is heated and expanded and be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: A rectification chip terminal structure for soldering a rectification chip encased in a glass passivated pallet (GPP) on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a helical buffer portion, a base having a boss, a spacer zone containing a space, a tapered section inclining towards the center of the terminal, and a bend spot having latch rings to provide coupling. The terminal thus structured can prevent bending and deformation under external forces, and form a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: A rectification chip terminal structure for soldering a rectification chip on a terminal filled with a packaging material to form a secured mounting for the rectification chip is to be inserted in a coupling bore of a circuit board. The structure includes a helical buffer portion, a spacer zone containing a space, a tapered section inclining towards the center of the terminal, a bend spot having latch rings to provide coupling, and a deck having a bulged ring. The structure can prevent bending and deformation under external forces, and form a stress buffer zone to prevent the chip from being damaged and moisture from entering. It can be installed easily in the coupling bore of the circuit board and hold the packaging material securely without breaking away.

Abstract: This invention discloses a rectification chip terminal structure that mounts a rectification chip into a terminal by means of soldering and rubber injection, and inserts the chip into the pivotal hole on the printed wire board. Such terminal comprises a rib ring surrounding the terminal, a platform extended from the middle section of said terminal, a buffer groove formed between said platform and said rib ring, and a protruded ring extended from the periphery of said platform; when rubber is injected into the terminal, the rubber will go through the buffer groove and the protruded ring for the fixing action, and no air bubble will remain after the solidification of the rubber. It will increase the adhesive force between the rubber and the terminal, and also will increase the soldering area of the rectification chip, such that the space between the terminal and the rectification chip can be fully soldered to provide the best effect for a current flow with larger power.

Abstract: This invention discloses a rectification chip terminal structure that mounts a rectification chip into a terminal by means of soldering and rubber injection, and inserts the chip into the pivotal hole on the printed wire board. Such terminal comprises a rib ring surrounding the terminal, a platform extended from the middle section of said terminal, a buffer groove formed between said platform and said rib ring, and a protruded ring extended from the periphery of said platform; when rubber is injected into the terminal, the rubber will go through the buffer groove and the protruded ring for the fixing action, and no air bubble will remain after the solidification of the rubber. It will increase the adhesive force between the rubber and the terminal, and also will increase the soldering area of the rectification chip, such that the space between the terminal and the rectification chip can be fully soldered to provide the best effect for a current flow with larger power.