Patents by Inventor Wen-Je Jung

Wen-Je Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module with silicon dice oriented for improved reliability
    Patent number: 5736786
    Abstract: A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plurality of silicon dice are mounted to the first metallic layer of the substrate. The solder layer has a void development region which after a predetermined number of thermal cycles does not significantly increase. The silicon dice are oriented on the substrate layer so that the silicon dice are not aligned over the void development region corresponding to the useful life of the module. The metallic base plate may also be mounted to a heatsink through a thermal grease layer. The heatsink may comprise the outer covering of the power module.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: April 7, 1998
    Assignee: Ford Global Technologies, Inc.
    Inventors: Venkateswara A. Sankaran, Xingyi Xu, Yi-Hsin Pao, Wen-Je Jung