Abstract: The present invention provides an Intelligent Engineering Data Analysis (I-EDA) system and method to help prevent low wafer yield and prevent occurrences of abnormal events. The I-EDA has a non-conforming wafer tracing (NCWT) system that operates to correlate occurrences of abnormal events with low wafer yield. The method generally has the steps of performing a fabrication operation on wafers disposed within a wafer lot; determining if an abnormal event occurred while performing the fabrication operation on the wafers disposed within the wafer lot; using a NCWT to determine a statistical correlation between an occurrence of an abnormal event and a wafer yield of the wafers being processed during the occurrence of the abnormal event if the abnormal event occurred during processing of the wafers disposed within the wafer lot; and using the determined statistical correlation to analyze the fabrication process and thereby improve wafer yield.

Abstract: A manufacturing management system and method. The system includes a monitor module and a planning module. The monitor module receives real-time yield information of one product currently being processed in a production line. The planning module dynamically manages a manufacturing schedule of the product by holding lots corresponding to the product to avoid being processed if the yield information is greater than a target yield, and releasing additional lots corresponding to the product to be processed by the production line if the yield information is less than the target yield.

Abstract: The present invention provides an Intelligent Engineering Data Analysis (I-EDA) system and method to help prevent low wafer yield and prevent occurrences of abnormal events. The I-EDA has a non-conforming wafer tracing (NCWT) system that operates to correlate occurrences of abnormal events with low wafer yield. The method generally has the steps of performing a fabrication operation on wafers disposed within a wafer lot; determining if an abnormal event occurred while performing the fabrication operation on the wafers disposed within the wafer lot; using a NCWT to determine a statistical correlation between an occurrence of an abnormal event and a wafer yield of the wafers being processed during the occurrence of the abnormal event if the abnormal event occurred during processing of the wafers disposed within the wafer lot; and using the determined statistical correlation to analyze the fabrication process and thereby improve wafer yield.

Abstract: A manufacturing management system and method. The system includes a monitor module and a planning module. The monitor module receives real-time yield information of one product currently being processed in a production line. The planning module dynamically manages a manufacturing schedule of the product by holding lots corresponding to the product to avoid being processed if the yield information is greater than a target yield, and releasing additional lots corresponding to the product to be processed by the production line if the yield information is less than the target yield.