Patents by Inventor Wen-Jen LAI

Wen-Jen LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR SOLDERING ELECTRONIC COMPONENTS TO A CIRCUIT BOARD BY MEANS OF HIGH-FREQUENCY SOLDERING
    Publication number: 20120187111
    Abstract: A method for soldering electronic components to a circuit board by: applying a solder paste to solder contacts of a circuit board and then arranging electronic components on the circuit board to keep the pins of the electronic components in contact with the solder contacts and then a high frequency to melt the solder paste and to let the pins of the electronic components be electrically connected to the solder contacts of the circuit board electrically by the solder paste.
    Type: Application
    Filed: March 17, 2011
    Publication date: July 26, 2012
    Inventors: Lien-Hsing Chen, Wen-Jen Lai
  • POLYLACTIDE-COATED PAPERBOARD
    Publication number: 20100209636
    Abstract: A polylactide-coated paperboard is provided. The polylactide-coated paperboard includes a paperboard and at least one polylactide layer on the paperboard. The polylactide layer is made from a compound that contains 97-100 wt % polylactic acid.
    Type: Application
    Filed: September 4, 2009
    Publication date: August 19, 2010
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Wen-Jen LAI, Chih-Hsien HUANG