Patents by Inventor Wen J. Liu

Wen J. Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230145787
    Abstract: A rubber compound for heavy-duty truck or bus tire treads may comprise: 5 to 100 parts by weight per hundred parts by weight rubber (phr) of a long chain branched cyclopentene ring opening rubber (LCB-CPR) having a glass transition temperature (Tg) of ?120° C. to ?80° C., a g?vis of 0.50 to 0.91, and a ratio of cis-to-trans of 40:60 to 5:95; 0 phr to 95 phr of a rubber selected from a group consisting of a natural rubber (NR), a polybutadiene rubber (BR), and a combination thereof; 30 phr to 90 phr of a reinforcing filler; and 0.5 phr to 20 phr of a process oil.
    Type: Application
    Filed: February 26, 2021
    Publication date: May 11, 2023
    Inventors: Alan A. Galuska, Alexander V. Zabula, Yong Yang, Carlos R. Lopez-Barron, Brian J. Rohde, Xiao-Dong Pan, Wen J. Liu
  • Patent number: D1018630
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: March 19, 2024
    Assignee: AMAZON TECHNOLOGIES, INC.
    Inventors: Wen-Yo Lu, Matthew J. England, Chia-Song Liu, James Siminoff